產品詳細資料

Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
COG (NBP) 56 42.88726 mm² 5.321 x 8.06
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

下載 觀看有字幕稿的影片 影片

更多資訊

提供完整的產品規格表。立即索取

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 7
類型 標題 日期
* Data sheet OPT8320 3D Time-of-Flight Sensor (Short) datasheet 2018年 4月 24日
E-book E-book: An engineer’s guide to industrial robot designs 2020年 2月 12日
EVM User's guide OPT8320-CDK-EVM User's Guide (Rev. A) 2017年 2月 2日
Application note Sensor Optics Selection Guide for 3D ToF Camera Systems PDF | HTML 2016年 7月 22日
White paper Filtering for 3D Time-of-Flight Sensors 2016年 1月 21日
Design guide Introduction to Time-of-Flight (ToF) System Design (Rev. D) 2014年 5月 13日
White paper Introduction to Time-of-Flight Camera (Rev. B) 2014年 5月 7日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

模擬型號

OPT8320 IBIS Model

SBAM256.ZIP (88 KB) - IBIS Model
計算工具

SBAC124 3D ToF System Estimator Tool

lock = 需要匯出核准 (1 分鐘)
支援產品和硬體

支援產品和硬體

產品
飛時測距 (ToF) 感測器
OPT8241 QVGA 解析度 3D 飛時測距 (ToF) 感測器 OPT8320 3D 飛行時間 (ToF) 感測器與控制器 OPT9221 適用於 OPT8241 的飛時測距 (ToF) 控制器
封裝 引腳 下載
COG (NBP) 56 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片