Inicio Microcontroladores (MCU) y procesadores Procesadores basados en Arm
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Microcontroladores (MCU) y procesadores
Procesadores basados en Arm

66AK2E05

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DSP+Arm multinúcleo de alto rendimiento: 4x Arm, núcleos A15, 1x C66x DSP núcleo, NetCP, 10 GbE

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66AK2E05

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Detalles del producto

Arm CPU 4 Arm Cortex-A15 Arm (max) (MHz) 1250, 1400 Coprocessors C66x DSP CPU 32-bit Protocols Ethernet Ethernet MAC 2-Port 10Gb switch, 8-Port 1Gb switch PCIe 4 PCIe Gen 2 Hardware accelerators Packet Accelerator, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptography, Device identity, Secure boot Rating Catalog Operating temperature range (°C) -40 to 100
Arm CPU 4 Arm Cortex-A15 Arm (max) (MHz) 1250, 1400 Coprocessors C66x DSP CPU 32-bit Protocols Ethernet Ethernet MAC 2-Port 10Gb switch, 8-Port 1Gb switch PCIe 4 PCIe Gen 2 Hardware accelerators Packet Accelerator, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptography, Device identity, Secure boot Rating Catalog Operating temperature range (°C) -40 to 100
FCBGA (ABD) 1089 729 mm² 27 x 27
  • ARM® Cortex®-A15 MPCore™
    CorePac
    • Up to Four ARM Cortex-A15 Processor Cores at
      up to 1.4-GHz
    • 4MB L2 Cache Memory Shared by all Cortex-
      A15 Processor Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC (Multicore
      Shared Memory Controller) for Low Latency
      Access to SRAM and DDR3
  • One TMS320C66x DSP Core Subsystem (C66x
    CorePacs), Each With
    • 1.4 GHz C66x Fixed/Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @
        1.2 GHz
    • Memory
      • 32K Byte L1P Per CorePac
      • 32K Byte L1D Per CorePac
      • 512K Byte Local L2 Per CorePac
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory Shared by DSP CorePacs
      and ARM CorePac
    • Memory Protection Unit for Both SRAM and
      DDR3_EMIF
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • One Packet-Based DMA Engine for Zero-
      Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP,
        PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP and WiMAX
        Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM,
        HMAC, CMAC, GMAC, AES, DES, 3DES,
        Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit
        Hash), MD5
      • Up to 6.4 Gbps IPSec and 3 Gbps Air
        Ciphering
    • Ethernet Subsystem
      • Eight SGMII Ports with Wire Rate Switching
      • IEEE1588 v2 (with Annex D/E/F) Support
      • 8 Gbps Total Ingress/Egress Ethernet BW
        from Core
      • Audio/Video Bridging (802.1Qav/D6.0)
      • QOS Capability
      • DSCP Priority Mapping
  • Peripherals
    • Two PCIe Gen2 Controllers with Support for
      • Two Lanes per Controller
      • Supports Up to 5 GBaud
    • One HyperLink
      • Supports Connections to Other KeyStone
        Architecture Devices Providing Resource
        Scalability
      • Supports Up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem
      • Two SGMII/XFI Ports with Wire Rate
        Switching and MACSEC Support
      • IEEE1588 v2 (with Annex D/E/F) Support
    • One 72-Bit DDR3/DDR3L Interface with Speeds
      Up to 1600 MTPS in DDR3 Mode
    • EMIF16 Interface
    • Two USB 2.0/3.0 Controllers
    • USIM Interface
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • One TSIP
      • Support 1024 DS0s
      • Support 2 Lanes at 32.768/16.3848.192
        Mbps Per Lane
  • System Resources
    • Three On-Chip PLLs
    • SmartReflex Automatic Voltage Scaling
    • Semaphore Module
    • Thirteen 64-Bit Timers
    • Five Enhanced Direct Memory Access (EDMA)
      Modules
  • Commercial Case Temperature:
    • 0°C to 85°C
  • Extended Case Temperature:
    • –40°C to 100°C
  • ARM® Cortex®-A15 MPCore™
    CorePac
    • Up to Four ARM Cortex-A15 Processor Cores at
      up to 1.4-GHz
    • 4MB L2 Cache Memory Shared by all Cortex-
      A15 Processor Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC (Multicore
      Shared Memory Controller) for Low Latency
      Access to SRAM and DDR3
  • One TMS320C66x DSP Core Subsystem (C66x
    CorePacs), Each With
    • 1.4 GHz C66x Fixed/Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @
        1.2 GHz
    • Memory
      • 32K Byte L1P Per CorePac
      • 32K Byte L1D Per CorePac
      • 512K Byte Local L2 Per CorePac
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory Shared by DSP CorePacs
      and ARM CorePac
    • Memory Protection Unit for Both SRAM and
      DDR3_EMIF
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • One Packet-Based DMA Engine for Zero-
      Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP,
        PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP and WiMAX
        Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM,
        HMAC, CMAC, GMAC, AES, DES, 3DES,
        Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit
        Hash), MD5
      • Up to 6.4 Gbps IPSec and 3 Gbps Air
        Ciphering
    • Ethernet Subsystem
      • Eight SGMII Ports with Wire Rate Switching
      • IEEE1588 v2 (with Annex D/E/F) Support
      • 8 Gbps Total Ingress/Egress Ethernet BW
        from Core
      • Audio/Video Bridging (802.1Qav/D6.0)
      • QOS Capability
      • DSCP Priority Mapping
  • Peripherals
    • Two PCIe Gen2 Controllers with Support for
      • Two Lanes per Controller
      • Supports Up to 5 GBaud
    • One HyperLink
      • Supports Connections to Other KeyStone
        Architecture Devices Providing Resource
        Scalability
      • Supports Up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem
      • Two SGMII/XFI Ports with Wire Rate
        Switching and MACSEC Support
      • IEEE1588 v2 (with Annex D/E/F) Support
    • One 72-Bit DDR3/DDR3L Interface with Speeds
      Up to 1600 MTPS in DDR3 Mode
    • EMIF16 Interface
    • Two USB 2.0/3.0 Controllers
    • USIM Interface
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • One TSIP
      • Support 1024 DS0s
      • Support 2 Lanes at 32.768/16.3848.192
        Mbps Per Lane
  • System Resources
    • Three On-Chip PLLs
    • SmartReflex Automatic Voltage Scaling
    • Semaphore Module
    • Thirteen 64-Bit Timers
    • Five Enhanced Direct Memory Access (EDMA)
      Modules
  • Commercial Case Temperature:
    • 0°C to 85°C
  • Extended Case Temperature:
    • –40°C to 100°C

