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Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 1000 CPU 32-bit Display type 1 LCD Protocols Ethernet Hardware accelerators Image/Video Extension Operating system Linux, RTOS Security Cryptography Rating Catalog Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 1000 CPU 32-bit Display type 1 LCD Protocols Ethernet Hardware accelerators Image/Video Extension Operating system Linux, RTOS Security Cryptography Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

  • AM3715, AM3703 Sitara ARM Microprocessors:
    • Compatible to OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 1-GHz Sitara™ ARM® Cortex™-A8 Core Also supports 300, 600, and 800-MHz operation
      • NEON SIMD Coprocessor
    • POWERVR SGX™ Graphics Accelerator (AM3715 only)
      • Tile Based Architecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
  • External Memory Interfaces:
    • SDRAM Controller (SDRC)
      • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
      • Interfaces to Low-Power SDRAM
      • SDRAM Memory Scheduler (SMS) and Rotation Engine
    • General Purpose Memory Controller (GPMC)
      • 16-bit Wide Multiplexed Address/Data Bus
      • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
      • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd.

OMAP is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

  • A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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모두 보기23
유형 직함 날짜
* Data sheet AM3715, AM3703 Sitara ARM Microprocessors datasheet (Rev. F) 2011/08/29
* Errata AM3715, AM3703 Microprocessors Silicon Errata (Silicon Revisions 1.2 1.1 & 1.0) (Rev. F) 2014/02/13
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012/09/24
More literature From Start to Finish: A Product Development Roadmap for Sitara™ Processors 2020/12/16
Application note (Cancelled - see the B revision, create by mistake 14-may-2009) (Rev. C) PDF | HTML 2020/03/03
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 2019/03/20
User guide How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 2018/09/24
More literature Ethernet Connectivity via GPMC 2018/07/06
More literature AM37x/DM37x Schematic Checklist 2018/07/06
More literature AM37x EVM Software Developer's Guide 2018/07/06
Technical article Spring has sprung. A sale has sprung. PDF | HTML 2016/04/04
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013/11/01
White paper AM37x power-saving techniques lead to ultra-low-power for battery-operated appli 2013/04/08
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012/09/10
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011/06/15
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010/06/23
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010/06/23
Application note AM/DM37x Power Estimation Spreadsheet 2010/06/07
Application note AM/DM37x Overview 2010/06/03
Application note AM3715/03 Memory Subsystem 2010/06/03
Application note AM37x CUS Routing Guidelines 2010/06/03
Application note Migrating from OMAP3530 to AM37x 2010/06/03
Application note Setting up AM37x SDRC Registers 2010/06/03

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  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
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