JAJSR90 September   2023 LMQ644A2-Q1

PRODMIX  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
    1. 6.1 Wettable Flanks
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN)
      2. 8.3.2  Enable EN Pin and Use as VIN UVLO
      3. 8.3.3  Output Voltage Selection and Soft Start
      4. 8.3.4  SYNC Allows Clock Synchronization and Mode Selection
      5. 8.3.5  Clock Locking
      6. 8.3.6  Adjustable Switching Frequency
      7. 8.3.7  Power-Good Output Voltage Monitoring
      8. 8.3.8  Internal LDO, VCC UVLO, and BIAS Input
      9. 8.3.9  Bootstrap Voltage and VCBOOT-UVLO (CB1 and CB2 Pin)
      10. 8.3.10 CONFIG Device Configuration Pin
      11. 8.3.11 Spread Spectrum
      12. 8.3.12 Soft Start and Recovery From Dropout
      13. 8.3.13 Overcurrent and Short-Circuit Protection
      14. 8.3.14 Hiccup
      15. 8.3.15 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 Peak Current Mode Operation
        2. 8.4.3.2 Auto Mode Operation
          1. 8.4.3.2.1 Diode Emulation
        3. 8.4.3.3 FPWM Mode Operation
        4. 8.4.3.4 Minimum On-time (High Input Voltage) Operation
        5. 8.4.3.5 Dropout
        6. 8.4.3.6 Recovery from Dropout
        7. 8.4.3.7 Other Fault Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Choosing the Switching Frequency
        2. 9.2.2.2  Setting the Output Voltage
        3. 9.2.2.3  Inductor Selection
        4. 9.2.2.4  Output Capacitor Selection
        5. 9.2.2.5  Input Capacitor Selection
        6. 9.2.2.6  BOOT Capacitor
        7. 9.2.2.7  VCC
        8. 9.2.2.8  CFF and RFF Selection
        9. 9.2.2.9  SYNCHRONIZATION AND MODE
        10. 9.2.2.10 External UVLO
        11. 9.2.2.11 Typical Thermal Performance
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Ground and Thermal Considerations
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 サード・パーティ製品に関する免責事項
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 用語集
    6. 10.6 静電気放電に関する注意事項
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.3.15 Thermal Shutdown

Thermal shutdown is a safety mechanism for the device that limits total power dissipation by turning off the internal switches when the a temperature sensor on the IC exceeds 168°C (typical). After thermal shutdown occurs, hysteresis prevents the device from switching until the temperature sensor temperature drops to approximately 159°C (typical). When the sensor temperature falls below 159°C (typical), the LMQ644xx attempts to soft start. While the sensor is close to the power FETs, it must not be used to determine maximum junction temperature of the device under load as there can be temperature gradients across the device. Instead thermal couples and other methods must be used to characterize thermal design in application.

While the LMQ644xx is shut down due to high junction temperature, power continues to be provided to VCC. To prevent overheating from a short circuit applied to VCC, the LDO providing power to VCC has reduced current limit while the part is disabled due to high junction temperature. The LDO only provides a few milliamperes during thermal shutdown.