產品詳細資料

Arm CPU 1 Arm9 Arm (max) (MHz) 200 Coprocessors C674x DSP CPU 32-bit Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection, Secure boot Rating Catalog Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm9 Arm (max) (MHz) 200 Coprocessors C674x DSP CPU 32-bit Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection, Secure boot Rating Catalog Operating temperature range (°C) -40 to 105
NFBGA (ZWT) 361 256 mm² 16 x 16
  • Dual-Core SoC
    • 200-MHz ARM926EJ-S RISC MPU
    • 200-MHz C674x Fixed- and Floating-Point VLIW DSP
  • ARM926EJ-S Core
    • 32- and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single-Cycle MAC
    • ARM Jazelle Technology
    • Embedded ICE-RT for Real-Time Debug
  • ARM9 Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 1600 MIPS and 1200 MFLOPS
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units:
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP × SP → SP Per Clock
        • 2 SP × SP → DP Every Two Clocks
        • 2 SP × DP → DP Every Three Clocks
        • 2 DP × DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 × 32-Bit Multiplies, Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSPBIOS
    • Chip Support Library and DSP Library
  • 128KB of RAM Shared Memory
  • 1.8-V or 3.3-V LVCMOS I/Os (Except for USB and DDR2 Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM With 128-MB Address Space
    • DDR2/Mobile DDR Memory Controller With one of the Following:
      • 16-Bit DDR2 SDRAM With 256-MB Address Space
      • 16-Bit mDDR SDRAM With 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • Two Serial Peripheral Interfaces (SPIs) Each With Multiple Chip Selects
  • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interfaces With Secure Data I/O (SDIO) Interfaces
  • Two Master and Slave Inter-Integrated Circuits
    (I2C Bus™)
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Real-Time Unit (PRU) Cores
      • 32-Bit Load-Store RISC Architecture
      • 4KB of Instruction RAM Per Core
      • 512 Bytes of Data RAM Per Core
      • PRUSS can be Disabled Through Software to Save Power
      • Register 30 of Each PRU is Exported From the Subsystem in Addition to the Normal R31 Output of the PRU Cores.
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1, 2, 3, and 4 (Control, Bulk, Interrupt, or ISOC) RX and TX
  • One Multichannel Audio Serial Port (McASP):
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO Buffers for Transmit and Receive
  • Two Multichannel Buffered Serial Ports (McBSPs):
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-Channel TDM
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant
    • MII Media-Independent Interface
    • RMII Reduced Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Real-Time Clock (RTC) With 32-kHz Oscillator and Separate Power Rail
  • Three 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose or Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Two Enhanced High-Resolution Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge Outputs, 6 Dual-Edge Symmetric Outputs, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Packages:
    • 361-Ball Pb-Free PBGA [ZWT Suffix],
      0.80-mm Ball Pitch
  • Commercial or Extended Temperature

All trademarks are the property of their respective owners.

  • Dual-Core SoC
    • 200-MHz ARM926EJ-S RISC MPU
    • 200-MHz C674x Fixed- and Floating-Point VLIW DSP
  • ARM926EJ-S Core
    • 32- and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single-Cycle MAC
    • ARM Jazelle Technology
    • Embedded ICE-RT for Real-Time Debug
  • ARM9 Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 1600 MIPS and 1200 MFLOPS
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units:
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP × SP → SP Per Clock
        • 2 SP × SP → DP Every Two Clocks
        • 2 SP × DP → DP Every Three Clocks
        • 2 DP × DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 × 32-Bit Multiplies, Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSPBIOS
    • Chip Support Library and DSP Library
  • 128KB of RAM Shared Memory
  • 1.8-V or 3.3-V LVCMOS I/Os (Except for USB and DDR2 Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM With 128-MB Address Space
    • DDR2/Mobile DDR Memory Controller With one of the Following:
      • 16-Bit DDR2 SDRAM With 256-MB Address Space
      • 16-Bit mDDR SDRAM With 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • Two Serial Peripheral Interfaces (SPIs) Each With Multiple Chip Selects
  • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interfaces With Secure Data I/O (SDIO) Interfaces
  • Two Master and Slave Inter-Integrated Circuits
    (I2C Bus™)
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Real-Time Unit (PRU) Cores
      • 32-Bit Load-Store RISC Architecture
      • 4KB of Instruction RAM Per Core
      • 512 Bytes of Data RAM Per Core
      • PRUSS can be Disabled Through Software to Save Power
      • Register 30 of Each PRU is Exported From the Subsystem in Addition to the Normal R31 Output of the PRU Cores.
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1, 2, 3, and 4 (Control, Bulk, Interrupt, or ISOC) RX and TX
  • One Multichannel Audio Serial Port (McASP):
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO Buffers for Transmit and Receive
  • Two Multichannel Buffered Serial Ports (McBSPs):
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-Channel TDM
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant
    • MII Media-Independent Interface
    • RMII Reduced Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Real-Time Clock (RTC) With 32-kHz Oscillator and Separate Power Rail
  • Three 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose or Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Two Enhanced High-Resolution Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge Outputs, 6 Dual-Edge Symmetric Outputs, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Packages:
    • 361-Ball Pb-Free PBGA [ZWT Suffix],
      0.80-mm Ball Pitch
  • Commercial or Extended Temperature

