SPRSP58C June   2022  – October 2025 AM620-Q1 , AM623 , AM625 , AM625-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        17
          2.        18
          3.        19
          4.        20
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        23
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        26
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        29
      6. 5.3.5  DSS
        1. 5.3.5.1 MAIN Domain
          1.        32
      7. 5.3.6  ECAP
        1. 5.3.6.1 MAIN Domain
          1.        35
          2.        36
          3.        37
      8. 5.3.7  Emulation and Debug
        1. 5.3.7.1 MAIN Domain
          1.        40
        2. 5.3.7.2 MCU Domain
          1.        42
      9. 5.3.8  EPWM
        1. 5.3.8.1 MAIN Domain
          1.        45
          2.        46
          3.        47
          4.        48
      10. 5.3.9  EQEP
        1. 5.3.9.1 MAIN Domain
          1.        51
          2.        52
          3.        53
      11. 5.3.10 GPIO
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
        2. 5.3.10.2 MCU Domain
          1.        59
      12. 5.3.11 GPMC
        1. 5.3.11.1 MAIN Domain
          1.        62
      13. 5.3.12 I2C
        1. 5.3.12.1 MAIN Domain
          1.        65
          2.        66
          3.        67
          4.        68
        2. 5.3.12.2 MCU Domain
          1.        70
        3. 5.3.12.3 WKUP Domain
          1.        72
      14. 5.3.13 MCAN
        1. 5.3.13.1 MAIN Domain
          1.        75
        2. 5.3.13.2 MCU Domain
          1.        77
          2.        78
      15. 5.3.14 MCASP
        1. 5.3.14.1 MAIN Domain
          1.        81
          2.        82
          3.        83
      16. 5.3.15 MCSPI
        1. 5.3.15.1 MAIN Domain
          1.        86
          2.        87
          3.        88
        2. 5.3.15.2 MCU Domain
          1.        90
          2.        91
      17. 5.3.16 MDIO
        1. 5.3.16.1 MAIN Domain
          1.        94
      18. 5.3.17 MMC
        1. 5.3.17.1 MAIN Domain
          1.        97
          2.        98
          3.        99
      19. 5.3.18 OLDI
        1. 5.3.18.1 MAIN Domain
          1.        102
      20. 5.3.19 OSPI
        1. 5.3.19.1 MAIN Domain
          1.        105
      21. 5.3.20 Power Supply
        1.       107
      22. 5.3.21 PRUSS
        1. 5.3.21.1 MAIN Domain
          1.        110
          2.        111
      23. 5.3.22 Reserved
        1.       113
      24. 5.3.23 System and Miscellaneous
        1. 5.3.23.1 Boot Mode Configuration
          1. 5.3.23.1.1 MAIN Domain
            1.         117
        2. 5.3.23.2 Clock
          1. 5.3.23.2.1 MCU Domain
            1.         120
          2. 5.3.23.2.2 WKUP Domain
            1.         122
        3. 5.3.23.3 System
          1. 5.3.23.3.1 MAIN Domain
            1.         125
          2. 5.3.23.3.2 MCU Domain
            1.         127
          3. 5.3.23.3.3 WKUP Domain
            1.         129
        4. 5.3.23.4 VMON
          1.        131
      25. 5.3.24 TIMER
        1. 5.3.24.1 MAIN Domain
          1.        134
        2. 5.3.24.2 MCU Domain
          1.        136
        3. 5.3.24.3 WKUP Domain
          1.        138
      26. 5.3.25 UART
        1. 5.3.25.1 MAIN Domain
          1.        141
          2.        142
          3.        143
          4.        144
          5.        145
          6.        146
          7.        147
        2. 5.3.25.2 MCU Domain
          1.        149
        3. 5.3.25.3 WKUP Domain
          1.        151
      27. 5.3.26 USB
        1. 5.3.26.1 MAIN Domain
          1.        154
          2.        155
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings for Devices which are not AEC - Q100 Qualified
    3. 6.3  ESD Ratings for AEC - Q100 Qualified Devices
    4. 6.4  Power-On Hours (POH)
    5. 6.5  Recommended Operating Conditions
    6. 6.6  Operating Performance Points
    7. 6.7  Power Consumption Summary
    8. 6.8  Electrical Characteristics
      1. 6.8.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.8.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.8.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.8.4  Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.8.5  SDIO Electrical Characteristics
      6. 6.8.6  LVCMOS Electrical Characteristics
      7. 6.8.7  OLDI LVDS (OLDI) Electrical Characteristics
      8. 6.8.8  CSI-2 (D-PHY) Electrical Characteristics
      9. 6.8.9  USB2PHY Electrical Characteristics
      10. 6.8.10 DDR Electrical Characteristics
    9. 6.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.9.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.9.2 Hardware Requirements
      3. 6.9.3 Programming Sequence
      4. 6.9.4 Impact to Your Hardware Warranty
    10. 6.10 Thermal Resistance Characteristics
      1. 6.10.1 Thermal Resistance Characteristics for ALW and AMC Packages
    11. 6.11 Temperature Sensor Characteristics
    12. 6.12 Timing and Switching Characteristics
      1. 6.12.1 Timing Parameters and Information
      2. 6.12.2 Power Supply Requirements
        1. 6.12.2.1 Power Supply Slew Rate Requirement
        2. 6.12.2.2 Power Supply Sequencing
          1. 6.12.2.2.1 Power-Up Sequencing
          2. 6.12.2.2.2 Power-Down Sequencing
          3. 6.12.2.2.3 Partial IO Power Sequencing
      3. 6.12.3 System Timing
        1. 6.12.3.1 Reset Timing
        2. 6.12.3.2 Error Signal Timing
        3. 6.12.3.3 Clock Timing
      4. 6.12.4 Clock Specifications
        1. 6.12.4.1 Input Clocks / Oscillators
          1. 6.12.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.12.4.1.1.1 Load Capacitance
            2. 6.12.4.1.1.2 Shunt Capacitance
          2. 6.12.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.12.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.12.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.12.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.12.4.2 Output Clocks
        3. 6.12.4.3 PLLs
        4. 6.12.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.12.5 Peripherals
        1. 6.12.5.1  CPSW3G
          1. 6.12.5.1.1 CPSW3G MDIO Timing
          2. 6.12.5.1.2 CPSW3G RMII Timing
          3. 6.12.5.1.3 CPSW3G RGMII Timing
        2. 6.12.5.2  CPTS
        3. 6.12.5.3  CSI-2
        4. 6.12.5.4  DDRSS
        5. 6.12.5.5  DSS
        6. 6.12.5.6  ECAP
        7. 6.12.5.7  Emulation and Debug
          1. 6.12.5.7.1 Trace
          2. 6.12.5.7.2 JTAG
        8. 6.12.5.8  EPWM
        9. 6.12.5.9  EQEP
        10. 6.12.5.10 GPIO
        11. 6.12.5.11 GPMC
          1. 6.12.5.11.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.12.5.11.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.12.5.11.3 GPMC and NAND Flash — Asynchronous Mode
        12. 6.12.5.12 I2C
        13. 6.12.5.13 MCAN
        14. 6.12.5.14 MCASP
        15. 6.12.5.15 MCSPI
          1. 6.12.5.15.1 MCSPI — Controller Mode
          2. 6.12.5.15.2 MCSPI — Peripheral Mode
        16. 6.12.5.16 MMCSD
          1. 6.12.5.16.1 MMC0 - eMMC/SD/SDIO Interface
            1. 6.12.5.16.1.1  Legacy SDR Mode
            2. 6.12.5.16.1.2  High Speed SDR Mode
            3. 6.12.5.16.1.3  HS200 Mode
            4. 6.12.5.16.1.4  Default Speed Mode
            5. 6.12.5.16.1.5  High Speed Mode
            6. 6.12.5.16.1.6  UHS–I SDR12 Mode
            7. 6.12.5.16.1.7  UHS–I SDR25 Mode
            8. 6.12.5.16.1.8  UHS–I SDR50 Mode
            9. 6.12.5.16.1.9  UHS–I DDR50 Mode
            10. 6.12.5.16.1.10 UHS–I SDR104 Mode
          2. 6.12.5.16.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.12.5.16.2.1 Default Speed Mode
            2. 6.12.5.16.2.2 High Speed Mode
            3. 6.12.5.16.2.3 UHS–I SDR12 Mode
            4. 6.12.5.16.2.4 UHS–I SDR25 Mode
            5. 6.12.5.16.2.5 UHS–I SDR50 Mode
            6. 6.12.5.16.2.6 UHS–I DDR50 Mode
            7. 6.12.5.16.2.7 UHS–I SDR104 Mode
        17. 6.12.5.17 OLDI
          1. 6.12.5.17.1 OLDI0 Switching Characteristics
        18. 6.12.5.18 OSPI
          1. 6.12.5.18.1 OSPI0 PHY Mode
            1. 6.12.5.18.1.1 OSPI0 With PHY Data Training
            2. 6.12.5.18.1.2 OSPI0 Without Data Training
              1. 6.12.5.18.1.2.1 OSPI0 PHY SDR Timing
              2. 6.12.5.18.1.2.2 OSPI0 PHY DDR Timing
          2. 6.12.5.18.2 OSPI0 Tap Mode
            1. 6.12.5.18.2.1 OSPI0 Tap SDR Timing
            2. 6.12.5.18.2.2 OSPI0 Tap DDR Timing
        19. 6.12.5.19 PRUSS
          1. 6.12.5.19.1 PRUSS Programmable Real-Time Unit (PRU)
            1. 6.12.5.19.1.1 PRUSS PRU Direct Output Mode Timing
            2. 6.12.5.19.1.2 PRUSS PRU Parallel Capture Mode Timing
            3. 6.12.5.19.1.3 PRUSS PRU Shift Mode Timing
          2. 6.12.5.19.2 PRUSS Industrial Ethernet Peripheral (IEP)
            1. 6.12.5.19.2.1 PRUSS IEP Timing
          3. 6.12.5.19.3 PRUSS Universal Asynchronous Receiver Transmitter (UART)
            1. 6.12.5.19.3.1 PRUSS UART Timing
          4. 6.12.5.19.4 PRUSS Enhanced Capture Peripheral (ECAP)
            1. 6.12.5.19.4.1 PRUSS ECAP Timing
        20. 6.12.5.20 Timers
        21. 6.12.5.21 UART
        22. 6.12.5.22 USB
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A53 Subsystem (A53SS)
      2. 7.2.2 Device/Power Manager
      3. 7.2.3 Arm Cortex-M4F
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 Graphics Processing Unit (GPU)
      2. 7.3.2 Programmable Real-Time Unit Subsystem (PRUSS)
    4. 7.4 Other Subsystems
      1. 7.4.1 Dual Clock Comparator (DCC)
      2. 7.4.2 Data Movement Subsystem (DMSS)
      3. 7.4.3 Memory Cyclic Redundancy Check (MCRC)
      4. 7.4.4 Peripheral DMA Controller (PDMA)
      5. 7.4.5 Real-Time Clock (RTC)
    5. 7.5 Peripherals
      1. 7.5.1  Gigabit Ethernet Switch (CPSW3G)
      2. 7.5.2  Camera Serial Interface Receiver (CSI_RX_IF)
      3. 7.5.3  DDR Subsystem (DDRSS)
      4. 7.5.4  Display Subsystem (DSS)
      5. 7.5.5  Enhanced Capture (ECAP)
      6. 7.5.6  Error Location Module (ELM)
      7. 7.5.7  Enhanced Pulse Width Modulation (EPWM)
      8. 7.5.8  Error Signaling Module (ESM)
      9. 7.5.9  Enhanced Quadrature Encoder Pulse (EQEP)
      10. 7.5.10 General-Purpose Interface (GPIO)
      11. 7.5.11 General-Purpose Memory Controller (GPMC)
      12. 7.5.12 Global Timebase Counter (GTC)
      13. 7.5.13 Inter-Integrated Circuit (I2C)
      14. 7.5.14 Modular Controller Area Network (MCAN)
      15. 7.5.15 Multichannel Audio Serial Port (MCASP)
      16. 7.5.16 Multichannel Serial Peripheral Interface (MCSPI)
      17. 7.5.17 Multi-Media Card Secure Digital (MMCSD)
      18. 7.5.18 Octal Serial Peripheral Interface (OSPI)
      19. 7.5.19 Timers
      20. 7.5.20 Universal Asynchronous Receiver/Transmitter (UART)
      21. 7.5.21 Universal Serial Bus Subsystem (USBSS)
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Supply Designs
        2. 8.1.1.2 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 DDR Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMC|441
  • ALW|425
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.10.1 Thermal Resistance Characteristics for ALW and AMC Packages

It is recommended to perform thermal simulations at the system level with the worst case device power consumption.
NO. PARAMETER DESCRIPTION ALW
PACKAGE
°C/W(1)(2)		 ALW
AEC - Q100
QUALIFIED
PACKAGE
°C/W(1)(2)		 AMC
AEC - Q100
QUALIFIED
PACKAGE
°C/W(1)(2)		 AIR
FLOW
(m/s)(3)
T1 RΘJC Junction-to-case 4.3 3.2 1.2 N/A
T2 RΘJB Junction-to-board 7.1 6.0 3.9 N/A
T3 RΘJA Junction-to-free air 19.3 18.3 13.3 0
T4 Junction-to-moving air 14.5 13.4 9.7 1
T5 13.4 12.3 8.7 2
T6 12.8 11.7 8.1 3
T7 ΨJT Junction-to-package top 0.11 0.07 0.73 0
T8 0.21 0.14 0.75 1
T9 0.26 0.18 0.76 2
T10 0.31 0.22 0.77 3
T11 ΨJB Junction-to-board 7.0 5.9 3.7 0
T12 6.6 5.5 3.4 1
T13 6.5 5.4 3.3 2
T14 6.5 5.4 3.3 3
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
  • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
  • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
  • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-9, Test Boards for Area Array Surface Mount Packages
(3) m/s = meters per second.