SLUSC16B November   2015  – March 2019

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Charge Pump Control
      2. 7.3.2 Pin Enable Controls
        1. 7.3.2.1 External Control of CHG and DSG Output Drivers
        2. 7.3.2.2 External Control of PCHG Output Driver
        3. 7.3.2.3 Pack Monitor Enable
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended System Implementation
        1. 8.1.1.1 bq76200 Slave Device
        2. 8.1.1.2 Flexible Control via AFE or via MCU
        3. 8.1.1.3 Scalable VDDCP Capacitor to Support Multiple FETs in Parallel
        4. 8.1.1.4 Precharge and Predischarge Support
        5. 8.1.1.5 Optional External Gate Resistor
        6. 8.1.1.6 Separate Charge and Discharge paths
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

For the following procedure, see Figure 15 and Figure 16.

  1. Place CVDDCP capacitor close to the device.
  2. Place BAT and PACK RC filters close to the device.
  3. Generally, a typical system using an AFE, MCU, and bq76200 usually have a high-current ground trace/plane and low-current ground plane in the PCB layout. If so, the bq76200 ground should be connected to the low-current ground plane of the PCB layout to remove noise affecting the ENABLE signals.