SWRS245C December   2021  – June 2025 AM2732 , AM2732-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagram
      1. 5.1.1 AM273x ZCE Pin Diagram
      2. 5.1.2 AM273x NZN Pin Diagram
    2. 5.2 Pin Attributes (AM273x ZCE, NZN Packages)
      1.      13
    3. 5.3 Signal Descriptions
      1. 5.3.1  ADC Signal Descriptions
        1.       16
      2. 5.3.2  CPTS Signal Descriptions
        1.       18
      3. 5.3.3  CSI 2.0 Signal Descriptions
        1.       20
      4. 5.3.4  DMM Signal Descriptions
        1.       22
      5. 5.3.5  ECAP Signal Descriptions
        1.       24
      6. 5.3.6  EPWM Signal Descriptions
        1.       26
        2.       27
        3.       28
        4.       29
      7. 5.3.7  GPIO Signal Descriptions
        1.       31
        2.       32
      8. 5.3.8  I2C Signal Descriptions
        1.       34
        2.       35
        3.       36
      9. 5.3.9  Clock Signal Descriptions
        1.       38
        2.       39
      10. 5.3.10 JTAG Signal Descriptions
        1.       41
      11. 5.3.11 LVDS Signal Descriptions
        1.       43
      12. 5.3.12 MCAN Signal Descriptions
        1.       45
        2.       46
      13. 5.3.13 MCASP Signal Descriptions
        1.       48
        2.       49
        3.       50
      14. 5.3.14 Ethernet Signal Descriptions
        1.       52
        2.       53
        3.       54
        4.       55
      15. 5.3.15 GPIO Signal Descriptions
        1.       57
        2.       58
      16. 5.3.16 Power Supply Signal Descriptions
        1.       60
      17. 5.3.17 QSPI Signal Descriptions
        1.       62
      18. 5.3.18 Reserverd Signal Descriptions
        1.       64
      19. 5.3.19 UART Signal Descriptions
        1.       66
        2.       67
        3.       68
        4.       69
      20. 5.3.20 SPI Signal Descriptions
        1.       71
        2.       72
        3.       73
        4.       74
      21. 5.3.21 System Signal Descriptions
        1.       76
      22. 5.3.22 Trace Signal Descriptions
        1.       78
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings - Automotive
    3. 6.3  Power-On Hours (POH)
      1. 6.3.1 Automotive Temperature Profile
      2. 6.3.2 Industrial Temperature Profile
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Power Supply Specifications
    7. 6.7  I/O Buffer Type and Voltage Rail Dependency
    8. 6.8  CPU Specifications
    9. 6.9  Thermal Resistance Characteristics for nFBGA Package [ZCE285A]
    10. 6.10 Thermal Resistance Characteristics for nFBGA Package [NZN225A]
    11. 6.11 Power Consumption Summary
    12. 6.12 Timing and Switching Characteristics
      1. 6.12.1 Power Supply Sequencing and Reset Timing
      2. 6.12.2 Clock Specifications
      3. 6.12.3 Peripheral Information
        1. 6.12.3.1  QSPI Flash Memory Peripheral
          1. 6.12.3.1.1 QSPI Timing Conditions
          2. 6.12.3.1.2 QSPI Timing Requirements
          3. 6.12.3.1.3 QSPI Switching Characteristics
        2. 6.12.3.2  MIBSPI Peripheral
          1. 6.12.3.2.1 SPI Timing Conditions
