SNAS602C FEBRUARY   2013  – December 2014 ADS1293

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Application Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Write Timing Requirements
    7. 7.7 Read Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Flexible Routing Switch
      2. 8.3.2  Battery Monitoring
      3. 8.3.3  Test Mode
      4. 8.3.4  Analog Front-End
      5. 8.3.5  Instrumentation Amplifier (INA)
        1. 8.3.5.1 Instrumentation Amplifier Fault Detection
      6. 8.3.6  Sigma-Delta Modulator (SDM)
        1. 8.3.6.1 Sigma-Delta Modulator Fault Detection
      7. 8.3.7  Programmable Digital Filters
      8. 8.3.8  Filter Settling Time
      9. 8.3.9  Analog Pace Channel
      10. 8.3.10 Wilson Reference
        1. 8.3.10.1 Wilson Central Terminal
        2. 8.3.10.2 Goldberger Terminals
      11. 8.3.11 Common-Mode (CM) Detector
        1. 8.3.11.1 Cable Shield Driving
        2. 8.3.11.2 Common-Mode Output Range (CMOR)
      12. 8.3.12 Right-Leg Drive (RLD)
      13. 8.3.13 Capacitive Load Driving
      14. 8.3.14 Error Status: RLD Rail
      15. 8.3.15 Lead-Off Detection (LOD)
      16. 8.3.16 DC Lead-Off Detect
      17. 8.3.17 Analog AC Lead-Off Detect
      18. 8.3.18 Digital AC Lead-Off Detect
      19. 8.3.19 Clock Oscillator
      20. 8.3.20 Synchronization
      21. 8.3.21 Single-Chip Multi-Channel Synchronization
      22. 8.3.22 Multichip Synchronization
      23. 8.3.23 Synchronization Errors
      24. 8.3.24 Alarm Functions
      25. 8.3.25 Error Filtering
      26. 8.3.26 ALARMB Pin and Error Masking
      27. 8.3.27 Error Register Automatic Clearing Description
      28. 8.3.28 Alarm Propagation
      29. 8.3.29 Reference Voltage Generators
      30. 8.3.30 Power Management
    4. 8.4 Device Functional Modes
      1. 8.4.1 Low Sampling Rate
      2. 8.4.2 High Sampling Rate
      3. 8.4.3 Ouput Code (ADCOUT)
    5. 8.5 Programming
      1. 8.5.1 Serial Digital Interface
      2. 8.5.2 Digital Output Drive Strength
      3. 8.5.3 SPI Protocol
      4. 8.5.4 Random Register Access Protocol
      5. 8.5.5 Auto-Incrementing Address
      6. 8.5.6 Streaming
      7. 8.5.7 Data Ready Bar
      8. 8.5.8 Simultaneous ECG and Pace Data Read
    6. 8.6 Register Maps
      1. 8.6.1  Operation Mode Registers
      2. 8.6.2  Input Channel Selection Registers
      3. 8.6.3  Lead-Off Detect Control Registers
      4. 8.6.4  Common-Mode Detection and Right-Leg Drive Common-Mode Feedback Control Registers
      5. 8.6.5  Wilson Control Registers
      6. 8.6.6  Reference Registers
      7. 8.6.7  OSC Control Registers
      8. 8.6.8  AFE Control Registers
      9. 8.6.9  Error Status Registers
      10. 8.6.10 Digital Registers
      11. 8.6.11 Pace and ECG Data Read Back Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 3-Lead ECG Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 5-Lead ECG Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 8- or 12-Lead ECG Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

See (1)(2).
MIN MAX UNIT
Analog Supply Voltage, VDD –0.3 6.0 V
Digital Supply Voltage, VDDIO –0.3 6.0 V
Voltage on any Input Pin –0.3 to (VDD + 0.3) V
Input Current at Any Pin ±10 mA
Max Junction Temperature(3) 150 °C
Tstg Storage temperature –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are measured with respect to the ground pin, unless otherwise specified.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation PDMAX = (TJ(MAX) – TA)/ θJA or the number given in , whichever is lower.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 1000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Analog Supply Voltage, VDD 2.7 5.5 V
Digital I/O Supply Voltage VDD > 3.6 V 1.65 3.6 V
VDD ≤ 3.6 V 1.65 VDD V
Supply Ground VSS = VSSIO
Full Scale Differential Input Voltage Range, DIVR ±400 mV
Temperature Range(2) –20 85 °C

7.4 Thermal Information

THERMAL METRIC(1) ADS1293 UNIT
LLP
28 PINS
RθJA Junction-to-ambient thermal resistance(2) 29 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation PDMAX = (TJ(MAX) – TA)/RθJA or the number given in , whichever is lower.

7.5 Electrical Characteristics(1)

Unless otherwise noted, all limits are specified at TA = 25°C, 2.7 V ≤ VDD ≤ 5.5 V, 1.65 V ≤ VDDIO ≤ MIN(3.6 V, VDD), VREF = 2.4 V, fOSC = 409.6 kHz, 1-µF low-ESR capacitor between CVREF and GND, 0.1-µF capacitor between RLDREF and GND.
PARAMETER TEST CONDITIONS MIN(3) TYP(2) MAX(3) UNIT
POWER SUPPLY (VDD, VDDIO)
VDD Analog Supply Voltage TMIN ≤ TA ≤ TMAX 2.7 5.5 V
IVDD Analog Supply Current Power-down mode 80 µA
TMIN ≤ TA ≤ TMAX 125
Standby mode 120 µA
TMIN ≤ TA ≤ TMAX 175
1 chan, WILSON OFF, RLD OFF, CMDET OFF, LOD OFF, low-power 205 µA
TMIN ≤ TA ≤ TMAX 290
1 chan, WILSON OFF, RLD OFF, CMDET OFF, LOD OFF, high-res 335
TMIN ≤ TA ≤ TMAX 490
3 chan, WILSON OFF, RLD OFF, CMDET OFF, LOD OFF, low-power 350
TMIN ≤ TA ≤ TMAX 520
3 chan, WILSON ON, RLD ON, CMDET ON, LOD ON, low-power, low cap-drive 440
TMIN ≤ TA ≤ TMAX 595
3 chan, WILSON ON, RLD ON, CMDET ON, LOD ON, high-res, low cap-drive 835
TMIN ≤ TA ≤ TMAX 1120
3 chan, WILSON ON, RLD ON, CMDET ON, LOD ON, high-res, high cap-drive 960
TMIN ≤ TA ≤ TMAX 1300
VDDIO IO Supply Voltage VDD > 3.6 V
TMIN ≤ TA ≤ TMAX		 1.65 3.6 V
VDD ≤ 3.6 V
TMIN ≤ TA ≤ TMAX		 1.65 VDD V
IVDDIO Quiescent Current IO Supply 0.6 µA
ANALOG INPUTS (IN1-IN6)
IB Input Bias Current TA = 25°C, LOD OFF –175 175 pA
TA = 85°C, LOD OFF
TMIN ≤ TA ≤ TMAX		 –13 13 nA
RIN Differential Input Resistance 500 MΩ
EMIRR Electromagnetic Interference Rejection Ratio, IN+, IN-, and VDD f = 400 MHz 92 dB
f = 900 MHz 107 dB
f = 1.8 GHz 98 dB
f = 2.4 GHz 86 dB
ANALOG FRONT END
DIVR Differential Input Voltage Range TMIN ≤ TA ≤ TMAX –400 400 mV
CMVR Common-Mode Voltage Range for full DIVR TMIN ≤ TA ≤ TMAX 0.95 VDD – 0.95 V
VOS Input-Referred Offset Voltage ±16 µV
TMIN ≤ TA ≤ TMAX –87 87
CMRR Common-Mode Rejection Ratio 50 / 60 Hz, VCMDC = RLDREF, VCMAC = 1.2VPP 100 dB
Ve-ECG Input-Referred Voltage Noise for ECG(5) 0.1 - 215 Hz, low-power mode 23 µVPP
TMIN ≤ TA ≤ TMAX 30.5
0.1 - 215 Hz, high-resolution mode 15
TMIN ≤ TA ≤ TMAX 23.95
0.1 - 40 Hz, low-power mode 10
TMIN ≤ TA ≤ TMAX 23.1
0.1 - 40 Hz, high-resolution mode 7
TMIN ≤ TA ≤ TMAX 10.3
Ve-PACE Input-Referred Voltage Noise for Pace 1 - 1280 Hz, high-resolution mode, double pace data rate 0.4 mVPP
Ne Input-Referred Noise Density 0.1 - 215 Hz, low-power mode 240 nV/√Hz
TMIN ≤ TA ≤ TMAX 315
0.1 - 215 Hz, high-resolution mode 155
TMIN ≤ TA ≤ TMAX 250
PSRR Power Supply Rejection Ratio 50 / 60 Hz 94 dB
