JAJSOO3A October   2014  – June 2022 TMP75B-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Temperature Limits and Alert
      3. 7.3.3 Serial Interface
        1. 7.3.3.1  Bus Overview
        2. 7.3.3.2  Serial Bus Address
        3. 7.3.3.3  Writing and Reading Operation
        4. 7.3.3.4  Target-Mode Operations
          1. 7.3.3.4.1 Target Receiver Mode:
          2. 7.3.3.4.2 Target Transmitter Mode:
        5. 7.3.3.5  SMBus Alert Function
        6. 7.3.3.6  General Call
        7. 7.3.3.7  High-Speed (Hs) Mode
        8. 7.3.3.8  Timeout Function
        9. 7.3.3.9  Two-Wire Timing
        10. 7.3.3.10 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
    5. 7.5 Programming
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)TMP75B-Q1UNIT
D (SOIC)DGK (VSSOP)
8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance125.4188.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance71.579.1
RθJBJunction-to-board thermal resistance65.8109.6
ψJTJunction-to-top characterization parameter21.115.3
ψJBJunction-to-board characterization parameter65.3108
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.