          2. 6.12.3.2.2 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. 6.12.3.2.3 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          4. 6.12.3.2.4 SPI Slave Mode Timing and Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        3. 6.12.3.3  Ethernet Switch (RGMII/RMII/MII) Peripheral
          1. 6.12.3.3.1  RGMII/GMII/MII Timing Conditions
          2. 6.12.3.3.2  RGMII Transmit Clock Switching Characteristics
          3. 6.12.3.3.3  RGMII Transmit Data and Control Switching Characteristics
          4. 6.12.3.3.4  RGMII Recieve Clock Timing Requirements
          5. 6.12.3.3.5  RGMII Recieve Data and Control Timing Requirements
          6. 6.12.3.3.6  RMII Transmit Clock Switching Characteristics
          7. 6.12.3.3.7  RMII Transmit Data and Control Switching Characteristics
          8. 6.12.3.3.8  RMII Receive Clock Timing Requirements
          9. 6.12.3.3.9  RMII Receive Data and Control Timing Requirements
          10. 6.12.3.3.10 MII Transmit Switching Characteristics
          11. 6.12.3.3.11 MII Receive Clock Timing Requirements
          12. 6.12.3.3.12 MII Receive Timing Requirements
          13. 6.12.3.3.13 MII Transmit Clock Timing Requirements
          14. 6.12.3.3.14 MDIO Interface Timings
        4. 6.12.3.4  LVDS/Aurora Instrumentation and Measurement Peripheral
          1. 6.12.3.4.1 LVDS Interface Configuration
          2. 6.12.3.4.2 LVDS Interface Timings
        5. 6.12.3.5  UART Peripheral
          1. 6.12.3.5.1 UART Timing Requirements
        6. 6.12.3.6  I2C Protocol Definition
          1. 6.12.3.6.1 I2C Timing Requirements #GUID-D615B3D8-5F52-430D-93CB-70204118ACE4/T4362547-185
        7. 6.12.3.7  Controller Area Network - Flexible Data-Rate (CAN-FD)
          1. 6.12.3.7.1 Dynamic Characteristics for the CAN-FD TX and RX Pins
        8. 6.12.3.8  CSI-2 Peripheral
        9. 6.12.3.9  General Purpose ADC (GPADC)
        10. 6.12.3.10 Enhanced Pulse-Width Modulator (ePWM)
        11. 6.12.3.11 Enhanced Capture (eCAP)
        12. 6.12.3.12 General-Purpose Input/Output
          1. 6.12.3.12.1 Switching Characteristics for Output Timing versus Load Capacitance (CL) #GUID-1BEBEADE-CEC6-42DA-A124-5081550EEDD7/T4362547-45 #GUID-1BEBEADE-CEC6-42DA-A124-5081550EEDD7/T4362547-50
      4. 6.12.4 Emulation and Debug
        1. 6.12.4.1 Emulation and Debug Description
        2. 6.12.4.2 JTAG Interface
          1. 6.12.4.2.1 Timing Requirements for IEEE 1149.1 JTAG
          2. 6.12.4.2.2 Switching Characteristics for IEEE 1149.1 JTAG
        3. 6.12.4.3 ETM Trace Interface
          1. 6.12.4.3.1 ETM TRACE Timing Requirements
          2. 6.12.4.3.2 ETM TRACE Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Main Subsystem
    3. 7.3 DSP Subsystem
    4. 7.4 Radar Control Subsystem
    5. 7.5 Other Subsystems
      1. 7.5.1 Radar A2D Data Format Over CSI2 Interface
      2. 7.5.2 ADC Channels (Service) for User Application
    6. 7.6 Boot Modes
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Typical Application
      1. 8.1.1 Schematic
      2. 8.1.2 Layout
        1. 8.1.2.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NZN|225
  • ZCE|285
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.12.3.2.3 SPI Master Mode Timing and Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