XTLK Crosstalk between channels Crosstalk from driven channel to zero input channel –105 dB
ENOB-ECG Effective Number of Bits for ECG 215-Hz bandwidth, low-power mode 17.8 bits
TMIN ≤ TA ≤ TMAX 17.4
215 Hz bandwidth, high-resolution mode 18.4 bits
TMIN ≤ TA ≤ TMAX 17.8
ENOB-PACE Effective Number of Bits for Pace 1280-Hz bandwidth, high-resolution mode, double pace data rate 13.7 bits
RS-ECG Sample Rate ECG Channel See Table 8, Table 9, Table 10 and Table 11
TMIN ≤ TA ≤ TMAX		 25 6400 sps
RS-PACE Sample Rate PACE Channel TMIN ≤ TA ≤ TMAX 3.2 25.6 ksps
TSKEW Sample Time Skew Between Channels Multichip simultaneous sampling architecture 0 µs
INTERNAL REFERENCE (REF)
VREF Internal Reference Voltage 2.4 V
Internal Reference Accuracy ±0.5%
Internal Reference Drift ±11 ppm/°C
Internal Reference Start-up Time 5 ms
BATTERY MONITOR
Division (VDD-VREF)/factor 3.246 V/V
Division Accuracy ±0.25%
TEST REFERENCE
(VREF-VSS)/factor 12 V/V
Division Accuracy ±0.1%
Current Consumption 3.5 μA
RIGHT-LEG DRIVE AMPLIFIER (RLD Amp)
VOS Input-Referred Offset Voltage ±5 mV
CMVR Common-Mode Voltage Range TMIN ≤ TA ≤ TMAX 0.5 VDD – 0.5 V
GBW Programmable Gain Bandwidth Low-bandwidth mode 50 kHz
High-bandwidth mode 200 kHz
SR Slew Rate Low-bandwidth mode 25 mV/μs
High-bandwidth mode 90 mV/μs
ClMAX Programmable Capacitive Load Driving Capability High-bandwidth, Low cap-drive mode (see Table 5) 400 pF
Low-bandwidth, High cap-drive mode (see Table 5) 8 nF
IVDD Quiescent Power Consumption Low-bandwidth, Low cap-drive mode 20 μA
TMIN ≤ TA ≤ TMAX 36
High-bandwidth, High cap-drive mode 60 μA
TMIN ≤ TA ≤ TMAX 91
RIGHT-LEG DRIVE REFERENCE
RLDREF Output Voltage Unloaded (VDD – VSS)/2.2 V
COMMON-MODE DETECTOR AMPLIFIER (CMDET Amp)
CMVR Common-Mode Voltage Range TMIN ≤ TA ≤ TMAX 0.5 VDD – 0.5 V
BW Programmable Bandwidth Low-bandwidth mode 50 kHz
High-bandwidth mode 150 kHz
SR Slew Rate Low-bandwidth mode 25 mV/μs
High-bandwidth mode 90 mV/μs
ClMAX Programmable Capacitive Load Driving Capability High-bandwidth mode, Low capdrive mode (see Table 4) 400 pF
Low-bandwidth mode, High cap- drive mode (see Table 4) 8 nF
IVDD Power Consumption (Selected Leads) N leads, low-bandwidth mode, low cap-drive mode 21 + 3 × N μA
N leads, high-bandwidth mode, high cap-drive mode 61 + 3 × N μA
WILSON REFERENCE CIRCUIT
IVR Input Voltage Range TMIN ≤ TA ≤ TMAX 0.5 VDD – 0.5 V
BW Bandwidth 3 buffers ON 50 kHz
SR Slew Rate 3 buffers ON 45 mV/μs
Ne Noise Density At 10 Hz 60 nV/√Hz
Ve Input-Referred Noise for Wilson Reference Amp 0.1 - 200 Hz, 3 buffers ON 5.5 μVPP
IVDD Power Consumption (Selected Leads) N leads, low-power mode 7 × N μA
LEAD-OFF DETECTION