All trademarks are the property of their respective owners.

The OMAP-L132 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-, 16-, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM9 core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM9 core has separate 16-KB instruction and 16-KB data caches. Both caches are 4-way associative with virtual index virtual tag (VIVT). The ARM9 core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a
32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by the ARM9 and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

For security-enabled devices, TI’s Basic Secure Boot lets users protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust," the secure boot flow ensures a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port can be enabled during the secure boot process during application development. The boot modules are encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. Encryption and decryption protects customers’ IP and lets them securely set up the system and begin device operation with known, trusted code.

Basic Secure Boot uses either SHA-1 or SHA-256, and AES-128 for boot image validation. Basic Secure Boot also uses AES-128 for boot image encryption. The secure boot flow employs a multilayer encryption scheme which not only protects the boot process but also offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect customer encryption keys. When an update is needed, the customer creates a new encrypted image. Then the device can acquire the image through an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, see the .

The peripheral set includes: a 10/100 Mbps Ethernet media access controller (EMAC) with a management data input/output (MDIO) module; one USB2.0 OTG interface; two I2C Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSPs) with FIFO buffers; two serial peripheral interfaces (SPIs) with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as a watchdog); a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

The EMAC provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM9 and DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

The OMAP-L132 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-, 16-, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM9 core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM9 core has separate 16-KB instruction and 16-KB data caches. Both caches are 4-way associative with virtual index virtual tag (VIVT). The ARM9 core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a
32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by the ARM9 and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

For security-enabled devices, TI’s Basic Secure Boot lets users protect proprietary intellectual property and prevents external entities from modifying user-developed algorithms. By starting from a hardware-based “root-of-trust," the secure boot flow ensures a known good starting point for code execution. By default, the JTAG port is locked down to prevent emulation and debug attacks; however, the JTAG port can be enabled during the secure boot process during application development. The boot modules are encrypted while sitting in external nonvolatile memory, such as flash or EEPROM, and are decrypted and authenticated when loaded during secure boot. Encryption and decryption protects customers’ IP and lets them securely set up the system and begin device operation with known, trusted code.

Basic Secure Boot uses either SHA-1 or SHA-256, and AES-128 for boot image validation. Basic Secure Boot also uses AES-128 for boot image encryption. The secure boot flow employs a multilayer encryption scheme which not only protects the boot process but also offers the ability to securely upgrade boot and application software code. A 128-bit device-specific cipher key, known only to the device and generated using a NIST-800-22 certified random number generator, is used to protect customer encryption keys. When an update is needed, the customer creates a new encrypted image. Then the device can acquire the image through an external interface, such as Ethernet, and overwrite the existing code. For more details on the supported security features or TI’s Basic Secure Boot, see the .