The 66AK2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor single-core or quad-core CorePac and C66x DSP core, that can run at a core speed of up to 1.4 GHz. TI’s 66AK2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), C66x CorePac, network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

TI’s C66x core launches a new era of DSP technology by combining fixed-point and floating point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). It can execute 8 single precision floating point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE754 compliant. For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64×+ cores. The C66x CorePac incorporates 90 new instructions targeted for floating point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backwards code compatible with TI'’s previous generation C6000 fixed and floating point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.

The 66AK2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. In the DSP CorePac, in addition to 32KB of L1 program and 32KB of L1 data cache, there is 512KB of dedicated memory per core that can be configured as cache or as memory mapped RAM. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.

The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.

The 66AK2E0x is a high performance device based on TI’s KeyStone II Multicore SoC Architecture, incorporating the most performance-optimized Cortex-A15 processor single-core or quad-core CorePac and C66x DSP core, that can run at a core speed of up to 1.4 GHz. TI’s 66AK2E0x device enables a high performance, power-efficient and easy to use platform for developers of a broad range of applications such as enterprise grade networking end equipment, data center networking, avionics and defense, medical imaging, test and automation.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (for example, ARM CorePac (Cortex-A15 Processor Quad Core CorePac), C66x CorePac, network processing, and uses a queue-based communication system that allows the device resources to operate efficiently and seamlessly. This unique device architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

TI’s C66x core launches a new era of DSP technology by combining fixed-point and floating point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). It can execute 8 single precision floating point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE754 compliant. For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64×+ cores. The C66x CorePac incorporates 90 new instructions targeted for floating point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backwards code compatible with TI'’s previous generation C6000 fixed and floating point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.

The 66AK2E0x KeyStone II device integrates a large amount of on-chip memory. The Cortex-A15 processor cores each have 32KB of L1Data and 32KB of L1 Instruction cache. The up to four Cortex A15 cores in the ARM CorePac share a 4MB L2 Cache. In the DSP CorePac, in addition to 32KB of L1 program and 32KB of L1 data cache, there is 512KB of dedicated memory per core that can be configured as cache or as memory mapped RAM. The device also integrates 2MB of Multicore Shared Memory (MSMC) that can be used as a shared L3 SRAM. All L2 and MSMC memories incorporate error detection and error correction. For fast access to external memory, this device includes a 64-bit DDR-3 (72-bit with ECC support) external memory interface (EMIF) running at 1600 MTPS.

