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AM3715

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Sitara-Prozessor: Arm Cortex-A8, 3D Grafik, Kamera

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AM3715

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Produktdetails

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 1 LCD Protocols Ethernet Hardware accelerators Image/Video Extension, SGX Graphics Operating system Linux, RTOS Security Cryptography Rating Catalog Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 1 LCD Protocols Ethernet Hardware accelerators Image/Video Extension, SGX Graphics Operating system Linux, RTOS Security Cryptography Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.
  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging
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Technische Dokumentation

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Typ Titel Datum
* Data sheet AM3715, AM3703 Sitara ARM Microprocessors datasheet (Rev. F) 29 Aug 2011
* Errata AM3715, AM3703 Microprocessors Silicon Errata (Silicon Revisions 1.2 1.1 & 1.0) (Rev. F) 13 Feb 2014
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 24 Sep 2012
More literature From Start to Finish: A Product Development Roadmap for Sitara™ Processors 16 Dez 2020
Application note (Cancelled - see the B revision, create by mistake 14-may-2009) (Rev. C) PDF | HTML 03 Mär 2020
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 20 Mär 2019
User guide How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 24 Sep 2018
More literature Ethernet Connectivity via GPMC 06 Jul 2018
More literature AM37x/DM37x Schematic Checklist 06 Jul 2018
More literature AM37x EVM Software Developer's Guide 06 Jul 2018
Technical article Spring has sprung. A sale has sprung. PDF | HTML 04 Apr 2016
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 01 Nov 2013
White paper AM37x power-saving techniques lead to ultra-low-power for battery-operated appli 08 Apr 2013
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 10 Sep 2012
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 15 Jun 2011
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 23 Jun 2010
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 23 Jun 2010
Application note AM/DM37x Power Estimation Spreadsheet 07 Jun 2010
Application note AM/DM37x Overview 03 Jun 2010
Application note AM3715/03 Memory Subsystem 03 Jun 2010
Application note AM37x CUS Routing Guidelines 03 Jun 2010
Application note Migrating from OMAP3530 to AM37x 03 Jun 2010
Application note Setting up AM37x SDRC Registers 03 Jun 2010

Design und Entwicklung

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