Produktdetails

Configuration 1:1 SPST Number of channels 2 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 120 CON (typ) (pF) 4.2 ON-state leakage current (max) (µA) 0.0004 Supply current (typ) (µA) 16 Bandwidth (MHz) 630 Operating temperature range (°C) -40 to 125 Features Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
Configuration 1:1 SPST Number of channels 2 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 120 CON (typ) (pF) 4.2 ON-state leakage current (max) (µA) 0.0004 Supply current (typ) (µA) 16 Bandwidth (MHz) 630 Operating temperature range (°C) -40 to 125 Features Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Wide supply range: ±5 V to ±16.5 V (dual) or 10 V to 16.5 V (single)
  • Latch-up performance meets 100 mA per JESD78 Class II Level A on all pins
  • Low on-capacitance: 4.2 pF
  • Low input leakage: 0.5 pA
  • Low charge injection: 0.51 pC
  • Rail-to-rail operation
  • Low on-resistance: 120 Ω
  • Fast switch turn-on time: 68 ns
  • Break-before-make switching (TMUX6123)
  • SELx pin connectable to VDD with integrated pull-down
  • Logic levels: 2 V to VDD
  • Low supply current: 16 µA
  • Human Body Model (HBM) ESD protection: ± 2 kV on all pins
  • Industry-standard VSSOP package
  • Wide supply range: ±5 V to ±16.5 V (dual) or 10 V to 16.5 V (single)
  • Latch-up performance meets 100 mA per JESD78 Class II Level A on all pins
  • Low on-capacitance: 4.2 pF
  • Low input leakage: 0.5 pA
  • Low charge injection: 0.51 pC
  • Rail-to-rail operation
  • Low on-resistance: 120 Ω
  • Fast switch turn-on time: 68 ns
  • Break-before-make switching (TMUX6123)
  • SELx pin connectable to VDD with integrated pull-down
  • Logic levels: 2 V to VDD
  • Low supply current: 16 µA
  • Human Body Model (HBM) ESD protection: ± 2 kV on all pins
  • Industry-standard VSSOP package

The TMUX6121, TMUX6122, and TMUX6123 are modern complementary metal-oxide semiconductor (CMOS) devices that have two independently selectable single-pole, single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.

The switches are turned on with Logic 1 on the digital control inputs in the TMUX6121. Logic 0 is required to turn on switches in the TMUX6122. The TMUX6123 has one switch with similar digital control logic to the TMUX6121 while the logic is inverted on the other switch. The TMUX6123 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.

The TMUX6121, TMUX6122, and TMUX6123 are part of the precision switches and multiplexers family of devices. The devices have very low leakage current and low charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 16 µA enables the device usage in portable applications.

The TMUX6121, TMUX6122, and TMUX6123 are modern complementary metal-oxide semiconductor (CMOS) devices that have two independently selectable single-pole, single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.

The switches are turned on with Logic 1 on the digital control inputs in the TMUX6121. Logic 0 is required to turn on switches in the TMUX6122. The TMUX6123 has one switch with similar digital control logic to the TMUX6121 while the logic is inverted on the other switch. The TMUX6123 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.

The TMUX6121, TMUX6122, and TMUX6123 are part of the precision switches and multiplexers family of devices. The devices have very low leakage current and low charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 16 µA enables the device usage in portable applications.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 5
Typ Titel Datum
* Data sheet TMUX612x ±16.5-V, Low-Capacitance, Low-Leakage-Current, Precision, Dual SPST Switches datasheet (Rev. A) PDF | HTML 26 Jul 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Guarding in Multiplexer Applications PDF | HTML 13 Mai 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dez 2021
Application note System Level Protection for High Voltage Analog Multiplexers 03 Jan 2017

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Schnittstellenadapter

LEADED-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zur schnellen Prüfung der 5-, 8-, 10-, 16- und 24-poligen

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Benutzerhandbuch: PDF
Simulationsmodell

TMUX6121 IBIS Model

SCDM206.ZIP (14 KB) - IBIS Model
Gehäuse Pins Herunterladen
VSSOP (DGS) 10 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos