JAJSO66A December   2023  – January 2024 TPS61289

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Bidirectional Operation Configuration
      2. 6.3.2 VCC Power Supply
      3. 6.3.3 VHIGH and VCC Undervoltage Lockout (UVLO)
      4. 6.3.4 Enable and Programmable EN/UVLO
      5. 6.3.5 Switching Frequency
      6. 6.3.6 Programmable Switching Peak and Valley Current Limit
      7. 6.3.7 External Clock Synchronization
      8. 6.3.8 VHIGH Overvoltage Protection
      9. 6.3.9 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Bootstrap Capacitor Selection
        2. 7.2.2.2 Inductor Selection
        3. 7.2.2.3 MOSFET Selection
        4. 7.2.2.4 VLOW/VHIGH Output Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) TPS61289 UNIT
RZP (VQFN) - 14 PINS
Standard
RθJA Junction-to-ambient thermal resistance 64.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.2 °C/W
RθJB Junction-to-board thermal resistance 18.8 °C/W
ΨJT Junction-to-top characterization parameter 1.4 °C/W
ΨJB Junction-to-board characterization parameter 18.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics  application note.