SWRS255A March   2022  – April 2025 CC1311P3

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption - Power Modes
    6. 7.6  Power Consumption - Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861MHz to 1054MHz—Receive (RX)
    11. 7.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 7.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 359MHz to 527MHz—Receive (RX)
    15. 7.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 7.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 7.17 Timing and Switching Characteristics
      1. 7.17.1 Reset Timing
      2. 7.17.2 Wakeup Timing
      3. 7.17.3 Clock Specifications
        1. 7.17.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 7.17.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 7.17.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 7.17.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.17.4 Synchronous Serial Interface (SSI) Characteristics
        1. 7.17.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       38
      5. 7.17.5 UART
        1. 7.17.5.1 UART Characteristics
    18. 7.18 Peripheral Characteristics
      1. 7.18.1 ADC
        1. 7.18.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.18.2 DAC
        1. 7.18.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.18.3 Temperature and Battery Monitor
        1. 7.18.3.1 Temperature Sensor
        2. 7.18.3.2 Battery Monitor
      4. 7.18.4 Comparator
        1. 7.18.4.1 Continuous Time Comparator
      5. 7.18.5 GPIO
        1. 7.18.5.1 GPIO DC Characteristics
    19. 7.19 Typical Characteristics
      1. 7.19.1 MCU Current
      2. 7.19.2 RX Current
      3. 7.19.3 TX Current
      4. 7.19.4 RX Performance
      5. 7.19.5 TX Performance
      6. 7.19.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  Voltage Supply Domains
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Pin Diagram—RGZ Package (Top View)

CC1311P3 RGZ (7mm × 7mm) Pinout, 0.5mm Pitch (Top View) Figure 6-1 RGZ (7mm × 7mm) Pinout, 0.5mm Pitch (Top View)

The following I/O pins marked in Figure 6-1 in bold have high-drive capabilities:

  • Pin 10, DIO_5
  • Pin 11, DIO_6
  • Pin 12, DIO_7
  • Pin 24, JTAG_TMSC
  • Pin 26, DIO_16
  • Pin 27, DIO_17

The following I/O pins marked in Figure 6-1 in italics have analog capabilities:

  • Pin 36, DIO_23
  • Pin 37, DIO_24
  • Pin 38, DIO_25
  • Pin 39, DIO_26
  • Pin 40, DIO_27
  • Pin 41, DIO_28
  • Pin 42, DIO_29
  • Pin 43, DIO_30