Startseite Schnittstelle Andere Schnittstellen

DS90CR215

AKTIV

21-Bit Channel-Link-LVDS-Sender, +3,3V Rising Edge Data Strobe – 66 MHz

Produktdetails

Protocols Catalog Device type Transmitter Rating Catalog Operating temperature range (°C) -40 to 85
Protocols Catalog Device type Transmitter Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • Single +3.3V Supply
  • Chipset (Tx + Rx) Power Consumption <250 mW (typ)
  • Power-down Mode (<0.5 mW total)
  • Up to 173 Megabytes/sec Bandwidth
  • Up to 1.386 Gbps Data Throughput
  • Narrow Bus Reduces Cable Size
  • 290 mV Swing LVDS Devices for Low EMI
  • +1V Common Mode Range (Around +1.2V)
  • PLL Requires No External Components
  • Low Profile 48-Lead TSSOP Package
  • Rising Edge Data Strobe
  • Compatible with TIA/EIA-644 LVDS Standard
  • ESD Rating > 7 kV
  • Operating Temperature: −40°C to +85°C

All trademarks are the property of their respective owners.

  • Single +3.3V Supply
  • Chipset (Tx + Rx) Power Consumption <250 mW (typ)
  • Power-down Mode (<0.5 mW total)
  • Up to 173 Megabytes/sec Bandwidth
  • Up to 1.386 Gbps Data Throughput
  • Narrow Bus Reduces Cable Size
  • 290 mV Swing LVDS Devices for Low EMI
  • +1V Common Mode Range (Around +1.2V)
  • PLL Requires No External Components
  • Low Profile 48-Lead TSSOP Package
  • Rising Edge Data Strobe
  • Compatible with TIA/EIA-644 LVDS Standard
  • ESD Rating > 7 kV
  • Operating Temperature: −40°C to +85°C

All trademarks are the property of their respective owners.

The DS90CR215 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. The DS90CR216 receiver converts the LVDS data streams back into 21 bits of CMOS/TTL data. At a transmit clock frequency of 66 MHz, 21 bits of TTL data are transmitted at a rate of 462 Mbps per LVDS data channel. Using a 66 MHz clock, the data throughput is 1.386 Gbit/s (173 Mbytes/s).

The multiplexing of the data lines provides a substantial cable reduction. Long distance parallel single-ended buses typically require a ground wire per active signal (and have very limited noise rejection capability). Thus, for a 21-bit wide data and one clock, up to 44 conductors are required. With the Channel Link chipset as few as 9 conductors (3 data pairs, 1 clock pair and a minimum of one ground) are needed. This provides a 80% reduction in required cable width, which provides a system cost savings, reduces connector physical size and cost, and reduces shielding requirements due to the cables' smaller form factor.

The 21 CMOS/TTL inputs can support a variety of signal combinations. For example, five 4-bit nibbles plus 1 control, or two 9-bit (byte + parity) and 3 control.

The DS90CR215 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. The DS90CR216 receiver converts the LVDS data streams back into 21 bits of CMOS/TTL data. At a transmit clock frequency of 66 MHz, 21 bits of TTL data are transmitted at a rate of 462 Mbps per LVDS data channel. Using a 66 MHz clock, the data throughput is 1.386 Gbit/s (173 Mbytes/s).

The multiplexing of the data lines provides a substantial cable reduction. Long distance parallel single-ended buses typically require a ground wire per active signal (and have very limited noise rejection capability). Thus, for a 21-bit wide data and one clock, up to 44 conductors are required. With the Channel Link chipset as few as 9 conductors (3 data pairs, 1 clock pair and a minimum of one ground) are needed. This provides a 80% reduction in required cable width, which provides a system cost savings, reduces connector physical size and cost, and reduces shielding requirements due to the cables' smaller form factor.

The 21 CMOS/TTL inputs can support a variety of signal combinations. For example, five 4-bit nibbles plus 1 control, or two 9-bit (byte + parity) and 3 control.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 6
Typ Titel Datum
* Data sheet DS90CR215/216 3.3V Rising Edge Data Strobe LVDS 21Bit Chanlnk - 66MHz datasheet (Rev. D) 17 Apr 2013
Application note High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs 09 Nov 2018
Application note Receiver Skew Margin for Channel Link I and FPD Link I Devices 13 Jan 2016
Design guide Channel Link I Design Guide 29 Mär 2007
Application note Multi-Drop Channel-Link Operation 04 Okt 2004
Application note CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications 05 Okt 1998

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
Gehäuse Pins Herunterladen
TSSOP (DGG) 48 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos