SPRSP65H April   2021  – December 2025 AM2431 , AM2432 , AM2434

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM243x ALV Pin Diagram
      2. 5.1.2 AM243x ALX Pin Diagram
    2. 5.2 Pin Attributes
      1.      13
      2.      14
      3. 5.2.1 AM243x Package Comparison Table (ALV vs. ALX)
    3. 5.3 Signal Descriptions
      1.      17
      2. 5.3.1  AM243x_ALX Package - Unsupported Interfaces and Signals
      3. 5.3.2  ADC
        1.       MAIN Domain Instances
          1.        21
      4. 5.3.3  CPSW
        1.       MAIN Domain Instances
          1.        24
          2.        25
          3.        26
          4.        27
      5. 5.3.4  CPTS
        1.       MAIN Domain Instances
          1.        30
          2.        31
      6. 5.3.5  DDRSS
        1.       MAIN Domain Instances
          1.        34
      7. 5.3.6  ECAP
        1.       MAIN Domain Instances
          1.        37
          2.        38
          3.        39
      8. 5.3.7  Emulation and Debug
        1.       MAIN Domain Instances
          1.        42
        2.       MCU Domain Instances
          1.        44
      9. 5.3.8  EPWM
        1.       MAIN Domain Instances
          1.        47
          2.        48
          3.        49
          4.        50
          5.        51
          6.        52
          7.        53
          8.        54
          9.        55
          10.        56
      10. 5.3.9  EQEP
        1.       MAIN Domain Instances
          1.        59
          2.        60
          3.        61
      11. 5.3.10 FSI
        1.       MAIN Domain Instances
          1.        64
          2.        65
          3.        66
          4.        67
          5.        68
          6.        69
          7.        70
          8.        71
      12. 5.3.11 GPIO
        1.       MAIN Domain Instances
          1.        74
          2.        75
        2.       MCU Domain Instances
          1.        77
      13. 5.3.12 GPMC
        1.       MAIN Domain Instances
          1.        80
      14. 5.3.13 I2C
        1.       MAIN Domain Instances
          1.        83
          2.        84
          3.        85
          4.        86
        2.       MCU Domain Instances
          1.        88
          2.        89
      15. 5.3.14 MCAN
        1.       MAIN Domain Instances
          1.        92
          2.        93
      16. 5.3.15 SPI (MCSPI)
        1.       MAIN Domain Instances
          1.        96
          2.        97
          3.        98
          4.        99
          5.        100
        2.       MCU Domain Instances
          1.        102
          2.        103
      17. 5.3.16 MMC
        1.       MAIN Domain Instances
          1.        106
          2.        107
      18. 5.3.17 OSPI
        1.       MAIN Domain Instances
          1.        110
      19. 5.3.18 Power Supply
        1.       112
      20. 5.3.19 PRU_ICSSG
        1.       MAIN Domain Instances
          1.        115
          2.        116
      21. 5.3.20 Reserved and No Connect
        1.       118
      22. 5.3.21 SERDES
        1.       MAIN Domain Instances
          1.        121
      23. 5.3.22 System and Miscellaneous
        1. 5.3.22.1 Boot Mode Configuration
          1.        MAIN Domain Instances
            1.         125
        2. 5.3.22.2 Clocking
          1.        MCU Domain Instances
            1.         128
        3. 5.3.22.3 SYSTEM
          1.        MAIN Domain Instances
            1.         131
          2.        MCU Domain Instances
            1.         133
        4. 5.3.22.4 VMON
          1.        135
      24. 5.3.23 TIMER
        1.       MAIN Domain Instances
          1.        138
        2.       MCU Domain Instances
          1.        140
      25. 5.3.24 UART
        1.       MAIN Domain Instances
          1.        143
          2.        144
          3.        145
          4.        146
          5.        147
          6.        148
          7.        149
        2.       MCU Domain Instances
          1.        151
          2.        152
      26. 5.3.25 USB
        1.       MAIN Domain Instances
          1.        155
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On Hours (POH)
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Consumption Summary
    7. 6.7  Electrical Characteristics
      1. 6.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.7.4  eMMCPHY Electrical Characteristics
      5. 6.7.5  SDIO Electrical Characteristics
      6. 6.7.6  LVCMOS Electrical Characteristics
      7. 6.7.7  ADC12B Electrical Characteristics (ALV package)
      8. 6.7.8  ADC10B Electrical Characteristics (ALX package)
      9. 6.7.9  USB2PHY Electrical Characteristics
      10. 6.7.10 SerDes PHY Electrical Characteristics
      11. 6.7.11 DDR Electrical Characteristics
    8. 6.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.8.2 Hardware Requirements
      3. 6.8.3 Programming Sequence
      4. 6.8.4 Impact to Your Hardware Warranty
    9. 6.9  Thermal Resistance Characteristics
      1. 6.9.1 Thermal Resistance Characteristics
    10. 6.10 Temperature Sensor Characteristics
    11. 6.11 Timing and Switching Characteristics
      1. 6.11.1 Timing Parameters and Information
      2. 6.11.2 Power Supply Requirements
        1. 6.11.2.1 Power Supply Slew Rate Requirement
        2. 6.11.2.2 Power Supply Sequencing
          1. 6.11.2.2.1 Power-Up Sequencing
          2. 6.11.2.2.2 Power-Down Sequencing
      3. 6.11.3 System Timing
        1. 6.11.3.1 Reset Timing
        2. 6.11.3.2 Safety Signal Timing
        3. 6.11.3.3 Clock Timing
      4. 6.11.4 Clock Specifications
        1. 6.11.4.1 Input Clocks / Oscillators
          1. 6.11.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.11.4.1.1.1 Load Capacitance
            2. 6.11.4.1.1.2 Shunt Capacitance
          2. 6.11.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 6.11.4.2 Output Clocks
        3. 6.11.4.3 PLLs
        4. 6.11.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.11.5 Peripherals
        1. 6.11.5.1  CPSW3G
          1. 6.11.5.1.1 CPSW3G MDIO Timing
          2. 6.11.5.1.2 CPSW3G RMII Timing
          3. 6.11.5.1.3 CPSW3G RGMII Timing
          4. 6.11.5.1.4 CPSW3G IOSETs
        2. 6.11.5.2  DDRSS
        3. 6.11.5.3  ECAP
        4. 6.11.5.4  EPWM
        5. 6.11.5.5  EQEP
        6. 6.11.5.6  FSI
        7. 6.11.5.7  GPIO
        8. 6.11.5.8  GPMC
          1. 6.11.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.11.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.11.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 6.11.5.8.4 GPMC0 IOSETs (ALV)
        9. 6.11.5.9  I2C
        10. 6.11.5.10 MCAN
        11. 6.11.5.11 MCSPI
          1. 6.11.5.11.1 MCSPI — Controller Mode
          2. 6.11.5.11.2 MCSPI — Peripheral Mode
        12. 6.11.5.12 MMCSD
          1. 6.11.5.12.1 MMC0 - eMMC Interface
            1. 6.11.5.12.1.1 Legacy SDR Mode
            2. 6.11.5.12.1.2 High Speed SDR Mode
            3. 6.11.5.12.1.3 High Speed DDR Mode
            4. 6.11.5.12.1.4 HS200 Mode
          2. 6.11.5.12.2 MMC1 - SD/SDIO Interface
            1. 6.11.5.12.2.1 Default Speed Mode
            2. 6.11.5.12.2.2 High Speed Mode
            3. 6.11.5.12.2.3 UHS–I SDR12 Mode
            4. 6.11.5.12.2.4 UHS–I SDR25 Mode
            5. 6.11.5.12.2.5 UHS–I SDR50 Mode
            6. 6.11.5.12.2.6 UHS–I DDR50 Mode
            7. 6.11.5.12.2.7 UHS–I SDR104 Mode
        13. 6.11.5.13 CPTS
        14. 6.11.5.14 OSPI
          1. 6.11.5.14.1 OSPI0 PHY Mode
            1. 6.11.5.14.1.1 OSPI0 With PHY Data Training
            2. 6.11.5.14.1.2 OSPI0 Without Data Training
              1. 6.11.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 6.11.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 6.11.5.14.2 OSPI0 Tap Mode
            1. 6.11.5.14.2.1 OSPI0 Tap SDR Timing
            2. 6.11.5.14.2.2 OSPI0 Tap DDR Timing
        15. 6.11.5.15 PCIe
        16. 6.11.5.16 PRU_ICSSG
          1. 6.11.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 6.11.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 6.11.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 6.11.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 6.11.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 6.11.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 6.11.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 6.11.5.16.2.1 PRU_ICSSG PWM Timing
          3. 6.11.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 6.11.5.16.3.1 PRU_ICSSG IEP Timing
          4. 6.11.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 6.11.5.16.4.1 PRU_ICSSG UART Timing
          5. 6.11.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 6.11.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 6.11.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 6.11.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 6.11.5.16.6.2 PRU_ICSSG MII Timing
            3. 6.11.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 6.11.5.17 Timers
        18. 6.11.5.18 UART
        19. 6.11.5.19 USB
      6. 6.11.6 Emulation and Debug
        1. 6.11.6.1 Trace
        2. 6.11.6.2 JTAG
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-R5F Subsystem (R5FSS)
      2. 7.2.2 Arm Cortex-M4F (M4FSS)
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 7.4 Other Subsystems
      1. 7.4.1 PDMA Controller
      2. 7.4.2 Peripherals
        1. 7.4.2.1  ADC
        2. 7.4.2.2  DCC
        3. 7.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 7.4.2.4  ECAP
        5. 7.4.2.5  EPWM
        6. 7.4.2.6  ELM
        7. 7.4.2.7  ESM
        8. 7.4.2.8  GPIO
        9. 7.4.2.9  EQEP
        10. 7.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 7.4.2.11 I2C
        12. 7.4.2.12 MCAN
        13. 7.4.2.13 MCRC Controller
        14. 7.4.2.14 MCSPI
        15. 7.4.2.15 MMCSD
        16. 7.4.2.16 OSPI
        17. 7.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 7.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 7.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 7.4.2.20 Dual Mode Timer (DMTIMER)
        21. 7.4.2.21 UART
        22. 7.4.2.22 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 General Routing Guidelines
      2. 8.2.2 DDR Board Design and Layout Guidelines
      3. 8.2.3 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.3.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.3.2 External Board Loopback
        3. 8.2.3.3 DQS (only available in Octal SPI devices)
      4. 8.2.4 USB VBUS Design Guidelines
      5. 8.2.5 System Power Supply Monitor Design Guidelines
      6. 8.2.6 High Speed Differential Signal Routing Guidance
      7. 8.2.7 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
      2. 8.3.2 Oscillator Ground Connection
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
      1. 9.3.1 Information About Cautions and Warnings
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
  • ALX|293
Thermal pad, mechanical data (Package|Pins)

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)(2)
PARAMETER MIN MAX UNIT
VDD_CORE Core supply -0.3 1.05 V
VDDR_CORE RAM supply -0.3 1.05 V
VDD_MMC0 MMC0 PHY core supply -0.3 1.05 V
VDD_DLL_MMC0 MMC0 PLL analog supply -0.3 1.05 V
VDDA_0P85_SERDES0 SERDES0 0.85V analog supply -0.3 1.05 V
VDDA_0P85_SERDES0_C SERDES0 clock 0.85V analog supply -0.3 1.05 V
VDDA_0P85_USB0 USB0 0.85V analog supply -0.3 1.05 V
VDDS_DDR DDR PHY IO supply -0.3 1.57 V
VDDS_DDR_C DDR clock IO supply -0.3 1.57 V
VDDS_MMC0 MMC0 PHY IO supply -0.3 1.98 V
VDDS_OSC MCU_OSC0 supply -0.3 1.98 V
VDDA_MCU RCOSC, POR, POK, and MCU_ PLL0 analog supply -0.3 1.98 V
VDDA_ADC0 ADC0 analog supply -0.3 1.98 V
VDDA_PLL0 MAIN_PLL0, MAIN_PLL2, and MAIN_PLL14 analog supply -0.3 1.98 V
VDDA_PLL1 MAIN_PLL8 and MAIN_PLL12 analog supply -0.3 1.98 V
VDDA_PLL2 MAIN_PLL1 analog supply -0.3 1.98 V
VDDA_1P8_SERDES0 SERDES0 1.8V analog supply -0.3 1.98 V
VDDA_1P8_USB0 USB0 1.8V analog supply -0.3 1.98 V
VDDA_TEMP0 TEMP0 analog supply -0.3 1.98 V
VDDA_TEMP1 TEMP1 analog supply -0.3 1.98 V
VPP eFuse ROM programming supply -0.3 1.98 V
VDDSHV_MCU IO supply for IO MCU -0.3 3.63 V
VDDSHV0 IO supply for IO group 0 -0.3 3.63 V
VDDSHV1 IO supply for IO group 1 -0.3 3.63 V
VDDSHV2 IO supply for IO group 2 -0.3 3.63 V
VDDSHV3 IO supply for IO group 3 -0.3 3.63 V
VDDSHV4 IO supply for IO group 4 -0.3 3.63 V
VDDSHV5 IO supply for IO group 5 -0.3 3.63 V
VDDA_3P3_USB0 USB0 3.3V analog supply -0.3 3.63 V
VDDA_3P3_SDIO SDIO 3.3V analog supply -0.3 3.63 V
Steady-state max voltage at all fail-safe IO pins MCU_PORz -0.3 3.63 V
MCU_I2C0_SCL, MCU_I2C0_SDA,  I2C0_SCL,  I2C0_SDA, and EXTINTn
When operating at 1.8V		 -0.3 1.98(3) V
MCU_I2C0_SCL, MCU_I2C0_SDA,  I2C0_SCL,  I2C0_SDA, and EXTINTn
When operating at 3.3V		 -0.3 3.63(3) V
VMON_1P8_MCU and VMON_1P8_SOC -0.3 1.98 V
VMON_3P3_MCU and VMON_3P3_SOC -0.3 3.63 V
VMON_VSYS(4) -0.3 1.98 V
Steady-state max voltage at all other IO pins(5) USB0_VBUS(6) -0.3 3.6 V
USB0_ID(7) -0.3 3.6 V
All other IO pins -0.3 IO supply voltage + 0.3 V
Transient overshoot and undershoot at IO pin 20% of IO supply voltage for up to 20% of the signal period (see Figure 6-1, IO Transient Voltage Ranges) 0.2 × VDD(8) V
Latch-up performance I-Test(9) -100 +100 mA
Over-Voltage (OV) Test(10) 1.5 x VDD(8) V
TSTG Storage temperature(11) -55 +150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside Section 6.4, Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to VSS, unless otherwise noted.
(3) The absolute maximum ratings for these fail-safe pins depends on their IO supply operating voltage. Therefore, this value is also defined by the maximum VIH value found in Section 6.7.1, I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics, where the electrical characteristics table has separate parameter values for 1.8V mode and 3.3V mode.
(4) The VMON_VSYS pin provides a way to monitor the system power supply. For more information, see Section 8.2.5, System Power Supply Monitor Design Guidelines.
(5) This parameter applies to all IO pins which are not fail-safe and the requirement applies to all values of IO supply voltage. For example, if the voltage applied to a specific IO supply is 0 volts the valid input voltage range for any IO powered by that supply will be –0.3 to +0.3 volts. Special attention should be applied anytime peripheral devices are not powered from the same power sources used to power the respective IO supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range, including power supply ramp-up and ramp-down sequences.
(6) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see Section 8.2.4, USB VBUS Design Guidelines.
(7) The USB0_ID pin is connected to analog circuits in the USB0 PHY. The analog circuits source a known current while measuring voltage, to determine the resistance value (RID), if connected to VSS through a resistor. This pin should be connected to VSS for USB host operation, or left unconnected for USB device operation, and should never be connected to any external voltage source.
(8) VDD is the voltage on the corresponding power-supply pin(s) for the IO.
(9) For current pulse injection (I-Test):
  • Pins stressed per JEDEC JESD78 (Class II) and passed with specified I/O pin injection current and clamp voltage of 1.5 times maximum recommended I/O voltage and negative 0.5 times maximum recommended I/O voltage.
(10) For over-voltage performance (Over-Voltage (OV) Test):
  • Supplies stressed per JEDEC JESD78 (Class II) and passed specified voltage injection.
(11) For tape and reel the storage temperature range is [–10°C; +50°C] with a maximum relative humidity of 70%. TI recommends returning to ambient room temperature before usage.

Fail-safe IO terminals are designed without any dependencies on the respective IO power supply voltage. This allows external voltage sources to be connected to these IO terminals when the respective IO power supplies are turned off.

MCU_I2C0_SCL, MCU_I2C0_SDA,  I2C0_SCL, I2C0_SDA,  EXTINTn, VMON_1P8_MCU, VMON_1P8_SOC, VMON_3P3_MCU, VMON_3P3_SOC, and MCU_PORz are the only fail-safe IO terminals. All other IO terminals are not fail-safe and the voltage applied to them should be limited to the value defined by the Steady-state max voltage at all other IO pins parameter in Section 6.1, Absolute Maximum Ratings.

AM2434 AM2432 AM2431 IO Transient Voltage Range
A. Tovershoot + Tundershoot < 20% of Tperiod
Figure 6-1 IO Transient Voltage Range