Product details

CPU Arm Cortex-R5F Frequency (MHz) 400 ADC 10-bit SAR GPIO 94 UART 4 Number of I2Cs 3 Features 2x CSI-2, C66x DSP Operating temperature range (C) -40 to 140
CPU Arm Cortex-R5F Frequency (MHz) 400 ADC 10-bit SAR GPIO 94 UART 4 Number of I2Cs 3 Features 2x CSI-2, C66x DSP Operating temperature range (C) -40 to 140
NFBGA (ZCE) 285 169 mm² 13 x 13

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400 MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • TMS320C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating at 450 MHz (14.4 GMAC)

Memory subsystem:

  • Up to 5.0 MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67 MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0 MHz crystal with internal oscillator
    • Supports external oscillator at 40/50 MHz
    • Supports externally driven clock (Square/Sine) at 40/50 MHz

High-speed Serial Interfaces:

  • 10/100 Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625 Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25 MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety-Compliant targeted
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 certification by TÜV SÜD planned
  • AEC-Q100 qualification targeted
  • Operating Conditions
    • Automotive grade temperature range supported
    • Industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • 45-nm technology
  • Compact solution size

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400 MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB ICache and 32KB DCache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • TMS320C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating at 450 MHz (14.4 GMAC)

Memory subsystem:

  • Up to 5.0 MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67 MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0 MHz crystal with internal oscillator
    • Supports external oscillator at 40/50 MHz
    • Supports externally driven clock (Square/Sine) at 40/50 MHz

High-speed Serial Interfaces:

  • 10/100 Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625 Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25 MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety-Compliant targeted
    • Developed for functional safety applications
    • Documentation will be available to aid ISO 26262 functional safety system design
    • Hardware integrity up to ASIL B targeted
    • Safety-related certification
      • ISO 26262 certification by TÜV SÜD planned
  • AEC-Q100 qualification targeted
  • Operating Conditions
    • Automotive grade temperature range supported
    • Industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • 45-nm technology
  • Compact solution size

The AM273x family of microcontrollers is a highly-integrated, high-performance microcontroller based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance, through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built in, large, integrated RAM on die and a wide temperature range, the AM273x offers a safe, secure and cost effective solution for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform solution including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

The AM273x family of microcontrollers is a highly-integrated, high-performance microcontroller based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables Original-Equipment Manufacturers (OEM) and Original-Design Manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance, through the maximum flexibility of a fully integrated, mixed processor solution.

With an integrated Hardware Security Module (HSM) and functional safety support built in, large, integrated RAM on die and a wide temperature range, the AM273x offers a safe, secure and cost effective solution for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform solution including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

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Technical documentation

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Type Title Date
* Data sheet AM273x Sitara™ Microcontrollers datasheet (Rev. A) 28 Feb 2022
* Errata AM273x Sitara Microcontrollers Silicon Revision 1.0 20 Dec 2021
Application note Power Estimation Tool 01 Dec 2021
Technical article 5 ways high-performance MCUs are reshaping the industry 12 Jul 2021
User guide AM273x Technical Reference Manual 10 Dec 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

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Debug probe

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Debug probe

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IDE, configuration, compiler or debugger

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

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Supported products & hardware

Supported products & hardware

This design resource supports most products in these categories.

Check the product details page to verify support.

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Software development kit (SDK)

MCU-PLUS-SDK-AM273X — AM273x software development kit (SDK) for Sitara™ microcontrollers

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Software development kit (SDK)

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Software development kit (SDK)

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Firmware

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Simulation model

AM273x Thermal Model

SPRM788.ZIP (31 KB) - Thermal Model
Simulation model

AM273x IBIS Model

SPRM789.ZIP (2167 KB) - IBIS Model
Simulation model

AM273x BSDL Model

SPRM790.ZIP (3 KB) - BSDL Model
Simulation model

AM273x Power Estimation Tool

SPRM803.ZIP (674 KB) - Power Model
Package Pins Download
NFBGA (ZCE) 285 View options

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  • Qualification summary
  • Ongoing reliability monitoring

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