Startseite Schnittstelle LVDS-, M-LVDS- und PECL-ICs

SN65LVDS387

AKTIV

LVDS-Treiber mit 16 Kanälen

Produktdetails

Function Driver Protocols LVDS Number of transmitters 16 Number of receivers 0 Supply voltage (V) 3.3 Signaling rate (MBits) 630 Input signal LVTTL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
Function Driver Protocols LVDS Number of transmitters 16 Number of receivers 0 Supply voltage (V) 3.3 Signaling rate (MBits) 630 Input signal LVTTL Output signal LVDS Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 64 137.7 mm² 17 x 8.1
  • Four (’391), Eight (’389), or Sixteen (’387) Line
    Drivers Meet or Exceed the Requirements of ANSI
    EIA/TIA-644 Standard
  • Designed for Signaling Rates Up to 630 Mbps
    With Very Low Radiation (EMI)
  • Low-Voltage Differential Signaling With Typical
    Output Voltage of 350 mV and a 100-Ω Load
  • Propagation Delay Times Less Than 2.9 ns
  • Output Skew Is Less Than 150 ps
  • Part-to-Part Skew Is Less Than 1.5 ns
  • 35-mW Total Power Dissipation in Each Driver
    Operating at 200 MHz
  • Driver Is High-Impedance When Disabled or With
    VCC < 1.5 V
  • SN65’ Version Bus-Pin ESD Protection Exceeds
    15 kV
  • Packaged in Thin Shrink Small-Outline Package
    With 20-mil Pin Pitch
  • Low-Voltage TTL (LVTTL) Logic Inputs Are 5-V
    Tolerant
  • Four (’391), Eight (’389), or Sixteen (’387) Line
    Drivers Meet or Exceed the Requirements of ANSI
    EIA/TIA-644 Standard
  • Designed for Signaling Rates Up to 630 Mbps
    With Very Low Radiation (EMI)
  • Low-Voltage Differential Signaling With Typical
    Output Voltage of 350 mV and a 100-Ω Load
  • Propagation Delay Times Less Than 2.9 ns
  • Output Skew Is Less Than 150 ps
  • Part-to-Part Skew Is Less Than 1.5 ns
  • 35-mW Total Power Dissipation in Each Driver
    Operating at 200 MHz
  • Driver Is High-Impedance When Disabled or With
    VCC < 1.5 V
  • SN65’ Version Bus-Pin ESD Protection Exceeds
    15 kV
  • Packaged in Thin Shrink Small-Outline Package
    With 20-mil Pin Pitch
  • Low-Voltage TTL (LVTTL) Logic Inputs Are 5-V
    Tolerant

This family of 4, 8, and 16 differential line drivers implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the 16 current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.

When disabled, the driver outputs are high-impedance. Each driver input (A) and enable (EN) have an internal pulldown that will drive the input to a low level when open-circuited.

The SN65LVDS387, SN65LVDS389, and SN65LVDS391 devices are characterized for operation from –40°C to 85°C. The SN75LVDS387, SN75LVDS389, and SN75LVDS391 devices are characterized for operation from 0°C to 70°C.

This family of 4, 8, and 16 differential line drivers implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the 16 current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.

When disabled, the driver outputs are high-impedance. Each driver input (A) and enable (EN) have an internal pulldown that will drive the input to a low level when open-circuited.

The SN65LVDS387, SN65LVDS389, and SN65LVDS391 devices are characterized for operation from –40°C to 85°C. The SN75LVDS387, SN75LVDS389, and SN75LVDS391 devices are characterized for operation from 0°C to 70°C.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet SNx5LVDS3xx High-Speed Differential Line Drivers datasheet (Rev. G) PDF | HTML 14 Jan 2016
Application brief How to Support 1.8-V Signals Using a 3.3-V LVDS Driver/Receiver + Level-Shifter 28 Dez 2018
Application brief LVDS to Improve EMC in Motor Drives 27 Sep 2018
Application brief How Far, How Fast Can You Operate LVDS Drivers and Receivers? 03 Aug 2018
Application brief How to Terminate LVDS Connections with DC and AC Coupling 16 Mai 2018
Application note Using Signaling Rate and Transfer Rate (Rev. A) 07 Feb 2005
User guide 16-Channel LVDS Driver/Receiver Evaluation Module 27 Jun 2000
Application note An Overview of LVDS Technology 05 Okt 1998

Design und Entwicklung

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Evaluierungsplatine

SN65LVDS387EVM — 16-Kanal-LVDS-Treiber – Evaluierungsmodul

We have designed easy-to-use evaluation modules (EVM) for our 16-channel low-voltage differential signaling (LVDS) driver and receivers. Flexibility has been designed into these EVMs so they can be set up in a point-to-point topology (1 driver to 1 receiver) or a multidrop topology (1 driver (...)

Benutzerhandbuch: PDF
Simulationsmodell

SN65LVDS387, SN75LVDS387 IBIS Model (Rev. A)

SLLC031A.ZIP (5 KB) - IBIS Model
Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
Gehäuse Pins Herunterladen
TSSOP (DGG) 64 Optionen anzeigen

Bestellen & Qualität

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  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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