Startseite Schnittstelle Highspeed-Serializer/Deserializer Serializer/Deserializer für FPD-Link

DS90CF384

AKTIV

LVDS-Empfänger, 24-Bit-Flachbildschirm (FPD)-Link, +3,3V – 65 MHz

Produktdetails

Function Deserializer Color depth (bps) 24 Input compatibility FPD-Link LVDS Output compatibility LVCMOS Features Low-EMI Point-to-Point Communication Applications In-vehicle Infotainment (IVI) EMI reduction LVDS Rating Catalog Operating temperature range (°C) -40 to 85
Function Deserializer Color depth (bps) 24 Input compatibility FPD-Link LVDS Output compatibility LVCMOS Features Low-EMI Point-to-Point Communication Applications In-vehicle Infotainment (IVI) EMI reduction LVDS Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • 20 to 65 MHz shift clock support
  • Programmable transmitter (DS90C383) strobe select
    (Rising or Falling edge strobe)
  • Single 3.3V supply
  • Chipset (Tx + Rx) power consumption < 250 mW (typ)
  • Power-down mode (< 0.5 mW total)
  • Single pixel per clock XGA (1024x768) ready
  • Supports VGA, SVGA, XGA and higher addressability.
  • Up to 227 Megabytes/sec bandwidth
  • Up to 1.8 Gbps throughput
  • Narrow bus reduces cable size and cost
  • 290 mV swing LVDS devices for low EMI
  • PLL requires no external components
  • Low profile 56-lead TSSOP package.
  • DS90CF384 also available in 64 ball, 0.8mm fine pitch
    ball grid array(FBGA) package
  • Falling edge data strobe Receiver
  • Compatible with TIA/EIA-644 LVDS standard
  • ESD rating >7 kV
  • Operating Temperature: –40°C to +85°C

  • 20 to 65 MHz shift clock support
  • Programmable transmitter (DS90C383) strobe select
    (Rising or Falling edge strobe)
  • Single 3.3V supply
  • Chipset (Tx + Rx) power consumption < 250 mW (typ)
  • Power-down mode (< 0.5 mW total)
  • Single pixel per clock XGA (1024x768) ready
  • Supports VGA, SVGA, XGA and higher addressability.
  • Up to 227 Megabytes/sec bandwidth
  • Up to 1.8 Gbps throughput
  • Narrow bus reduces cable size and cost
  • 290 mV swing LVDS devices for low EMI
  • PLL requires no external components
  • Low profile 56-lead TSSOP package.
  • DS90CF384 also available in 64 ball, 0.8mm fine pitch
    ball grid array(FBGA) package
  • Falling edge data strobe Receiver
  • Compatible with TIA/EIA-644 LVDS standard
  • ESD rating >7 kV
  • Operating Temperature: –40°C to +85°C

The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. The DS90CF384 is also offered in 64 ball, 0.8mm fine pitch ball grid array(FBGA) package which provides a 44 % reduction in PCB footprint (available Q3, 1999).

This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.

The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. The DS90CF384 is also offered in 64 ball, 0.8mm fine pitch ball grid array(FBGA) package which provides a 44 % reduction in PCB footprint (available Q3, 1999).

This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet DS90C383/F384 3.3VProg LVDS Trans 24Bit FPD, 65MHz,3.3VLVDS Rcvr 24Bit FPD 65MHz datasheet (Rev. A) 13 Mai 2004
Application note How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) 29 Jun 2018
Application note AN-1032 An Introduction to FPD-Link (Rev. C) 08 Aug 2017
Application note Receiver Skew Margin for Channel Link I and FPD Link I Devices 13 Jan 2016
Application note TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map 15 Mai 2004
Application note AN-1056 STN Application Using FPD-Link 14 Mai 2004
Application note AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines 14 Mai 2004

Design und Entwicklung

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Evaluierungsplatine

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The FPD-Link evaluation kit includes a transmitter (Tx) board, a receiver (Rx) board and interfacing cables. This kit shows the chipsets interfacing from test equipment or a graphics controller using low-voltage differential signaling (LVDS) to a receiver board.

The transmitter board accepts (...)

Benutzerhandbuch: PDF
Simulationsmodell

DS90CF384 IBIS Model

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Benutzerhandbuch: PDF
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TSSOP (DGG) 56 Optionen anzeigen

Bestellen & Qualität

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  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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  • Montagestandort

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