Startseite Schnittstelle Andere Schnittstellen

DS32EL0124

AKTIV

125 bis 312,5-MHz-FPGA-Link-Deserializer mit paralleler DDR-LVDS-Schnittstelle

Produktdetails

Protocols Catalog Rating Catalog Operating temperature range (°C) -40 to 85
Protocols Catalog Rating Catalog Operating temperature range (°C) -40 to 85
WQFN (RHS) 48 49 mm² 7 x 7
  • 5-bit DDR LVDS Parallel Data Interface
  • Programmable Receive Equalization
  • Selectable DC-Balance Decoder
  • Selectable De-Scrambler
  • Remote Sense for Automatic Detection and Negotiation of Link Status
  • No External Receiver Reference Clock Required
  • LVDS Parallel Interface
  • Programmable LVDS Output Clock Delay
  • Supports Output Data-Valid Signaling
  • Supports Keep-Alive Clock Output
  • On Chip LC VCOs
  • Redundant Serial Input (ELX device only)
  • Retimed Serial Output (ELX device only)
  • Configurable PLL Loop Bandwidth
  • Configurable via SMBus
  • Loss of Lock and Error Reporting
  • 48-pin WQFN Package with Exposed DAP

Key Specifications

  • 1.25 to 3.125 Gbps Serial Data Rate
  • 125 to 312.5 MHz DDR Parallel Clock
  • -40° to +85°C Temperature Range
  • > 8 kV ESD (HBM) Protection
  • 0.5 UI Minimum Input Jitter Tolerance (1.25 Gbps)

All trademarks are the property of their respective owners.

  • 5-bit DDR LVDS Parallel Data Interface
  • Programmable Receive Equalization
  • Selectable DC-Balance Decoder
  • Selectable De-Scrambler
  • Remote Sense for Automatic Detection and Negotiation of Link Status
  • No External Receiver Reference Clock Required
  • LVDS Parallel Interface
  • Programmable LVDS Output Clock Delay
  • Supports Output Data-Valid Signaling
  • Supports Keep-Alive Clock Output
  • On Chip LC VCOs
  • Redundant Serial Input (ELX device only)
  • Retimed Serial Output (ELX device only)
  • Configurable PLL Loop Bandwidth
  • Configurable via SMBus
  • Loss of Lock and Error Reporting
  • 48-pin WQFN Package with Exposed DAP

Key Specifications

  • 1.25 to 3.125 Gbps Serial Data Rate
  • 125 to 312.5 MHz DDR Parallel Clock
  • -40° to +85°C Temperature Range
  • > 8 kV ESD (HBM) Protection
  • 0.5 UI Minimum Input Jitter Tolerance (1.25 Gbps)

All trademarks are the property of their respective owners.

The DS32EL0124/DS32ELX0124 integrates clock and data recovery modules for high-speed serial communication over FR-4 printed circuit board backplanes, balanced cables, and optical fiber. This easy-to-use chipset integrates advanced signal and clock conditioning functions, with an FPGA friendly interface.

The DS32EL0124/DS32ELX0124 deserializes up to 3.125 Gbps of high speed serial data to 5 LVDS outputs without the need for an external reference clock. With DC-balance decoding enabled, the application payload of 2.5 Gbps is deserialized to 4 LVDS outputs.

The DS32EL0124/DS32ELX01214 deserializers feature a remote sense capability to automatically signal link status conditions to its companion DS32EL0421/ELX0421 serializers without requiring an additional feedback path.

The parallel LVDS interface of these devices reduce FPGA I/O pins, board trace count and alleviates EMI issues, when compared to traditional single-ended wide bus interfaces.

The DS32EL0124/ELX0124 is programmable through a SMBus interface as well as through control pins.

The DS32EL0124/DS32ELX0124 integrates clock and data recovery modules for high-speed serial communication over FR-4 printed circuit board backplanes, balanced cables, and optical fiber. This easy-to-use chipset integrates advanced signal and clock conditioning functions, with an FPGA friendly interface.

The DS32EL0124/DS32ELX0124 deserializes up to 3.125 Gbps of high speed serial data to 5 LVDS outputs without the need for an external reference clock. With DC-balance decoding enabled, the application payload of 2.5 Gbps is deserialized to 4 LVDS outputs.

The DS32EL0124/DS32ELX01214 deserializers feature a remote sense capability to automatically signal link status conditions to its companion DS32EL0421/ELX0421 serializers without requiring an additional feedback path.

The parallel LVDS interface of these devices reduce FPGA I/O pins, board trace count and alleviates EMI issues, when compared to traditional single-ended wide bus interfaces.

The DS32EL0124/ELX0124 is programmable through a SMBus interface as well as through control pins.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 3
Typ Titel Datum
* Data sheet DS32EL0124/ELX0124 125MHz-312.5MHz FPGA-Link Deserializr w/DDR LVDS Para I/F datasheet (Rev. K) 15 Apr 2013
Application note Expanding the Payload w/FPGA-Link DS32ELX0421 and DS32ELX0124 SER/DES (Rev. A) 26 Apr 2013
Application note LVDS Timing DS32ELX0421 and DS32ELX0124 Serializers and Deserializers (Rev. A) 26 Apr 2013

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

DS32ELX0124 IBIS Model

SNLM199.ZIP (56 KB) - IBIS Model
Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
Gehäuse Pins Herunterladen
WQFN (RHS) 48 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos