Refer to the PDF data sheet for device specific package drawings
The following packaging information and addendum reflect the most current data available for the designated device. This data is subject to change without notice and without revision of this document.
The following figure is a preliminary package drawing for the ZDN package option.
Note: The ZDN package is shown with a 17-mm × 17-mm array of 491 solder balls with 0.65-mm pitch, with via channel array (VCA) technology.