SN74AVC2T245

ACTIVE

Dual-Bit, 2-DIR pin Dual-Supply Bus Transceiver w/ Configurable Voltage Translation, 3-State Output

A newer version of this product is available

open-in-new Compare alternates
This product continues to be available for existing customers. New designs should consider an alternate product.
Drop-in replacement with upgraded functionality to the compared device
SN74AXC2T245 ACTIVE Dual-bit, 2-DIR pin dual-supply bus transceiver w/ configurable voltage translation, 3-state output Pin-to-pin upgrade with a wider voltage range and improved performance

SN74AVC2T245

ACTIVE

Product details

Technology family AVC Applications JTAG Bits (#) 2 High input voltage (min) (V) 0.78 High input voltage (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 3.6 Data rate (max) (Mbps) 500 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 16 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type 3-State, Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AVC Applications JTAG Bits (#) 2 High input voltage (min) (V) 0.78 High input voltage (max) (V) 3.6 Vout (min) (V) 1.2 Vout (max) (V) 3.6 Data rate (max) (Mbps) 500 IOH (max) (mA) -12 IOL (max) (mA) 12 Supply current (max) (µA) 16 Features Output enable, Overvoltage tolerant inputs, Partial power down (Ioff) Input type Standard CMOS Output type 3-State, Balanced CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
UQFN (RSW) 10 2.52 mm² 1.8 x 1.4
  • Each Channel Has Independent Direction Control
  • Control Inputs VIH/VIL Levels Are Referenced to
    VCCA Voltage
  • Fully Configurable Dual-Rail Design Allows Each
    Port to Operate Over the Full 1.2 V to
    3.6 V Power-Supply Range
  • I/Os Are 4.6 V Tolerant
  • Ioff Supports Partial-Power-Down Mode Operation
  • VCC Isolation Feature - If Either VCC Input is at
    GND, Both Ports are in High-Impedance State
  • Typical Data Rates
    • 500 Mbps (1.8 V to 3.3 V Level-Shifting)
    • 320 Mbps (<1.8 V to 3.3 V Level-Shifting)
    • 320 Mbps (Translate to 2.5 V or 1.8 V)
    • 280 Mbps (Translate to 1.5 V)
    • 240 Mbps (Translate to 1.2 V)
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 5000 V Human-Body Model (A114-A)
    • 200 V Machine Model (A115-A)
    • 1500 V Charged-Device Model (C101)
  • Each Channel Has Independent Direction Control
  • Control Inputs VIH/VIL Levels Are Referenced to
    VCCA Voltage
  • Fully Configurable Dual-Rail Design Allows Each
    Port to Operate Over the Full 1.2 V to
    3.6 V Power-Supply Range
  • I/Os Are 4.6 V Tolerant
  • Ioff Supports Partial-Power-Down Mode Operation
  • VCC Isolation Feature - If Either VCC Input is at
    GND, Both Ports are in High-Impedance State
  • Typical Data Rates
    • 500 Mbps (1.8 V to 3.3 V Level-Shifting)
    • 320 Mbps (<1.8 V to 3.3 V Level-Shifting)
    • 320 Mbps (Translate to 2.5 V or 1.8 V)
    • 280 Mbps (Translate to 1.5 V)
    • 240 Mbps (Translate to 1.2 V)
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 5000 V Human-Body Model (A114-A)
    • 200 V Machine Model (A115-A)
    • 1500 V Charged-Device Model (C101)

This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation between any of the 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V voltage nodes.

The SN74AVC2T245 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input and the output-enable (OE) activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode . The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ.

The SN74AVC2T245 control pins (DIR1, DIR2, and OE) are supplied by VCCA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE must be connected to VCC through a pull-up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional translation between any of the 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V voltage nodes.

The SN74AVC2T245 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input and the output-enable (OE) activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode . The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ.

The SN74AVC2T245 control pins (DIR1, DIR2, and OE) are supplied by VCCA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE must be connected to VCC through a pull-up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 17
Type Title Date
* Data sheet SN74AVC2T245 Dual-Bit Dual-Supply Bus Transceiver with Configurable Level-Shifting / Voltage Translation and Tri-State Outputs datasheet (Rev. D) PDF | HTML 22 Feb 2016
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 12 Jul 2024
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 03 Jul 2024
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
EVM User's guide SN74AXC2T-SMALLPKGEVM Evaluation module user's guide 04 Jun 2019
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
Application note Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B) 30 Apr 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
More literature LCD Module Interface Application Clip 09 May 2003
User guide AVC Advanced Very-Low-Voltage CMOS Logic Data Book, March 2000 (Rev. C) 20 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B) 07 Jul 1999
Application note AVC Logic Family Technology and Applications (Rev. A) 26 Aug 1998

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

AXC2T-SMALLPKGEVM — AXC2T small package evaluation module for DTM and RSW package devices

This EVM is designed to support DTM and RSW packages for the AXC and LVC family of DIR controlled bidirectional devices. The AXC and AVC devices belong to the low voltage direction controlled translation family with operating voltage from 0.65V to 3.6V (AXC) and 1.2 to 3.6 (AVC) with 12mA of drive (...)
User guide: PDF
Not available on TI.com
Development kit

EVMK2GX — 66AK2Gx 1GHz evaluation module

The EVMK2GX (also known as "K2G") 1GHz evaluation module (EVM) enables developers to immediately start evaluating the 66AK2Gx processor family, and to accelerate the development of audio, industrial motor control, smart grid protection and other high reliability, real-time compute intensive (...)

User guide: PDF
Not available on TI.com
Simulation model

HSPICE Model for SN74AVC2T245

SCEM533.ZIP (102 KB) - HSpice Model
Simulation model

SN74AVC2T245 IBIS Model

SCEM532.ZIP (64 KB) - IBIS Model
Reference designs

TIDEP0050 — EnDat 2.2 System Reference Design

This reference design implements EnDat 2.2 Master protocol stack and hardware interface based on HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The design is composed of EnDat 2.2 Master protocol stack, half-duplex communications using RS-485 transceivers and the line termination (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-00403 — Ultrasonic Distance Measurement using the TLV320AIC3268 miniDSP CODEC Reference Design

The TIDA-00403 reference design uses off-the-shelf EVMs for ultrasonic distance measurement solutions using algorithms within the TLV320AIC3268 miniDSP. In conjunction with TI’s PurePath Studio design suite, a robust and user configurable ultrasonic distance measurement system can be designed (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
UQFN (RSW) 10 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos