SBAS660C August   2016  – June 2017 ADS124S06 , ADS124S08

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Family Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Multiplexer
      2. 9.3.2  Low-Noise Programmable Gain Amplifier
        1. 9.3.2.1 PGA Input-Voltage Requirements
        2. 9.3.2.2 PGA Rail Flags
        3. 9.3.2.3 Bypassing the PGA
      3. 9.3.3  Voltage Reference
        1. 9.3.3.1 Internal Reference
        2. 9.3.3.2 External Reference
        3. 9.3.3.3 Reference Buffers
      4. 9.3.4  Clock Source
      5. 9.3.5  Delta-Sigma Modulator
      6. 9.3.6  Digital Filter
        1. 9.3.6.1 Low-Latency Filter
          1. 9.3.6.1.1 Low-Latency Filter Frequency Response
          2. 9.3.6.1.2 Data Conversion Time for the Low-Latency Filter
        2. 9.3.6.2 Sinc3 Filter
          1. 9.3.6.2.1 Sinc3 Filter Frequency Response
          2. 9.3.6.2.2 Data Conversion Time for the Sinc3 Filter
        3. 9.3.6.3 Note on Conversion Time
        4. 9.3.6.4 50-Hz and 60-Hz Line Cycle Rejection
        5. 9.3.6.5 Global Chop Mode
      7. 9.3.7  Excitation Current Sources (IDACs)
      8. 9.3.8  Bias Voltage Generation
      9. 9.3.9  System Monitor
        1. 9.3.9.1 Internal Temperature Sensor
        2. 9.3.9.2 Power Supply Monitors
        3. 9.3.9.3 Burn-Out Current Sources
      10. 9.3.10 Status Register
        1. 9.3.10.1 POR Flag
        2. 9.3.10.2 RDY Flag
        3. 9.3.10.3 PGA Output Voltage Rail Monitors
        4. 9.3.10.4 Reference Monitor
      11. 9.3.11 General-Purpose Inputs and Outputs (GPIOs)
      12. 9.3.12 Low-Side Power Switch
      13. 9.3.13 Cyclic Redundancy Check (CRC)
      14. 9.3.14 Calibration
        1. 9.3.14.1 Offset Calibration
        2. 9.3.14.2 Gain Calibration
    4. 9.4 Device Functional Modes
      1. 9.4.1 Reset
        1. 9.4.1.1 Power-On Reset
        2. 9.4.1.2 RESET Pin
        3. 9.4.1.3 Reset by Command
      2. 9.4.2 Power-Down Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Conversion Modes
        1. 9.4.4.1 Continuous Conversion Mode
        2. 9.4.4.2 Single-Shot Conversion Mode
        3. 9.4.4.3 Programmable Conversion Delay
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip Select (CS)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Serial Data Input (DIN)
        4. 9.5.1.4 Serial Data Output and Data Ready (DOUT/DRDY)
        5. 9.5.1.5 Data Ready (DRDY)
        6. 9.5.1.6 Timeout
      2. 9.5.2 Data Format
      3. 9.5.3 Commands
        1. 9.5.3.1  NOP
        2. 9.5.3.2  WAKEUP
        3. 9.5.3.3  POWERDOWN
        4. 9.5.3.4  RESET
        5. 9.5.3.5  START
        6. 9.5.3.6  STOP
        7. 9.5.3.7  SYOCAL
        8. 9.5.3.8  SYGCAL
        9. 9.5.3.9  SFOCAL
        10. 9.5.3.10 RDATA
        11. 9.5.3.11 RREG
        12. 9.5.3.12 WREG
      4. 9.5.4 Reading Data
        1. 9.5.4.1 Read Data Direct
        2. 9.5.4.2 Read Data by RDATA Command
        3. 9.5.4.3 Sending Commands When Reading Data
      5. 9.5.5 Interfacing with Multiple Devices
    6. 9.6 Register Map
      1. 9.6.1 Configuration Registers
        1. 9.6.1.1  Device ID Register (address = 00h) [reset = xxh]
          1. Table 26. Device ID (ID) Register Field Descriptions
        2. 9.6.1.2  Device Status Register (address = 01h) [reset = 80h]