The device enables developers to use a variety of development and debugging tools that include GNU GCC, GDB, Open source Linux, Eclipse based debugging environment enabling kernel and user space debugging using a variety of Eclipse plug-ins including TI's industry leading IDE Code Composer Studio.
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Documentación técnica

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Tipo Título Fecha
* Data sheet 66AK2E05/02 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet (Rev. D) 11 mar 2015
* Errata 66AK2E05/02 KeyStone SoC Silicon Errata (Silicon Rev 1.0) (Rev. B) 20 ago 2015
User guide ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Z) PDF | HTML 30 mar 2023
User guide ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. W) PDF | HTML 30 mar 2023
Application note DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 07 jul 2022
Application note Keystone Error Detection and Correction EDC ECC (Rev. A) 25 jun 2021
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 19 may 2021
Application note Using Arm ROM Bootloader on Keystone II Devices PDF | HTML 04 jun 2019
User guide ARM Assembly Language Tools v19.6.0.STS User's Guide (Rev. X) 03 jun 2019
User guide ARM Optimizing C/C++ Compiler v19.6.0.STS User's Guide (Rev. U) 03 jun 2019
Application note Keystone Multicore Device Family Schematic Checklist PDF | HTML 17 may 2019
Application note KeyStone II DDR3 interface bring-up 07 mar 2019
User guide ARM Assembly Language Tools v18.12.0.LTS User's Guide (Rev. W) 19 nov 2018
User guide ARM Optimizing C/C++ Compiler v18.12.0.LTS User's Guide (Rev. T) 19 nov 2018
User guide ARM Assembly Language Tools v18.1.0.LTS User's Guide (Rev. U) 16 ene 2018
User guide ARM Optimizing C/C++ Compiler v18.1.0.LTS User's Guide (Rev. R) 16 ene 2018
White paper POWERLINK on TI Sitara Processors (Rev. A) 10 ene 2018
User guide ARM Assembly Language Tools v17.9.0.STS User's Guide (Rev. T) 30 sep 2017
User guide ARM Optimizing C/C++ Compiler v17.9.0.STS User's Guide (Rev. Q) 30 sep 2017
User guide KeyStone II Architecture Universal Serial Bus 3.0 (USB 3.0) (Rev. A) 21 ago 2017
Application note Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 14 ago 2017
User guide Phase-Locked Loop (PLL) for KeyStone Devices User's Guide (Rev. I) 26 jul 2017
User guide ARM Assembly Language Tools v17.6.0.STS User's Guide (Rev. S) 21 jun 2017
User guide ARM Optimizing C/C++ Compiler v17.6.0.STS User's Guide (Rev. P) 21 jun 2017
Application note Power Consumption Summary for K2E System-on-Chip (SoC) Device Family 14 jun 2017
Application note PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A) 19 may 2017
Application note Processor SDK RTOS Audio Benchmark Starter Kit 12 abr 2017
Application note Clocking Spreadsheet for K2E Device Family 26 ene 2017
User guide Serializer/Deserializer (SerDes) for KeyStone II Devices User Guide (Rev. A) 27 jul 2016
Application note Power Management of KS2 Device (Rev. C) 15 jul 2016
User guide ARM Assembly Language Tools v16.9.0.LTS User's Guide (Rev. P) 30 abr 2016
User guide ARM Optimizing C/C++ Compiler v16.9.0.LTS User's Guide (Rev. M) 30 abr 2016
Application note SERDES Link Commissioning on KeyStone I and II Devices 13 abr 2016
Application note TI DSP Benchmarking 13 ene 2016
Application note Throughput Performance Guide for KeyStone II Devices (Rev. B) 22 dic 2015
Application note Keystone II DDR3 Debug Guide 16 oct 2015
White paper Making your search SIMPLE, even when your ideas are complex 10 ago 2015
White paper Processing solutions for biometric systems 30 jun 2015
White paper Quality of service on Keystone II architecture 07 may 2015
User guide Enhanced Direct memory Access 3 (EDMA3) for KeyStone Devices User's Guide (Rev. B) 06 may 2015