The peripheral set includes: a 10/100 Mbps Ethernet media access controller (EMAC) with a management data input/output (MDIO) module; one USB2.0 OTG interface; two I2C Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSPs) with FIFO buffers; two serial peripheral interfaces (SPIs) with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as a watchdog); a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

The EMAC provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM9 and DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

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類型 標題 日期
* Data sheet OMAP-L132 C6000™ DSP+ARM Processor datasheet (Rev. E) PDF | HTML 2017年 1月 31日
* Errata OMAP-L132 C6000 DSP+ARM Processor Errata (Silicon Revisions 2.3, 2.1) (Rev. G) 2014年 3月 21日
* User guide OMAP-L132 C6000 DSP+ARM Processor Technical Reference Manual (Rev. C) 2016年 9月 12日
User guide ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Z) PDF | HTML 2023年 3月 30日
User guide ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. W) PDF | HTML 2023年 3月 30日
Application note OMAPL138/C6748 ROM Bootloader Resources and FAQ (Rev. A) PDF | HTML 2021年 1月 21日
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 2020年 6月 1日
Application note Programming mDDR/DDR2 EMIF on OMAP-L1x/C674x 2019年 12月 20日
User guide L138/C6748 development kit (LCDK) (Rev. A) PDF | HTML 2019年 9月 18日
Application note Using DSPLIB FFT Implementation for Real Input and Without Data Scaling PDF | HTML 2019年 6月 11日
Application note TDA2x/TDA2E Performance (Rev. A) PDF | HTML 2019年 6月 10日
User guide ARM Assembly Language Tools v19.6.0.STS User's Guide (Rev. X) 2019年 6月 3日
User guide ARM Optimizing C/C++ Compiler v19.6.0.STS User's Guide (Rev. U) 2019年 6月 3日
Application note OMAP-L132/L138 Power Consumption Summary 2019年 4月 1日
Application note General Hardware Design/BGA PCB Design/BGA 2019年 2月 22日
Application note OMAP-L13x / C674x / AM1x schematic review guidelines PDF | HTML 2019年 2月 14日
Application note Using the OMAP-L132/L138 Bootloader Application Report (Rev. F) 2019年 1月 22日
Application note McASP Design Guide - Tips, Tricks, and Practical Examples 2019年 1月 10日
User guide ARM Assembly Language Tools v18.12.0.LTS User's Guide (Rev. W) 2018年 11月 19日
User guide ARM Optimizing C/C++ Compiler v18.12.0.LTS User's Guide (Rev. T) 2018年 11月 19日
User guide PRU Assembly Instruction User Guide 2018年 2月 16日
User guide ARM Assembly Language Tools v18.1.0.LTS User's Guide (Rev. U) 2018年 1月 16日
User guide ARM Optimizing C/C++ Compiler v18.1.0.LTS User's Guide (Rev. R) 2018年 1月 16日
User guide ARM Assembly Language Tools v17.9.0.STS User's Guide (Rev. T) 2017年 9月 30日
User guide ARM Optimizing C/C++ Compiler v17.9.0.STS User's Guide (Rev. Q) 2017年 9月 30日
User guide ARM Assembly Language Tools v17.6.0.STS User's Guide (Rev. S) 2017年 6月 21日
User guide ARM Optimizing C/C++ Compiler v17.6.0.STS User's Guide (Rev. P) 2017年 6月 21日
Application note Processor SDK RTOS Audio Benchmark Starter Kit 2017年 4月 12日
User guide ARM Assembly Language Tools v16.9.0.LTS User's Guide (Rev. P) 2016年 4月 30日
User guide ARM Optimizing C/C++ Compiler v16.9.0.LTS User's Guide (Rev. M) 2016年 4月 30日
Application note TI DSP Benchmarking 2016年 1月 13日
User guide ARM Assembly Language Tools v5.2 User's Guide (Rev. M) 2014年 11月 5日
User guide ARM Optimizing C/C++ Compiler v5.2 User's Guide (Rev. J) 2014年 11月 5日
Application note OMAP-L132/L138, TMS320C6742/6/8 Pin Multiplexing Utility (Rev. B) 2013年 9月 27日
User guide TMS320C6000 Assembly Language Tools v 7.4 User's Guide (Rev. W) 2012年 8月 21日
User guide TMS320C6000 Optimizing Compiler v 7.4 User's Guide (Rev. U) 2012年 8月 21日
Application note Powering the OMAP-L132/OMAP-L137/OMAP-L138 Processor with the TPS650061 2012年 4月 13日
White paper MityDSP®-L138F Software Defined Radio Using uPP Data Transfer (Rev. A) 2012年 2月 2日
Application note Powering the TMS320C6742, TMS320C6746, and TMS320C6748 With the TPS650061 2011年 12月 19日
Application note Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
User guide TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (Rev. F) 2011年 9月 14日
Application note High-Vin, High-Efficiency Power Solution Using DC/DC Converter With DVFS (Rev. C) 2011年 8月 29日
Application note Powering OMAP-L132/L138, C6742/4/6, and AM18x with TPS65070 (Rev. B) 2011年 8月 29日
Application note Simple Power Solution Using LDOs (Rev. B) 2011年 8月 29日
White paper OpenCV on TI’s DSP+ARM® 2011年 7月 27日
Application note TMS320C674x/OMAP-L1x Processor Security 2011年 6月 8日
Product overview OMAP-L1x C6000 DSP+ARM Processors Product Bulletin (Rev. A) 2011年 3月 10日
User guide TMS320C674x DSP Megamodule Reference Guide (Rev. A) 2010年 8月 3日
User guide TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B) 2010年 7月 30日
Application note High-Efficiency Power Solution Using DC/DC Converters With DVFS (Rev. A) 2010年 5月 5日
Application note High-Integration, High-Efficiency Power Solution Using DC/DC Converters w/DVFS (Rev. A) 2010年 5月 5日
Application note Canny Edge Detection Implementation on TMS320C64x/64x+ Using VLIB 2009年 11月 25日
Application note TMS320C6748/46/42 & OMAP-L132/L138 USB Downstream Host Compliance Testing 2009年 8月 17日
Application note TMS320C6748/46/42 & OMAP-L1x8 USB Upstream Device Compliance Testing 2009年 8月 17日
White paper Efficient Fixed- and Floating-Point Code Execution on the TMS320C674x Core 2009年 6月 24日
Application note TMS320C674x/OMAP-L1x USB Compliance Checklist 2009年 3月 12日
User guide TMS320C674x DSP Cache User's Guide (Rev. A) 2009年 2月 11日
Application note Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A) 2008年 7月 17日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器 (模擬器)。與低成本 XDS110 和高效能 XDS560v2 相比,XDS200 是兼具低成本與優異效能的完美平衡,可在單一 pod 中支援各種標準 (IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探測器均支援具嵌入式追踪緩衝區 (ETB) 的 Arm® 與 DSP 處理器中的核心和系統追蹤功能。透過針腳進行核心追蹤則需要 XDS560v2 PRO TRACE