Table 6-15 SPI Master Mode Switching Characteristics (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)(1)(3) see Figure 6-5 and Figure 6-8
NO.PARAMETERMINTYPMAXUNIT
1tc(SPC)MCycle time, SPICLK(2)40256tc(VCLK)ns
2tw(SPCH)MPulse duration, SPICLK high (clock polarity = 0)0.5tc(SPC)M – 40.5tc(SPC)M + 4ns
tw(SPCL)MPulse duration, SPICLK low (clock polarity = 1)0.5tc(SPC)M – 40.5tc(SPC)M + 4
3tw(SPCL)MPulse duration, SPICLK low (clock polarity = 0)0.5tc(SPC)M – 40.5tc(SPC)M + 4ns
tw(SPCH)MPulse duration, SPICLK high (clock polarity = 1)0.5tc(SPC)M – 40.5tc(SPC)M + 4
4td(SPCH-SIMO)MDelay time, SPISIMO valid before SPICLK low, (clock polarity = 0)0.5tc(SPC)M – 13ns
td(SPCL-SIMO)MDelay time, SPISIMO valid before SPICLK high, (clock polarity = 1)0.5tc(SPC)M – 13
5tv(SPCL-SIMO)MValid time, SPISIMO data valid after SPICLK low, (clock polarity = 0)0.5tc(SPC)M – 10.5ns
tv(SPCH-SIMO)MValid time, SPISIMO data valid after SPICLK high, (clock polarity = 1)0.5tc(SPC)M – 10.5
6tC2TDELAYSetup time CS active until SPICLK high
(clock polarity = 0)(5)		CSHOLD = 00.5*tc(SPC)M + (C2TDELAY + 2)*tc(VCLK) – 7.50.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) + 7ns
CSHOLD = 10.5*tc(SPC)M + (C2TDELAY + 2)*tc(VCLK) – 7.50.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) + 7
Setup time CS active until SPICLK low
(clock polarity = 1)(5)		CSHOLD = 00.5*tc(SPC)M + (C2TDELAY+2)*tc(VCLK) – 7.50.5*tc(SPC)M + (C2TDELAY+2) * tc(VCLK) + 7
CSHOLD = 10.5*tc(SPC)M + (C2TDELAY+3)*tc(VCLK) – 7.50.5*tc(SPC)M + (C2TDELAY+3) * tc(VCLK) + 7
7tT2CDELAYHold time, SPICLK low until CS inactive (clock polarity = 0)(5)(T2CDELAY + 1) *tc(VCLK) – 7.5(T2CDELAY + 1) *tc(VCLK) + 7ns
Hold time, SPICLK high until CS inactive (clock polarity = 1)(5)(T2CDELAY + 1) *tc(VCLK) – 7.5(T2CDELAY + 1) *tc(VCLK) + 7
Table 6-16 SPI Master Mode Timing Requirements (CLOCK PHASE = , SPICLK = output, SPISIMO = output, and SPISOMI = input)(1)(3) see Figure 6-5 and Figure 6-8
NO. PARAMETER MIN TYP MAX UNIT
8 tsu(SOMI-SPCL)M Setup time, SPISOMI before SPICLK low
(clock polarity = 0)(4)		 5 ns
tsu(SOMI-SPCH)M Setup time, SPISOMI before SPICLK high
(clock polarity = 1)(4)		 5
9 th(SPCL-SOMI)M Hold time, SPISOMI data valid after SPICLK low
(clock polarity = 0)(4)		 3 ns
th(SPCH-SOMI)M Hold time, SPISOMI data valid after SPICLK high
(clock polarity = 1)(4)		 3
(1) The MASTER bit (SPIGCRx.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is set ( where x = 0 or 1 ).
(2) tc(MSS_VCLK) = main subsystem clock time = 1 / f(MSS_VCLK). For more details, see the Technical Reference Manual.
(3) When the SPI is in Master mode, the following must be true: For PS values from 1 to 255: tc(SPC)M ≥ (PS +1)tc(MSS_VCLK) ≥ 25 ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits. For PS values of 0: tc(SPC)M = 2tc(MSS_VCLK) ≥ 25 ns.
(4) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
(5) C2TDELAY and T2CDELAY is programmed in the SPIDELAY register
AM2732 AM2732-Q1 SPI Master Mode External Timing (CLOCK PHASE = 1)Figure 6-7 SPI Master Mode External Timing (CLOCK PHASE = 1)
AM2732 AM2732-Q1 SPI Master Mode Chip Select Timing (CLOCK PHASE = 1)Figure 6-8 SPI Master Mode Chip Select Timing (CLOCK PHASE = 1)