          1. Table 27. Device Status (STATUS) Register Field Descriptions
        3. 9.6.1.3  Input Multiplexer Register (address = 02h) [reset = 01h]
          1. Table 28. Input Multiplexer (INPMUX) Register Field Descriptions
        4. 9.6.1.4  Gain Setting Register (address = 03h) [reset = 00h]
          1. Table 29. Gain Setting (PGA) Register Field Descriptions
        5. 9.6.1.5  Data Rate Register (address = 04h) [reset = 14h]
          1. Table 30. Data Rate (DATARATE) Register Field Descriptions
        6. 9.6.1.6  Reference Control Register (address = 05h) [reset = 10h]
          1. Table 31. Reference Control (REF) Register Field Descriptions
        7. 9.6.1.7  Excitation Current Register 1 (address = 06h) [reset = 00h]
          1. Table 32. Excitation Current Register 1 (IDACMAG) Register Field Descriptions
        8. 9.6.1.8  Excitation Current Register 2 (address = 07h) [reset = FFh]
          1. Table 33. Excitation Current Register 2 (IDACMUX) Register Field Descriptions
        9. 9.6.1.9  Sensor Biasing Register (address = 08h) [reset = 00h]
          1. Table 34. Sensor Biasing (VBIAS) Register Field Descriptions
        10. 9.6.1.10 System Control Register (address = 09h) [reset = 10h]
          1. Table 35. System Control (SYS) Register Field Descriptions
        11. 9.6.1.11 Offset Calibration Register 1 (address = 0Ah) [reset = 00h]
          1. Table 36. Offset Calibration Register 1 (OFCAL0) Register Field Descriptions
        12. 9.6.1.12 Offset Calibration Register 2 (address = 0Bh) [reset = 00h]
          1. Table 37. Offset Calibration Register 2 (OFCAL1) Register Field Descriptions
        13. 9.6.1.13 Offset Calibration Register 3 (address = 0Ch) [reset = 00h]
          1. Table 38. Offset Calibration Register 3 (OFCAL2) Register Field Descriptions
        14. 9.6.1.14 Gain Calibration Register 1 (address = 0Dh) [reset = 00h]
          1. Table 39. Gain Calibration Register 1 (FSCAL0) Register Field Descriptions
        15. 9.6.1.15 Gain Calibration Register 2 (address = 0Eh) [reset = 00h]
          1. Table 40. Gain Calibration Register 2 (FSCAL1) Field Descriptions
        16. 9.6.1.16 Gain Calibration Register 3 (address = 0Fh) [reset = 40h]
          1. Table 41. Gain Calibration Register 3 (FSCAL2) Field Descriptions
        17. 9.6.1.17 GPIO Data Register (address = 10h) [reset = 00h]
          1. Table 42. GPIO Data (GPIODAT) Register Field Descriptions
        18. 9.6.1.18 GPIO Configuration Register (address = 11h) [reset = 00h]
          1. Table 43. GPIO Configuration (GPIOCON) Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Serial Interface Connections
      2. 10.1.2 Analog Input Filtering
      3. 10.1.3 External Reference and Ratiometric Measurements
      4. 10.1.4 Establishing a Proper Input Voltage
      5. 10.1.5 Unused Inputs and Outputs
      6. 10.1.6 Pseudo Code Example
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Register Settings
      3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
    2. 11.2 Power-Supply Sequencing
    3. 11.3 Power-On Reset
    4. 11.4 Power-Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
  • PBS|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.6.5 Global Chop Mode

