SNVSC74 September   2023 LP5813

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  9. 8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Synchronous Boost Converter
        1. 9.3.1.1 Undervoltage Lockout
        2. 9.3.1.2 Enable and Soft Start
        3. 9.3.1.3 Switching Frequency
        4. 9.3.1.4 Current Limit Operation
        5. 9.3.1.5 Boost PWM Mode
        6. 9.3.1.6 Boost PFM Mode
        7. 9.3.1.7 Pass-Through Mode
      2. 9.3.2 Time-cross-multiplexing (TCM) scheme
        1. 9.3.2.1 Direct drive mode
        2. 9.3.2.2 TCM drive mode
        3. 9.3.2.3 Mix drive mode
        4. 9.3.2.4 Ghosting elimination
      3. 9.3.3 Analog Dimming
      4. 9.3.4 PWM Dimming
      5. 9.3.5 Autonomous Animation Engine Control
        1. 9.3.5.1 Animation Engine Pattern
        2. 9.3.5.2 Sloper
        3. 9.3.5.3 Animation Engine Unit (AEU)
        4. 9.3.5.4 Animation Pause Unit (APU)
      6. 9.3.6 Protections and Diagnostics
        1. 9.3.6.1 Overvoltage Protection
        2. 9.3.6.2 Output Short-to-Ground Protection
        3. 9.3.6.3 LED Open Detections
        4. 9.3.6.4 LED Short Detections
        5. 9.3.6.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
    6. 9.6 Register Map Table
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Application
      2. 10.2.2 Design Parameters
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Inductor Selection
        2. 10.2.3.2 Output Capacitor Selection
        3. 10.2.3.3 Input Capacitor Selection
        4. 10.2.3.4 Program Procedure
        5. 10.2.3.5 Programming Example
      4. 10.2.4 Application Performance Plots
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) LP5813 UNIT
YBH (DSBGA)
12 PINS
RθJA Junction-to-ambient thermal resistance 92.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.4 °C/W
RθJB Junction-to-board thermal resistance 25.9 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
ΨJB Junction-to-board characterization parameter 25.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.