User guide Gigabit Ethernet (GbE) Switch SS for K2E & K2L Devices User's Guide (Rev. A) 28 abr 2015
User guide Multicore Navigator (CPPI) for KeyStone Architecture User's Guide (Rev. H) PDF | HTML 09 abr 2015
User guide DDR3 Memory Controller for KeyStone II Devices User's Guide (Rev. C) 27 mar 2015
White paper Save power and costs with TI's K2E on-chip networking features 25 mar 2015
Application note Keystone II DDR3 Initialization 26 ene 2015
User guide ARM Assembly Language Tools v5.2 User's Guide (Rev. M) 05 nov 2014
User guide ARM Optimizing C/C++ Compiler v5.2 User's Guide (Rev. J) 05 nov 2014
User guide Power Sleep Controller (PSC) for KeyStone Devices User's Guide (Rev. C) 04 sep 2014
Product overview 66AK2Ex KeyStone Multicore DSP+ARM(R) System-on-Chips (Rev. A) 03 sep 2014
White paper KeyStone™-II-based processors: 10G Ethernet as an optical interface 25 ago 2014
User guide Packet Accelerator 2 (PA2) for K2E and K2L Devices User's Guide 19 ago 2014
User guide Security Accelerator 2 (SA2) for K2E and K2L Devices User's Guide 19 ago 2014
White paper Differentiating AM5K2E02 and AM5K2E04 SoCs from Alternate ARM® Cortex®-A15 Devic 14 ago 2014
User guide Network Coprocessor (NETCP) for K2E and K2L Devices User's Guide 13 ago 2014
Application note Hardware Design Guide for KeyStone II Devices 24 mar 2014
Product overview The Case for 10G Ethernet in Embedded Processing 13 nov 2013
User guide PCI Express (PCIe) for KeyStone Devices User's Guide (Rev. D) 30 sep 2013
User guide Debug and Trace for KeyStone II Devices User's Guide 26 jul 2013
User guide ARM Bootloader User Guide for KeyStone II Devices 21 jul 2013
User guide DSP Bootloader for KeyStone Architecture User's Guide (Rev. C) 15 jul 2013
User guide C66x CorePac User's Guide (Rev. C) 28 jun 2013
User guide Memory Protection Unit (MPU) for KeyStone Devices User's Guide (Rev. A) 28 jun 2013
User guide HyperLink for KeyStone Devices User's Guide (Rev. C) 28 may 2013
User guide 10 Gigabit Ethernet Switch Subsystem User Guide for KeyStone II Devices 08 feb 2013
User guide Multicore Shared Memory Controller (MSMC) User Guide for KeyStone II Devices 12 nov 2012
Product overview Industrial Imaging: Applications of the K2H and K2E platforms 09 nov 2012
Product overview Video Infrastructure - Applications of the K2E, K2H platforms 09 nov 2012
User guide ARM CorePac User Guide for KeyStone II Devices 31 oct 2012
Application note Multicore Programming Guide (Rev. B) 29 ago 2012
User guide Serial Peripheral Interface (SPI) for KeyStone Devices User’s Guide (Rev. A) 30 mar 2012
User guide Chip Interrupt Controller (CIC) for KeyStone Devices User's Guide (Rev. A) 27 mar 2012
User guide 64-Bit Timer (Timer64) for KeyStone Devices User's Guide (Rev. A) 22 mar 2012
Application note PCIe Use Cases for KeyStone Devices 13 dic 2011
Application note Introduction to TMS320C6000 DSP Optimization 06 oct 2011
User guide Inter-Integrated Circuit (I2C) for KeyStone Devices User's Guide 02 sep 2011
User guide External Memory Interface (EMIF16) for KeyStone Devices User's Guide (Rev. A) 24 may 2011
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 19 may 2011
User guide C66x CPU and Instruction Set Reference Guide 09 nov 2010
User guide C66x DSP Cache User's Guide 09 nov 2010
Application note Clocking Design Guide for KeyStone Devices 09 nov 2010
User guide General-Purpose Input/Output (GPIO) forKeyStone Devices User's Guide 09 nov 2010
Application note Optimizing Loops on the C66x DSP 09 nov 2010
User guide Telecom Serial Interface Port (TSIP) for KeyStone Devices User's Guide 09 nov 2010
User guide Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices UG 09 nov 2010

