SBOS567A June   2011  – February 2024 OPA564-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
        1. 7.3.1.1 Setting the Current Limit
      2. 7.3.2 Enable and Shutdown (E/S) Pin
      3. 7.3.3 Input Protection
      4. 7.3.4 Output Shutdown
      5. 7.3.5 Microcontroller Compatibility
      6. 7.3.6 Current Limit Flag
      7. 7.3.7 Thermal Protection
      8. 7.3.8 Junction Temperature Measurement Using TSENSE
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Configuration
      2. 8.1.2 Output-Stage Compensation
      3. 8.1.3 Output Protection
      4. 8.1.4 Power Dissipation and Safe Operating Area
    2. 8.2 Typical Applications
      1. 8.2.1 Improved Howland Current Pump
      2. 8.2.2 Programmable Power Supply
      3. 8.2.3 Powerline Communication
      4. 8.2.4 Motor-Drive Circuit
      5. 8.2.5 DC Motor-Speed Controller (Without Tachometer)
      6. 8.2.6 Generating VDIG
      7. 8.2.7 Temperature Measurement
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermally Enhanced PowerPAD™ Integrated Circuit Package
          1. 8.4.1.1.1 Bottom-Side Thermal Pad Assembly Process
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Protection

The OPA564-Q1 has thermal sensing circuitry that helps protect the amplifier from exceeding temperature limits. Power dissipated in the OPA564-Q1 causes the junction temperature to rise. Internal thermal shutdown circuitry disables the output when the die temperature reaches the thermal shutdown temperature limit. The OPA564-Q1 output remains shut down until the die has cooled sufficiently; see the Electrical Characteristics, Thermal Shutdown section. When the OPA564-Q1 is in thermal shutdown, the device asserts the TFLAG pin high. The TFLAG pin returns low when the device returns to normal operation. Read the TFLAG pin with a high-impedance digital I/O pin, or buffer the TFLAG pin.

Depending on load and signal conditions, the thermal protection circuit can cycle on and off. This cycling limits the amplifier dissipation, but can have undesirable effects on the load. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink. For reliable, long-term, continuous operation, with IOUT at the maximum output of 1.5A, limit the junction temperature to 85°C maximum. Figure 7-8 shows the maximum output current versus junction temperature for dc and RMS signal outputs. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection triggers. Use worst-case loading and signal conditions. For good, long-term reliability, thermal protection triggers when the maximum expected ambient condition of the application is exceeded by 35°C.

GUID-02A1C5AD-2C0E-4DC4-A1EB-1D1D32CED395-low.svg Figure 7-8 Maximum Output Current vs Junction Temperature

The internal protection circuitry of the OPA564-Q1 is designed to protect against overload conditions; this circuitry was not intended to replace a proper heat sink. Continuously running the OPA564-Q1 into thermal shutdown degrades reliability.