The device uses a very low-drift PGA and modulator in order to provide very low input voltage offset drift. However, a small amount of offset voltage drift sometimes remains in normal measurement. The ADC incorporates a global chop option to reduce the offset voltage and offset voltage drift to very low levels. When the global chop is enabled, the ADC performs two internal conversions to cancel the input offset voltage. The first conversion is taken with normal input polarity. The ADC reverses the internal input polarity for a second conversion. The average of the two conversions yields the final corrected result, removing the offset voltage. The global chop mode is enabled using the G_CHOP bit in the data rate register (04h). Figure 73 shows a block diagram of the global chop implementation. The combined PGA and ADC internal offset voltage is modeled as VOFS.

ADS124S06 ADS124S08 ai_chop_sbas660.gifFigure 73. ADC Global Chop Block Diagram

The first conversion result is available after the ADC takes two separate conversions with settled data. When using the low-latency filter, data settles in a single conversion. When the global chop mode is enabled, the first conversion result appears after a time period of approximately two conversions. When using the sinc3 filter, data settles in three conversions. If the global chop mode is enabled, the first conversion result appears after a time period of approximately six conversions.

In continuous conversion mode with the global chop mode enabled, subsequent conversions complete in half the time as the first conversion completed. Data for alternating inputs are pipelined so that averaging appears on each ADC data cycle. Conversion times using the global chop mode are given in Table 18 and Table 19.

Table 18. Data Conversion Time for Global Chop Mode Using the Low-Latency Filter

NOMINAL
DATA RATE(1) (SPS) 		FIRST DATA CONVERSION PERIOD
FOR GLOBAL CHOP MODE(2)		SECOND AND SUBSEQUENT CONVERSION
PERIODS FOR GLOBAL CHOP MODE
ms(3)NUMBER OF
tMOD PERIODS(3)		ms(3)NUMBER OF
tMOD PERIODS(3)
2.5 813.008 208130 406.504 104065
5 413.008 105730 206.504 52865
10 213.008 54530 106.504 27265
16.66 120.508 30850 60.254 15425
20 113.008 28930 56.504 14465
50 40.313 10320 20.156 5160
60 33.820 8658 16.910 4329
100 20.313 5200 10.156 2600
200 10.313 2640 5.156 1320
400 5.313 1360 2.656 680
800 2.813 720 1.406 360
1000 2.313 592 1.156 296
2000 1.313 336 0.656 168
4000 0.813 208 0.406 104
(1) Valid for the internal oscillator or an external 4.096-MHz clock. Scales proportional with fCLK.
(2) Conversions start at the rising edge of the START/SYNC pin or on the seventh SCLK falling edge for a START command.
(3) Time does not include the programmable delay set by the DELAY[2:0] bits in the gain setting register. Global chop mode requires two conversions, doubling the additional time. The default setting adds an extra 28 · tMOD (where tMOD = tCLK · 16) to this column.

Table 19. Data Conversion Time for Global Chop Mode Using the Sinc3 Filter

NOMINAL
DATA RATE(1) (SPS)		FIRST DATA CONVERSION PERIOD
FOR GLOBAL CHOP MODE(2)		SECOND AND SUBSEQUENT CONVERSION
PERIODS FOR GLOBAL CHOP MODE
ms(3)NUMBER OF tMOD PERIODS(3)ms(3)NUMBER OF tMOD PERIODS(3)
2.5 2400.508 614530 1200.254 307265
5 1200.508 307330 600.254 153665
10 600.508 153730 300.254 76865
16.66 360.508 92290 180.254 46145
20 300.508 76930 150.254 38465
50 120.508 30850 60.254 15425
60 100.445 25714 50.223 12857
100 60.508 15490 30.254 7745
200 30.508 7810 15.254 3905
400 15.508 3970 7.754 1985
800 8.008 2050 4.004 1025
1000 6.313 1616 3.156 808
2000 3.313 848 1.656 424
4000 1.813 464 0.906 232
(1) Valid for the internal oscillator or an external 4.096-MHz clock. Scales proportional with fCLK.
(2) Conversions start at the rising edge of the START/SYNC pin or on the seventh SCLK falling edge for a START command.
(3) Time does not include the programmable delay set by the DELAY[2:0] bits in the gain setting register. Global chop mode requires two conversions, doubling the additional time. The default setting adds an extra 28 · tMOD (where tMOD = tCLK · 16) to this column.

In global chop mode, sequences are similar to taking consecutive single-shot conversions and swapping the input on each conversion. Output data are averaged using the last two data read operations by the ADC with the inputs swapped. Figure 74 shows the time sequence for the ADC using global chop mode.

ADS124S06 ADS124S08 ai_conv_time_gchop_sbas660.gif
1. Conversions start at the rising edge of the START/SYNC pin or on the seventh SCLK falling edge for a START command.
2. When the first data are collected, the inputs are swapped.
3. Measurements are averaged after the inputs are swapped for each conversion.
Figure 74. Global Chop Enabled Conversion Mode Sequences

Because the digital filter must settle after reversing the inputs, the global chop mode data rate is less than the nominal data rate, depending on the digital filter and programmed settling delay. However, if the data rate in use has 50-Hz and 60-Hz frequency response notches, the null frequencies remain unchanged.

The global chop mode also reduces the ADC noise by a factor of √2 because two conversions are averaged. In some cases, the programmable conversion delay must be increased, DELAY[2:0] in the gain setting register (03h), to allow for settling of external components.