This eight-diode array is designed for high-current, low duty-cycle applications typical of flyback voltage clamping for inductive loads. The dual bridge connection makes this device particularly applicable to bipolar driven stepper motors.
The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.
This single monolithic chip is fabricated in both hermetic CERDIP and copper-leaded plastic packages. The UC1610 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability. The UC2610 in plastic and ceramic is designed for -25°C to 125°C environments also with reduced peak current capability; while the UC3610 in plastic has higher current rating over a 0°C to 70°C temperature range.
| Typ | Titel | Datum | ||
|---|---|---|---|---|
| * | Data sheet | Dual Schottky Diode Bridge datasheet (Rev. B) | 07 Dez 2004 | |
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 18 Aug 2022 | |
| User guide | Generic ESD Evaluation Module User's Guide (Rev. A) | PDF | HTML | 27 Sep 2021 |
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<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
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| Gehäuse | Pins | Herunterladen |
|---|---|---|
| PDIP (P) | 8 | Optionen anzeigen |
| SOIC (DW) | 16 | Optionen anzeigen |
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