Produktdetails

Protocols Composite, RGB Configuration 1:2 SPDT Number of channels 4 Bandwidth (MHz) 250 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 4 Ron (typ) (mΩ) 3000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -87 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5.5 CON (typ) (pF) 16.5 Off isolation (typ) (dB) -54 OFF-state leakage current (max) (µA) 10 Propagation delay time (µs) 0.006 Ron (max) (mΩ) 10000 Turnoff time (disable) (max) (ns) 5.9 Turnon time (enable) (max) (ns) 6 VIH (min) (V) 2 VIL (max) (V) 0.8
Protocols Composite, RGB Configuration 1:2 SPDT Number of channels 4 Bandwidth (MHz) 250 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 4 Ron (typ) (mΩ) 3000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -87 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5.5 CON (typ) (pF) 16.5 Off isolation (typ) (dB) -54 OFF-state leakage current (max) (µA) 10 Propagation delay time (µs) 0.006 Ron (max) (mΩ) 10000 Turnoff time (disable) (max) (ns) 5.9 Turnon time (enable) (max) (ns) 6 VIH (min) (V) 2 VIL (max) (V) 0.8
SOIC (D) 16 59.4 mm² 9.9 x 6 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Low Differential Gain and Phase
    (Typical DG = 0.24%, Typical DP = 0.039°)
  • Wide Bandwidth (Typical BW > 288 MHz)
  • Low Cross-Talk (Typical XTALK = –87 dB)
  • Low Power Consumption
    (Maximum ICC = 3 µA)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (Typical rON = 3 )
  • VCC Operating Range From 4.5 V to 5.5 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite Video Switching

  • Low Differential Gain and Phase
    (Typical DG = 0.24%, Typical DP = 0.039°)
  • Wide Bandwidth (Typical BW > 288 MHz)
  • Low Cross-Talk (Typical XTALK = –87 dB)
  • Low Power Consumption
    (Maximum ICC = 3 µA)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (Typical rON = 3 )
  • VCC Operating Range From 4.5 V to 5.5 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite Video Switching

The TS5V330C is a 4-bit 1-of-2 multiplexer/demultiplexer video switch with a single switch-enable (EN) input. The select (IN) input controls the data path of the multiplexer/demultiplexer. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and a high impedance state exists between the D and S ports.

Low differential gain and phase makes this switch ideal for video applications. The device has a wide bandwidth and low cross talk which makes it suitable for high frequency video applications. The device can be used for RGB and composite video switching applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The TS5V330C is a 4-bit 1-of-2 multiplexer/demultiplexer video switch with a single switch-enable (EN) input. The select (IN) input controls the data path of the multiplexer/demultiplexer. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and a high impedance state exists between the D and S ports.

Low differential gain and phase makes this switch ideal for video applications. The device has a wide bandwidth and low cross talk which makes it suitable for high frequency video applications. The device can be used for RGB and composite video switching applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 3
Typ Titel Datum
* Data sheet 4 Bit 1-of-2 FET Multiplexer/Demultiplexer datasheet (Rev. B) 03 Dez 2009
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Schnittstellenadapter

LEADED-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zur schnellen Prüfung der 5-, 8-, 10-, 16- und 24-poligen

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Benutzerhandbuch: PDF
Gehäuse Pins Herunterladen
SOIC (D) 16 Optionen anzeigen
SSOP (DBQ) 16 Optionen anzeigen
TSSOP (PW) 16 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos