JAJSES9 February   2018 DAC8771

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      DAC8771のブロック図
  4. 改訂履歴
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Write and Readback Mode
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Current Output Stage
      2. 8.3.2  Voltage Output Stage
      3. 8.3.3  Buck-Boost Converter
        1. 8.3.3.1 Buck-Boost Converter Outputs
        2. 8.3.3.2 Selecting and Enabling Buck-Boost Converter
        3. 8.3.3.3 Configurable Clamp Feature and Current Output Settling Time
          1. 8.3.3.3.1 Default Mode - CCLP[1:0] = "00"
          2. 8.3.3.3.2 Fixed Clamp Mode - CCLP[1:0] = "01"
          3. 8.3.3.3.3 Auto Learn Mode - CCLP[1:0] = "10"
          4. 8.3.3.3.4 High Side Clamp (HSCLMP)
      4. 8.3.4  Analog Power Supply
      5. 8.3.5  Digital Power Supply
      6. 8.3.6  Internal Reference
      7. 8.3.7  Power-On-Reset
      8. 8.3.8  ALARM Pin
      9. 8.3.9  Power GOOD bit
      10. 8.3.10 Status Register
      11. 8.3.11 Status Mask
      12. 8.3.12 Alarm Action
      13. 8.3.13 Watchdog Timer
      14. 8.3.14 Programmable Slew Rate
      15. 8.3.15 HART Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Peripheral Interface (SPI)
        1. 8.4.1.1 Stand-Alone Operation
        2. 8.4.1.2 Daisy-Chain Operation
      2. 8.4.2 SPI Shift Register
      3. 8.4.3 Write Operation
      4. 8.4.4 Read Operation
      5. 8.4.5 Updating the DAC Outputs and LDAC Pin
        1. 8.4.5.1 Asynchronous Mode
        2. 8.4.5.2 Synchronous Mode
      6. 8.4.6 Hardware RESET Pin
      7. 8.4.7 Hardware CLR Pin
      8. 8.4.8 Frame Error Checking
      9. 8.4.9 DAC Data Calibration
        1. 8.4.9.1 DAC Data Gain and Offset Calibration Registers
    5. 8.5 Register Maps
      1. 8.5.1 Register Maps
        1. 8.5.1.1 DAC8771 Commands
        2. 8.5.1.2 Register Maps and Bit Functions
          1. 8.5.1.2.1  No Operation Register (address = 0x00) [reset = 0x0000]
            1. Table 6. No Operation Field Descriptions
          2. 8.5.1.2.2  Reset Register (address = 0x01) [reset = 0x0000]
            1. Table 7. Reset Register Field Descriptions
          3. 8.5.1.2.3  Reset Config Register (address = 0x02) [reset = 0x0000]
            1. Table 8. Reset Config Register Field Descriptions
          4. 8.5.1.2.4  Select DAC Register (address = 0x03) [reset = 0x0000]
            1. Table 9. Select DAC Register Field Descriptions
          5. 8.5.1.2.5  Configuration DAC Register (address = 0x04) [reset = 0x0000]
            1. Table 10. Configuration DAC Register Field Descriptions
          6. 8.5.1.2.6  DAC Data Register (address = 0x05) [reset = 0x0000]
            1. Table 11. DAC Data Register Field Descriptions
          7. 8.5.1.2.7  Select Buck-Boost Converter Register (address = 0x06) [reset = 0x0000]
            1. Table 12. Select Buck-Boost Converter Register Field Descriptions
          8. 8.5.1.2.8  Configuration Buck-Boost Register (address = 0x07) [reset = 0x0000]
            1. Table 13. Configuration Buck-Boost Register Field Descriptions
          9. 8.5.1.2.9  DAC Channel Calibration Enable Register (address = 0x08) [reset = 0x0000]
            1. Table 14. DAC Channel Calibration Enable Register Field Descriptions
          10. 8.5.1.2.10 DAC Channel Gain Calibration Register (address = 0x09) [reset = 0x0000]
            1. Table 15. DAC Channel Gain Calibration Register Field Descriptions
          11. 8.5.1.2.11 DAC Channel Offset Calibration Register (address = 0x0A) [reset = 0x0000]
            1. Table 16. DAC Channel Offset Calibration Register Field Descriptions
          12. 8.5.1.2.12 Status Register (address = 0x0B) [reset = 0x1000]
            1. Table 17. Status Register Field Descriptions
          13. 8.5.1.2.13 Status Mask Register (address = 0x0C) [reset = 0x0000]
            1. Table 18. Status Mask Register Field Descriptions
          14. 8.5.1.2.14 Alarm Action Register (address = 0x0D) [reset = 0x0000]
            1. Table 19. Alarm Action Register Field Descriptions
          15. 8.5.1.2.15 User Alarm Code Register (address = 0x0E) [reset = 0x0000]
            1. Table 20. User Alarm Code Register Field Descriptions
          16. 8.5.1.2.16 Reserved Register (address = 0x0F) [reset = N/A]
            1. Table 21. Reserved Register Field Descriptions
          17. 8.5.1.2.17 Write Watchdog Timer Register (address = 0x10) [reset = 0x0000]
            1. Table 22. Write Watchdog Timer Register Field Descriptions
          18. 8.5.1.2.18 Reserved Register (address 0x12 - 0xFF) [reset = N/A]
            1. Table 23. Reserved Register Field Descriptions
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Buck-Boost Converter External Component Selection
      2. 9.1.2 Voltage and Current Outputs on a Shared Terminal
      3. 9.1.3 Optimizing Current Output Settling Time with Auto-Learn Mode
      4. 9.1.4 Protection for Industrial Transients
      5. 9.1.5 Implementing HART with DAC8771
    2. 9.2 Typical Application
      1. 9.2.1 Single-Channel, Isolated, EMC and EMI Protected Analog Output Module with Adaptive Power Management
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