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Sonda de depuración

TMDSEMU200-U — Sonda de depuración XDS200 USB

El XDS200 es una sonda de depuración (emulador) que se utiliza para depurar dispositivos integrados de TI. El XDS200 presenta un equilibrio de bajo costo con buen rendimiento en comparación con el XDS110 de bajo costo y el XDS560v2 de alto rendimiento. Es compatible con una amplia (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-U — Sonda de depuración USB de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Kit de desarrollo

EVMK2EX — Placa de desarrollo K2E

The EVMK2EX is a full-featured development tool for 66AK2Exx and AM5K2Exx KeyStone II based SoCs. Get started developing general purpose embedded computing systems for industrial, mission critical, and networking applications today with this double-wide AMC form-factor evaluation board featuring a (...)

Guía del usuario: PDF
No disponible en TI.com
Kit de desarrollo de software (SDK)

BIOSLINUXMCSDK-K2 — MCSDK supporting SYS/BIOS RTOS and Linux OS for KeyStone II ARM A15 + DSP C66x

NOTE: K2x, C665x and C667x devices are now actively maintained on the Processor-SDK release stream. See links above.

Our Multicore Software Development Kits (MCSDK) provide highly-optimized bundles of foundational, platform-specific drivers to enable development on selected TI ARM and DSP devices. (...)

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-LINUX-RT-K2E — Linux-RT Processor SDK for K2E

 

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RTOS-K2E — RTOS Processor SDK for K2E

 

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Kit de desarrollo de software (SDK)

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Ejemplo de código o demostración

DEMOVIDEO-MULTICORE — Demostración de infraestructura de video multinúcleo para kit de desarrollo de software multinúcleo

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Controlador o biblioteca

FFTLIB — Biblioteca FFT para dispositivos de punto flotante

The Texas Instruments FFT library is an optimized floating-point math function library for computing the discrete Fourier transform (DFT).
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Controlador o biblioteca

MATHLIB — Biblioteca matemática DSP para dispositivos de punto flotante

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
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Controlador o biblioteca

SPRC264 — TMS320C5000/6000 Biblioteca de imágenes (IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Guía del usuario: PDF
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Controlador o biblioteca

SPRC265 — TMS320C6000 Biblioteca DSP (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Guía del usuario: PDF
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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

Productos y hardware compatibles

Productos y hardware compatibles

Este recurso de diseño es compatible con la mayoría de los productos de estas categorías.

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Códec de software

C66XCODECS — CÓDECS (video, voz) para dispositivos basados en C66x

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)
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Modelo de simulación

66AK2E05 66AK2E02 ABD IBIS Model

SPRM611.ZIP (2180 KB) - IBIS Model
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Modelo de simulación

66AK2E05 66AK2E02 ABD BSDL Model

SPRM612.ZIP (28 KB) - BSDL Model
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Modelo de simulación

66AK2E05 66AK2E02 ABD Thermal Model

SPRM613.ZIP (5 KB) - Thermal Model
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Modelo de simulación

66AK2E05 and 66AK2E02 Power Consumption Model (Rev. A)

SPRM652A.ZIP (143 KB) - Power Model
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Modelo de simulación

KeyStone II IBIS AMI Models

SPRM743.ZIP (265889 KB) - IBIS-AMI Model
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Esquema

66AK2E05 66AK2E02 AM5K2E04 AM5K2E02 ABD OrCAD Symbols

SPRR197.ZIP (99 KB)
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Diseños de referencia

TIDEP0042 — Diseño de referencia de generación de tensión de núcleo AVS SmartReflex para K2E con TPS544C25 y PMB

The K2E requires the use of AVS SmartReflex control for the CVDD core voltage. This design provides method of generating the proper voltage using software and the PMBus interface of the TPS544C25. The circuit can be implemented on the XEVMK2EX.
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDEP0041 — Diseño de referencia de generación de tensión de núcleo AVS SmartReflex, PMBus para K2E

The K2E requires the use of AVS SmartReflex control for the CVDD core voltage. This design provides method of generating the proper voltage without the need for any software. The circuit is currently implemented on the XEVMK2EX.
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDEP0031 — Secuenciación de potencia para K2E mediante UCD9090 con PMBus

The K2E devices require power supplies to be sequenced in a proper order. This design demonstrates power sequencing for the 66AK2Ex and AM5K2Ex families of KeyStone II ARM+DSP and ARM-only multicore processors by use of the UCD9090. The UCD9090 is a 10-rail PMBus/I2C addressable power-supply (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDEP0026 — Diseño de referencia de generación de reloj K2E

A single clock source should not be used to drive multiple clock inputs for a high-performance processor device, such as multicore ARM Cortex-A15 based 66AK2Ex and AM5K2Ex processors, since excessive loading, reflections, and noise will negatively impact performance. These can be avoided through (...)
Design guide: PDF
Esquema: PDF
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FCBGA (ABD) 1089 Ultra Librarian
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  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
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