SBOS567A June   2011  – February 2024 OPA564-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
        1. 7.3.1.1 Setting the Current Limit
      2. 7.3.2 Enable and Shutdown (E/S) Pin
      3. 7.3.3 Input Protection
      4. 7.3.4 Output Shutdown
      5. 7.3.5 Microcontroller Compatibility
      6. 7.3.6 Current Limit Flag
      7. 7.3.7 Thermal Protection
      8. 7.3.8 Junction Temperature Measurement Using TSENSE
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Configuration
      2. 8.1.2 Output-Stage Compensation
      3. 8.1.3 Output Protection
      4. 8.1.4 Power Dissipation and Safe Operating Area
    2. 8.2 Typical Applications
      1. 8.2.1 Improved Howland Current Pump
      2. 8.2.2 Programmable Power Supply
      3. 8.2.3 Powerline Communication
      4. 8.2.4 Motor-Drive Circuit
      5. 8.2.5 DC Motor-Speed Controller (Without Tachometer)
      6. 8.2.6 Generating VDIG
      7. 8.2.7 Temperature Measurement
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermally Enhanced PowerPAD™ Integrated Circuit Package
          1. 8.4.1.1.1 Bottom-Side Thermal Pad Assembly Process
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision * (June 2011) to Revision A (February 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Package Information table, and Pin Configuration and Functions, Specifications, ESD Ratings, Recommended Operating Conditions, Thermal Information, Detailed Description, Overview, Functional Block Diagram, Feature Description, Device Functional Modes, Application and Implementation, Typical Applications, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted preview DWD package and associated contentGo
  • Changed instances of HSOP to HSOIC (typo)Go
  • Changed 20kΩ resistor label from R4 to R3 (typo) in front-page diagramGo
  • Updated Related Products table and renamed to Device Comparison Table Go
  • Changed Operating Junction Temperature to Operating Ambient Temperature and moved to new Recommended Operating Conditions Go
  • Updated format of Electrical Characteristics Go
  • Changed Output current limit range typical value from "±0.4 to ±2.0" to "±0.4 to ±1.9"Go
  • Changed current limit flag output typical value for normal operation from 0 to V–Go
  • Changed Thermal Shutdown typical value for normal operation from 0 to V–Go
  • Changed current limit value range from "0.4A to 1.5A" to "0.4A to 1.6A" in Adjustable Current Limit Go
  • Added text regarding adjustable current limit used to protect the device in Adjustable Current Limit Go
  • Updated equation terms for consistencyGo
  • Changed RCL to RSET in Figure 7-1, Adjustable Current Limit Go
  • Added text regarding IFLAG pin to last sentence of Current Limit Flag Go
  • Added text regarding TFLAG pin to first paragraph of Thermal Protection Go
  • Added R1 and R2 resistor labels to Figure 8-1, Basic Noninverting Amplifier Go
  • Changed copper plane size from 9in2 to 3in2 to match Figure 8-2 in Power Dissipation and Safe Operating Area Go
  • Changed Figure 8-4, Thermal Resistance vs Circuit Board Copper Area, to align with Thermal Information Go
  • Changed Figure 8-6, Improved Howland Current Pump, 20kΩ resistor from R4 to R3 (typo), and deleted footnoteGo
  • Added text to clarify application operation in Programmable Power Supply Go
  • Moved misplaced junction dot to correct location in Figure 8-10, Motor-Drive Circuit Go