Product details

Frequency (MHz) 400 RAM (kByte) 5120 ADC type 10-bit SAR Number of GPIOs 94 UART 4 Features 2x CSI-2, C66x DSP Operating temperature range (°C) -40 to 140 Ethernet MAC only SPI 4 CAN (#) 2
Frequency (MHz) 400 RAM (kByte) 5120 ADC type 10-bit SAR Number of GPIOs 94 UART 4 Features 2x CSI-2, C66x DSP Operating temperature range (°C) -40 to 140 Ethernet MAC only SPI 4 CAN (#) 2
NFBGA (ZCE) 285 169 mm² 13 x 13

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400 MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • TMS320C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating at 450 MHz (14.4 GMAC)

Memory subsystem:

  • Up to 5.0 MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67 MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0 MHz crystal with internal oscillator
    • Supports external oscillator at 40/50 MHz
    • Supports externally driven clock (Square/Sine) at 40/50 MHz

High-speed Serial Interfaces:

  • 10/100 Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625 Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25 MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety-Compliant targeted
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 certification by TÜV SÜD planned
  • AEC-Q100 qualification targeted
  • Operating Conditions
    • Automotive grade temperature range supported
    • Industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • 45-nm technology
  • Compact solution size

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400 MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • TMS320C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating at 450 MHz (14.4 GMAC)

Memory subsystem:

  • Up to 5.0 MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67 MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0 MHz crystal with internal oscillator
    • Supports external oscillator at 40/50 MHz
    • Supports externally driven clock (Square/Sine) at 40/50 MHz

High-speed Serial Interfaces:

  • 10/100 Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625 Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25 MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety-Compliant targeted
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 certification by TÜV SÜD planned
  • AEC-Q100 qualification targeted
  • Operating Conditions
    • Automotive grade temperature range supported
    • Industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • 45-nm technology
  • Compact solution size

The AM273x family of microcontrollers is a highly-integrated, high-performance microcontroller based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance, through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built in, large, integrated RAM on die and a wide temperature range, the AM273x offers a safe, secure and cost effective solution for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform solution including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

The AM273x family of microcontrollers is a highly-integrated, high-performance microcontroller based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance, through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built in, large, integrated RAM on die and a wide temperature range, the AM273x offers a safe, secure and cost effective solution for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform solution including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

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Technical documentation

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Type Title Date
* Data sheet AM273x Sitara™ Microcontrollers datasheet (Rev. A) PDF | HTML 28 Feb 2022
* Errata AM273x Sitara Microcontrollers Silicon Revision 1.0 (Rev. A) PDF | HTML 06 Oct 2022
* User guide AM273x Technical Reference Manual (Rev. B) 30 Nov 2022
More literature AM273x Hardware Design Guide PDF | HTML 01 Mar 2023
More literature Debugging Sitara AM2x Microcontrollers PDF | HTML 24 Oct 2022
More literature Optimized Trigonometric Functions on TI Arm Cores (Rev. A) PDF | HTML 08 Aug 2022
More literature Power Estimation Tool PDF | HTML 01 Dec 2021
Technical article 5 ways high-performance MCUs are reshaping the industry 12 Jul 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

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Evaluation board

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Software development kit (SDK)

MCU-PLUS-SDK-AM273X MCU+ SDK for AM273x – RTOS, No-RTOS

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Software development kit (SDK)

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Software development kit (SDK)

MMWAVE-SDK mmWave software development kit (SDK)

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Industrial mmWave radar sensors
IWR1443 Single-chip 76-GHz to 81-GHz mmWave sensor integrating MCU and hardware accelerator IWR1642 Single-chip 76-GHz to 81-GHz mmWave sensor integrating DSP and MCU IWR1843 Single-chip 76-GHz to 81-GHz industrial radar sensor integrating DSP, MCU and radar accelerator IWR6443 Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating MCU and hardware accelerator IWR6843 Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating processing capability IWR6843AOP Single-chip 60-GHz to 64-GHz intelligent mmWave sensor with integrated antenna on package (AoP)
Arm Cortex-R MCUs
AM2732-Q1 Automotive dual-core Arm® Cortex-R5F MCU up to 400 MHz with C66x DSP, Ethernet, safety, security
Hardware development
AWR1443BOOST AWR1443 single-chip 76-GHz to 81-GHz automotive radar sensor evaluation module AWR1642BOOST AWR1642 single-chip 76-GHz to 81-GHz automotive radar sensor evaluation module AWR1843BOOST AWR1843 single-chip 76-GHz to 81-GHz automotive radar sensor evaluation module AWR6843ISK AWR6843 single-chip 60-GHz to 64-GHz automotive radar sensor antenna plug-in module IWR1443BOOST IWR1443 single-chip 76-GHz to 81-GHz mmWave sensor evaluation module IWR1642BOOST IWR1642 single-chip 76-GHz to 81-GHz mmWave sensor integrating DSP and MCU evaluation module IWR1843BOOST IWR1843 single-chip 76-GHz to 81-GHz industrial radar sensor evaluation module IWR6843ISK IWR6843 intelligent mmWave sensor standard antenna plug-in module
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Firmware

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Supported products & hardware

Supported products & hardware

This design resource supports most products in these categories.

Check the product details page to verify support.

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Industrial mmWave radar sensors
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Online training

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Software
Software development kit (SDK)
MCU-PLUS-SDK-AM273X AM273x software development kit (SDK) for Sitara™ microcontrollers
Simulation model

AM273x BSDL Model

SPRM790.ZIP (3 KB) - BSDL Model
Simulation model

AM273x IBIS Model

SPRM789.ZIP (2167 KB) - IBIS Model
Simulation model

AM273x Power Estimation Tool

SPRM803.ZIP (674 KB) - Power Model
Simulation model

AM273x Thermal Model

SPRM788.ZIP (31 KB) - Thermal Model
Package Pins Download
NFBGA (ZCE) 285 View options

Ordering & quality

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  • REACH
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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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