Product details

CPU Arm Cortex-R5F Frequency (MHz) 400 ADC 10-bit SAR GPIO 94 UART 4 Number of I2Cs 3 Features 2x CSI-2, C66x DSP, Radar hardware accelerator Operating temperature range (C) -40 to 105
CPU Arm Cortex-R5F Frequency (MHz) 400 ADC 10-bit SAR GPIO 94 UART 4 Number of I2Cs 3 Features 2x CSI-2, C66x DSP, Radar hardware accelerator Operating temperature range (C) -40 to 105
NFBGA (ZCE) 285

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400 MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • TMS320C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating at 450 MHz (14.4 GMAC)

Memory subsystem:

  • Up to 5.0 MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67 MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0 MHz crystal with internal oscillator
    • Supports external oscillator at 40/50 MHz
    • Supports externally driven clock (Square/Sine) at 40/50 MHz

High-speed Serial Interfaces:

  • 10/100 Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625 Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25 MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety-Compliant targeted
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 certification by TÜV SÜD planned
  • AEC-Q100 qualification targeted
  • Operating Conditions
    • Automotive grade temperature range supported
    • Industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • 45-nm technology
  • Compact solution size

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400 MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • TMS320C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating at 450 MHz (14.4 GMAC)

Memory subsystem:

  • Up to 5.0 MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67 MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0 MHz crystal with internal oscillator
    • Supports external oscillator at 40/50 MHz
    • Supports externally driven clock (Square/Sine) at 40/50 MHz

High-speed Serial Interfaces:

  • 10/100 Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625 Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25 MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety-Compliant targeted
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 certification by TÜV SÜD planned
  • AEC-Q100 qualification targeted
  • Operating Conditions
    • Automotive grade temperature range supported
    • Industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • 45-nm technology
  • Compact solution size

The AM273x family of microcontrollers is a highly-integrated, high-performance microcontroller based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance, through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built in, large, integrated RAM on die and a wide temperature range, the AM273x offers a safe, secure and cost effective solution for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform solution including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

The AM273x family of microcontrollers is a highly-integrated, high-performance microcontroller based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance, through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built in, large, integrated RAM on die and a wide temperature range, the AM273x offers a safe, secure and cost effective solution for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform solution including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

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Technical documentation

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Type Title Date
* Data sheet AM273x Sitara™ Microcontrollers datasheet 16 Dec 2021
* Errata AM273x Sitara Microcontrollers Silicon Revision 1.0 20 Dec 2021
Application note Power Estimation Tool 01 Dec 2021
Technical article 5 ways high-performance MCUs are reshaping the industry 12 Jul 2021
User guide AM273x Technical Reference Manual 10 Dec 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

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The AWR2243 BoosterPack™ plug-in module is an easy-to-use evaluation board for the single-chip AWR2243 mmWave sensing device.

AWR2243BOOST contains everything required to start developing using the MMWAVE-STUDIO environment and the DCA1000 real-time data capture adapter.

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Limit: 5
Evaluation board

TMDS273GPEVM — AM273x Arm-based MCU general purpose evaluation module

The AM273x EVM is a standalone test, development, and evaluation module (EVM) that lets developers evaluate AM273x's functionality and develop prototypes for a variety of applications.

The EVM is equipped with a Sitara™ AM2732 microcontroller along with additional components to allow the user (...)

In stock
Limit: 3
Software development kit (SDK)

MCU-PLUS-SDK-AM273X — AM273x software development kit (SDK) for Sitara™ microcontrollers

The MCU+ SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demos.  This software accelerates application development schedules by eliminating the need to create basic system (...)
Software development kit (SDK)

MMWAVE-MCUPLUS-SDK — mmWave software development kit (SDK) for AWR2944 and AM2732

The mmWave-MCU plus software development kit (MMWAVE-MCUPLUS-SDK) is a collection of software packages that enable application evaluation and development on TI mmWave sensors. This tool includes the MMWAVE-MCUPLUS-SDK and companion packages to support your design needs.

MMWAVE-MCUPLUS-SDK is a (...)

Firmware

VCTR-3P-AUTOSAR — Vector AUTOSAR, HSM, and networking software components for the automotive industry

Vector is the leading manufacturer of software tools and embedded components for the development of electronic systems and networking from CAN to Automotive Ethernet. Vector has been a partner of automotive manufacturers, suppliers and related industries since 1988, providing software components, (...)
From: Vector Informatik GmbH
Simulation model

AM273x Thermal Model

SPRM788.ZIP (31 KB) - Thermal Model
Simulation model

AM273x IBIS Model

SPRM789.ZIP (2167 KB) - IBIS Model
Simulation model

AM273x BSDL Model

SPRM790.ZIP (3 KB) - BSDL Model
Simulation model

AM273x Power Estimation Tool

SPRM803.ZIP (674 KB) - Power Model
Package Pins Download
NFBGA (ZCE) 285 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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