IEXC Excitation Current Programmable: Min. code 0x01
(See Lead-Off Detection (LOD))		 8 nA
Programmable: Max. code 0xFF
(See Lead-Off Detection (LOD))		 2040 nA
IEXCTOL Excitation Current Accuracy 25%
FEXC Excitation Frequency AC LOD mode, programmable, minimum
(see Analog AC Lead-Off Detect )		 6.1 Hz
AC LOD mode, programmable, maximum
(see Analog AC Lead-Off Detect)		 12.5 kHz
VTHDC DC Lead-Off Comparator Threshold VDD – 0.5 V
VHYST Comparator Hysteresis DC lead-off mode 55 mV
IVDD Current Consumption Programmed excl. excitation current 25 μA
ANALOG PACE CHANNEL
Gain 3.5 V/V
BW –3dB Bandwidth 50 kHz
Output Reference RLDREF V
VOS Input-Referred Offset Voltage ±1.3 mV
DIVR Differential Input Voltage Range 2.7 V ≤ VDD < 3.3 V
TMIN ≤ TA ≤ TMAX		 –330 330 mV
3.3 V ≤ VDD
TMIN ≤ TA ≤ TMAX		 –400 400 mV
CMVR Common-Mode Voltage Range for full DIVR TMIN ≤ TA ≤ TMAX 0.95 VDD – 1.1 V
CMRR Common-Mode Rejection Ratio 0.5 V ≤ VCM ≤ VDD-1.5 V 85 dB
PSRR Power Supply Rejection Ratio 3 V ≤ VDD ≤ 5 V, VCM=RLDREF 80 dB
SR Slew Rate 35 mV/µs
Overload Recovery 100 µs
Ve-APACE Input-Referred Noise for Analog Pace VCM = RLDREF, 0.1 kHz - 20 kHz 105 µVPP
IVDD Current Consumption 29 µA
CLOCK
fOSC Internal Clock Frequency fCRYSTAL = 4.096 MHz 409.6 kHz
Internal Clock Duty Cycle 50%
TSTART Internal Clock Start-up Time fCRYSTAL = 4.096 MHz 15 ms
IVDD Internal Clock Power Consumption 83 µA
fEXT External Clock Frequency(4) TMIN ≤ TA ≤ TMAX 370 409.6 450 kHz
External Clock Duty Cycle(4) TMIN ≤ TA ≤ TMAX 40% 50% 60%
DIGITAL INPUT / OUTPUT CHARACTERISTICS
VIH Logical “1” Input Voltage TMIN ≤ TA ≤ TMAX 0.8 × VDDIO V
VIL Logical “0” Input Voltage TMIN ≤ TA ≤ TMAX 0.2 × VDDIO V
VOH Logical “1” Output Voltage ISOURCE = 400 µA, Digital output high-drive mode
TMIN ≤ TA ≤ TMAX		 VDDIO – 0.075 V
ISOURCE = 400 µA, Digital output low-drive mode
TMIN ≤ TA ≤ TMAX		 VDDIO – 0.15
VOL Logical “0” Output Voltage ISINK = 400 µA, Digital output high-drive mode
TMIN ≤ TA ≤ TMAX		 VSSIO + 0.075 V
ISINK = 400 µA, Digital output low-drive mode
TMIN ≤ TA ≤ TMAX		 VSSIO + 0.15 V
IIOHL Digital IO Leakage Current SYNCB and RESETB pins, with 1-MΩ internal pullup resistor ±1 µA
Other digital I/O pins
TMIN ≤ TA ≤ TMAX		 –500 500 nA
(1) Typical specifications are estimations only and are not ensured.
(2) Typical values represent the most likely parameter norms at TA = 25°C and at the at the time of product characterization and are not ensured.
(3) Datasheet min/max specification limits are specified by test, unless otherwise noted.
(4) Specified by design; not production tested.
(5) At least 1000 consecutive readings are used to calculate the peak-to-peak noise in production.

