Produktdetails

Configuration 2:1 SPDT Number of channels 4 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 4 CON (typ) (pF) 10.5 Supply current (typ) (µA) 250 Bandwidth (MHz) 500 Operating temperature range (°C) -40 to 85 Features Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 64 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
Configuration 2:1 SPDT Number of channels 4 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 4 CON (typ) (pF) 10.5 Supply current (typ) (µA) 250 Bandwidth (MHz) 500 Operating temperature range (°C) -40 to 85 Features Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 64 Rating Catalog Drain supply voltage (max) (V) 3.6 Supply voltage (max) (V) 3.6
SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4 TVSOP (DGV) 16 23.04 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • High-Bandwidth Data Path
    (up to 500 MHz)
  • 5-V Tolerant I/Os With Device Powered Up or Powered Down
  • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range
    (ron= 4 Ω Typical)
  • Rail-to-Rail Switching on Data I/O Ports
    • 0- to 5-V Switching With 3.3-V VCC
    • 0- to 3.3-V Switching With 2.5-V VCC
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low Input and Output Capacitance Minimizes Loading and Signal Distortion
    (Cio(OFF) = 3.5 pF Typical)
  • Fast Switching Frequency (f OE = 20 MHz Maximum)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption
    (ICC = 0.7 mA Typical)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0- to 5-V Signaling Levels
    (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL or
    5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface,
    Bus Isolation, Low-Distortion Signal Gating (1)

(1)For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, SCDA008.

  • High-Bandwidth Data Path
    (up to 500 MHz)
  • 5-V Tolerant I/Os With Device Powered Up or Powered Down
  • Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range
    (ron= 4 Ω Typical)
  • Rail-to-Rail Switching on Data I/O Ports
    • 0- to 5-V Switching With 3.3-V VCC
    • 0- to 3.3-V Switching With 2.5-V VCC
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low Input and Output Capacitance Minimizes Loading and Signal Distortion
    (Cio(OFF) = 3.5 pF Typical)
  • Fast Switching Frequency (f OE = 20 MHz Maximum)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption
    (ICC = 0.7 mA Typical)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0- to 5-V Signaling Levels
    (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL or
    5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface,
    Bus Isolation, Low-Distortion Signal Gating (1)

(1)For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, SCDA008.

The SN74CB3Q3257 device is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).

The SN74CB3Q3257 device is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron).

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Technische Dokumentation

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Typ Titel Datum
* Data sheet SN74CB3Q3257 4-Bit 1-of-2 FET Multiplexer/Demultiplexer 2.5-V/3.3-V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. D) PDF | HTML 09 Jul 2018
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dez 2021
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) PDF | HTML 19 Nov 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Digital Bus Switch Selection Guide (Rev. A) 10 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Bus FET Switch Solutions for Live Insertion Applications 07 Feb 2003

Design und Entwicklung

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Schnittstellenadapter

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The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Benutzerhandbuch: PDF
Schnittstellenadapter

LEADLESS-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zum Testen der 6-, 8-, 10-, 12-, 14-, 16- und 20-poligen

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Benutzerhandbuch: PDF
Simulationsmodell

HSPICE Model of SN74CB3Q3257

SCDJ024.ZIP (28 KB) - HSpice Model
Simulationsmodell

SN74CB3Q3257 IBIS Model

SCDM049.ZIP (44 KB) - IBIS Model
Referenzdesigns

TIDA-01572 — Stereo-Evaluierungsmodul-Referenzdesign des Digital-Eingangs, Klasse D, IV-Sensor-Audioverstärker

This reference design provides a high-performance stereo audio subsystem for use in PC applications. It operates off a single supply, ranging from 4.5 V to 16 V, and features the TAS2770, a digital-input Class-D audio amplifier that provides excellent noise and distortion performance and is (...)
Design guide: PDF
Schaltplan: PDF
Gehäuse Pins Herunterladen
SSOP (DBQ) 16 Optionen anzeigen
TSSOP (PW) 16 Optionen anzeigen
TVSOP (DGV) 16 Optionen anzeigen
VQFN (RGY) 16 Optionen anzeigen

Bestellen & Qualität

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  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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