An example layout based on the design discussed in the Typical Application section is shown in the Layout Example section. Figure 132 shows the top-layer of the design which illustrates all component placement as no components are placed on the bottom layer. Figure 133 shows the internal power-layers for the internal buck-boost converter outputs.

The layer stack-up for this 4-layer example layout is shown below. A 4-layer design is not required, however provides optimal conditions for ground and power-supply planes. The solid ground plane beneath the majority of the signal traces, which are placed on the top layer, allows for a clean return path for sensitive analog traces and keeps them isolated from the internal power supply nets which will exhibit ripple from the DC/DC converter.

Table 24. Example Layout Layer Stack-Up

Signal Traces and Ground Fill
SOLID Ground Plane
Split Power Supply Plane for VPOS, VNEG, and DVDD
Signal Traces and Ground Fill

Traces for the DC/DC external components should be as low impedance, low inductance, and low capacitance as possible in order to maintain optimum performance. As such wide traces should be used to minimize inductance with minimal use of vias as vias contribute large inductance and capacitance to the trace. For this reason, it is recommended that all DC/DC components placed on the top layer.

The industrial transient protection circuit should be placed as close to the output connectors as possible to ensure that the return currents from these transients have a controlled path to exit the PCB which does not impact the analog circuitry.

Split ground planes for the DC/DC, digital, and analog grounds are not required but may be helpful to isolated ground return currents from cross-talk. If split ground planes are used, care should be taken to ensure that signal traces are only placed above or below the locations where their respective grounds are placed in order to mitigate unexpected return paths or coupling to the other ground planes. If a single ground plane is used, it is advisable to follow similar practices implementing a star-ground where the respective return currents interact with one another minimally. The example layout uses a single ground plane, based on measured results, performs similarly to an identical version with split ground planes.

The perimeter of the board is stitched with vias in order to enhance design performance against environments which may include radiated emissions. Additional vias are placed in critical areas nearby the design in order to place ground pours in between nodes to reduce cross-talk between adjacent traces.

Standard best-practices should be applied to the remaining components, including but not limited to, placing decoupling capacitors close to their respective pins and using wide traces or copper pours where possible, particularly for power traces where high current may flow.