7.6 Write Timing Requirements

Unless otherwise noted, all limits specified at TA = 25°C, 2.7 V ≤ VDD ≤ 5.5 V, 1.65 ≤ VDDIO ≤ MIN (3.6 V, VDD), VREF = 2.4 V, fOSC = 409.6-kHz and a 10-pF capacitive load in parallel with a 10-kΩ load on SDO.
MIN MAX UNIT
FSCLK Serial Clock Frequency 20 MHz
tPH SCLK Pulse Width - High FSCLK = 20 MHz 0.4/FSCLK s
tPL SCLK Pulse Width - Low FSCLK = 20 MHz 0.4/FSCLK s
tSU SDI Set-up Time 5 ns
tH SDI Hold Time 5 ns
writetimingdiagram_nas602.gifFigure 1. Write Timing Diagram

7.7 Read Timing Requirements

Unless otherwise noted, all limits specified at TA = 25°C, 2.7 V ≤ VDD ≤ 5.5 V, 1.65 ≤ VDDIO ≤ MIN(3.6 V, VDD), VREF = 2.4 V, fOSC = 409.6-kHz and a 10-pF capacitive load in parallel with a 10-kΩ load on SDO.
MIN NOM MAX UNIT
tODZ SDO Driven-to-Tristate Time Measured at 10% / 90% point 15 ns
tOZD SDO Tristate-to-Driven Time Measured at 10% / 90% point 15 ns
tOD SDO Output Delay Time 10 ns
tCSS CSB Set-up Time 5 ns
tCSH CSB Hold Time 5 ns
tIAG Inter-Access Gap 10 ns
tDRDYB Data Ready Bar at every 1/ODR second, see Figure 25 4/fOSC s
readtimingdiagram_nas602.gifFigure 2. Read Timing Diagram

7.8 Typical Characteristics

All plots at TA = 25°C, VDD = 3.3 V, VDDIO = 1.8 V, VSS = VSSIO = 0 V, internal VREF = 2.4 V, VCM = RLDREF, internal fOSC = 409.6 kHz, data rate = 1067 sps, and High-Resolution mode, unless otherwise noted.
C009_SNAS602.pngFigure 3. VOS vs VDD
C017_SNAS602.pngFigure 5. VOS Distribution
C011_SNAS602.pngFigure 7. Ibias vs VIN Diff
C013_SNAS602.pngFigure 9. Ibias vs VCM
C002_SNAS602.pngFigure 11. PSRR vs Frequency
C004_SNAS602.pngFigure 13. Input-Referred Noise
C007_SNAS602.pngFigure 15. FFT Plot ECG Channel (50-Hz Signal)
C010_SNAS602.pngFigure 4. VOS vs VCM
C015_SNAS602.pngFigure 6. Vref vs VDD
C012_SNAS602.pngFigure 8. Ibias vs VIN Diff
C014_SNAS602.pngFigure 10. Ibias vs VCM
C001_SNAS602.pngFigure 12. CMRR vs Frequency
C006_SNAS602.pngFigure 14. Noise Histogram
C008_SNAS602.pngFigure 16. FFT Plot Pace Channel (50-Hz Signal)