XDS200 透過 TI 20 針腳連接器 (配備適用 TI 14 針腳、Arm Cortex® 10 針腳和 Arm 20 針腳的多重轉接器) (...)

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偵錯探測器

TMDSEMU560V2STM-U — XDS560v2 System Trace USB 偵錯探測器

XDS560v2 是 XDS560™ 偵錯探測器系列的最高性能表現,支援傳統 JTAG 標準 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。請注意,序列線偵錯 (SWD) 不受支援。

所有 XDS 偵錯探測器均支援所有具有嵌入式追踪緩衝區 (ETB) 的 ARM 和 DSP 處理器中的核心和系統追蹤功能。對於針腳追蹤則需要 XDS560v2 PRO TRACE

XDS560v2 透過 MIPI HSPT 60 針腳接頭 (具有用於 TI 14 針腳、TI 20 針腳和 ARM 20 針腳的多轉接器) 連接到目標電路板,並透過 USB2.0 高速 (480Mbps) (...)

TI.com 無法提供
偵錯探測器

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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開發套件

TMDSLCDK138 — OMAP-L138 開發套件 (LCDK)

The OMAP-L138 DSP+Arm9™ development kit will enable fast and easy Linux software and hardware development. This scalable platform will ease and accelerate software and hardware development of everyday applications that require real-time signal processing and control functional, including (...)

