JAJSLA9E may   2015  – april 2023 DLP7000UV

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  LVDS Timing Requirements
    8. 7.8  LVDS Waveform Requirements
    9. 7.9  Serial Control Bus Timing Requirements
    10. 7.10 Systems Mounting Interface Loads
    11. 7.11 Micromirror Array Physical Characteristics
    12. 7.12 Micromirror Array Optical Characteristics
    13. 7.13 Window Characteristics
    14. 7.14 Chipset Component Usage Specification
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 - Digital Controller for DLP Discovery 4100 Chipset
      2. 8.3.2 DLPA200 DMD Micromirror Driver
      3. 8.3.3 DLPR410 - PROM for DLP Discovery 4100 Chipset
      4. 8.3.4 DLP7000 - DLP 0.7 XGA 2xLVDS UV Type-A DMD
        1. 8.3.4.1 DLP7000UV Chipset Interfaces
          1. 8.3.4.1.1 DLPC410 Interface Description
            1. 8.3.4.1.1.1 DLPC410 IO
            2. 8.3.4.1.1.2 Initialization
            3. 8.3.4.1.1.3 DMD Device Detection
            4. 8.3.4.1.1.4 Power Down
        2. 8.3.4.2 DLPC410 to DMD Interface
          1. 8.3.4.2.1 DLPC410 to DMD IO Description
          2. 8.3.4.2.2 Data Flow
        3. 8.3.4.3 DLPC410 to DLPA200 Interface
          1. 8.3.4.3.1 DLPA200 Operation
          2. 8.3.4.3.2 DLPC410 to DLPA200 IO Description
        4. 8.3.4.4 DLPA200 to DLP7000UV Interface Overview
      5. 8.3.5 Measurement Conditions
    4. 8.4 Device Functional Modes
      1. 8.4.1 DMD Operation
        1. 8.4.1.1 Single Block Mode
        2. 8.4.1.2 Dual Block Mode
        3. 8.4.1.3 Quad Block Mode
        4. 8.4.1.4 Global Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation
    7. 8.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DMD Reflectivity Characteristics
      2. 9.1.2 Design Considerations Influencing DMD Reflectivity
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up Sequence (Handled by the DLPC410)
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
      4. 11.1.4 PCB Layout Guidelines
        1. 11.1.4.1 DMD Interface
          1. 11.1.4.1.1 Trace Length Matching
        2. 11.1.4.2 DLP7000UV Decoupling
          1. 11.1.4.2.1 Decoupling Capacitors
        3. 11.1.4.3 VCC and VCC2
        4. 11.1.4.4 DMD Layout
        5. 11.1.4.5 DLPA200
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Device Marking
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 サポート・リソース
    5. 12.5 Trademarks
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision D (May 2017) to Revision E (May 2017)

  • Changed Micromirror switching time typical value from 13 μs to 12.5 μs and removed 22 μs Max value. Go
  • Changed "DMD" heading to "DLP7000 - DLP 0.7 XGA 2xLVDS UV Type-A DMD"Go

Changes from Revision C (September 2015) to Revision D (May 2017)

  • Updated Pin Configuration and Functions diagram Go
  • Changed TGRADIENT from 5 °C to 10 °C to accommodate increase in power density from 400 to 420 nm and added RH symbol for relative humidity in Section 7.1 Go
  • Clarified TGRADIENT footnote in Section 7.1 Go
  • Changed Tstg to TDMD in Section 7.2 Go
  • Changed 363 to 420 nm to 363 to 400 nm max for 2.5 W/cm2 power density and 3.7 W max optical power in Section 7.4 Go
  • Added 400 to 420 nm max power density of 11 W/cm2 and max optical power of 16.2 W in Section 7.4 Go
  • Added 363 to 420 nm total integrated max power density of 11 W/cm2 and total integrated max optical power of 16.2 W in Section 7.4 Go
  • Changed TGRADIENT from 5 °C to 10 °C to accommodate increase in power density from 400 to 420 nm Section 7.4 Go
  • Clarified TGRADIENT footnoteGo
  • Changed Micromirror active border value from 10 to correct value of 6 in Section 7.11 Go
  • Changed micromirror crossover to mean transition time and renamed previous crossover to micromirror switching time typical micromirror crossover time typo (16 µs to 13 µs) in Section 7.12 Go
  • Added typical micromirror switching time - 13 µs in Section 7.12 Go
  • Changed "Micromirror switching time" to "Array switching time" for clarity in Section 7.12 Go
  • Added clarification to Micromirror switching time at 400 MHz with global reset in Section 7.12 Go
  • Added "Digital Controller for Discovery 4100 chipset" to "DLPC410" headerGo
  • Changed "Flash Configuration PROM" heading to "DLPR410 PROM for DLP Discovery 4100 chipset" Go
  • Changed Figure 8-11 drawing to current thermal test point numbering conventionGo
  • Changed References to TP3 to TP1 Go
  • Changed DLPC410, DLPR410, & DLP7000UV Descriptions to match Feature Description sectionGo
  • Improved Figure 12-2 image resolutionGo
  • Added Related Links tableGo

Changes from Revision B (July 2015) to Revision C (September 2015)

  • デバイスのステータスを「製品プレビュー」から「量産データ」へ変更Go
  • Added 3.7-W maximum value to illumination power (from 363 nm to 420 nm) in Section 7.4 Go
  • Updated Figure 9-1 Go

Changes from Revision A (June 2015) to Revision B ()

  • データシート全体をリリースGo
  • セクション 3 で、UVA スペクトルの最小値を 365nm から 363nm に訂正 Go

Changes from Revision * (May 2015) to Revision A ()

  • デバイスの型番を訂正Go