使用指南: PDF | HTML
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開發套件

TMDSLCDK6748 — TMS320C6748 DSP 開發套件 (LCDK)

The TMS320C6748 DSP development kit (LCDK) is a scalable platform that breaks down development barriers for applications that require embedded analytics and real-time signal processing, including biometric analytics, communications and audio. The low-cost LCDK will also speed and ease your hardware (...)

使用指南: PDF | HTML
TI.com 無法提供
軟體開發套件 (SDK)

PROCESSOR-SDK-OMAPL138 — 適用於 OMAPL138 處理器的處理器 SDK - 支援 Linux 和 TI-RTOS

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
軟體開發套件 (SDK)

WINCESDK-AM1XOMAPL1X — Windows® 嵌入式 Compact/CE SDK - ARM9™ 型 AM18x、OMAP-L13x 處理器

Microsoft Windows Embedded Compact (WEC7) andCE (WinCE 6.0) operating systems are optimized for embedded devices that require minimum storage based on a componentized architecture.

WinCE BSPs for ARM9-based processors are now available fromAdeneo Embedded.

驅動程式或資料庫

MATHLIB — 用於浮點裝置的 DSP 數學函式庫

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
驅動程式或資料庫

SPRC265 — TMS320C6000 DSP 庫 (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
使用指南: PDF
驅動程式或資料庫

TELECOMLIB — 電信和媒體庫 - 用於 TMS320C64x+ 和 TMS320C55x 處理器的 FAXLIB、VoLIB 和 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

支援產品和硬體

支援產品和硬體

此設計資源支援此類別中多數產品。

檢查產品詳細資料頁面以確認支援。

啟動 下載選項
作業系統 (OS)

MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify (...)
軟體轉碼器

ADT-3P-DSPVOIPCODECS — 適應性數位技術 DSP VOIP、語音和音訊轉碼器

Adaptive Digital is a developer of voice quality enhancement algorithms, and best-in-class acoustic echo cancellation software that work with TI DSPs. Adaptive Digital has extensive experience in the algorithm development, implementation, optimization and configuration tuning. They provide (...)
軟體轉碼器

VOCAL-3P-DSPVOIPCODECS — VOCAL 技術 DSP VoIP 轉碼器

With over 25 years of assembly and C code development, VOCAL modular software suite is available for a wide variety of TI DSPs. Products include ATAs, VoIP servers and gateways, HPNA-based IPBXs, video surveillance, voice and video conferencing, voice and data RF devices, RoIP gateways, secure (...)
模擬型號

OMAP-L132 ZWT IBIS Model (Rev. A)

SPRM523A.ZIP (121 KB) - IBIS Model
CAD/CAE 符號

OMAP-L132 ZWT ORCAD OLB

SPRM539.ZIP (7 KB)
設計工具

PROCESSORS-3P-SEARCH — Arm 架構 MPU、arm 架構 MCU 和 DSP 第三方搜尋工具

TI 已與公司合作,提供各種使用 TI 處理器的軟體、工具和 SOM 以加速生產。下載此搜尋工具,以快速瀏覽我們的第三方解決方案,並找出符合您需求的正確協力廠商。此處列出的軟體、工具和模組,皆由獨立第三方而非由德州儀器生產及管理。

搜尋工具會依產品類型分類,如下所示:

  • 工具包括 IDE/編譯器、偵錯和追蹤、模擬和建模軟體及快閃程式設計師。
  • OS 包含 TI 處理器支援的作業系統。
  • 應用軟體意指特定應用程式軟體,包括在 TI 處理器上執行的中介軟體和程式庫。
  • SOM 意指系統模組解決方案
參考設計

PR2084 — 使用 TPS650061 為 OMAP-L132/OMAP-L137/OMAP-L138 供電

This reference design presents a complete power solution and low-cost, discrete sequencing circuit for the OMAP-L132, OMAP-L137, and OMAP-L138 processors.
Test report: PDF
封裝 引腳 下載
NFBGA (ZWT) 361 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

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