SWRS206D March   2017  – September 2020 CC3220MOD , CC3220MODA

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagrams
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 CC3220MODx and CC3220MODAx Pin Diagram
    2. 7.2 Pin Attributes
      1. 7.2.1 Module Pin Attributes
    3. 7.3 Connections for Unused Pins
    4. 7.4 Pin Attributes and Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Chip, but Before Reset Release
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption (CC3220MODS and CC3220MODAS)
    5. 8.5  Current Consumption (CC3220MODSF and CC3220MODASF)
    6. 8.6  TX Power and IBAT Versus TX Power Level Settings
    7. 8.7  Brownout and Blackout Conditions
    8. 8.8  Electrical Characteristics
    9. 8.9  CC3220MODAx Antenna Characteristics
    10. 8.10 WLAN Receiver Characteristics
    11. 8.11 WLAN Transmitter Characteristics
    12. 8.12 Reset Requirement
    13. 8.13 Thermal Resistance Characteristics for MOB and MON Packages
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power-Up Sequencing
      2. 8.14.2 Power-Down Sequencing
      3. 8.14.3 Device Reset
      4. 8.14.4 Wake Up From Hibernate Timing
      5. 8.14.5 Peripherals Timing
        1. 8.14.5.1  SPI
          1. 8.14.5.1.1 SPI Master
          2. 8.14.5.1.2 SPI Slave
        2. 8.14.5.2  I2S
          1. 8.14.5.2.1 I2S Transmit Mode
          2. 8.14.5.2.2 I2S Receive Mode
        3. 8.14.5.3  GPIOs
          1. 8.14.5.3.1 GPIO Input Transition Time Parameters
        4. 8.14.5.4  I2C
        5. 8.14.5.5  IEEE 1149.1 JTAG
        6. 8.14.5.6  ADC
        7. 8.14.5.7  Camera Parallel Port
        8. 8.14.5.8  UART
        9. 8.14.5.9  External Flash Interface
        10. 8.14.5.10 SD Host
        11. 8.14.5.11 Timers
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  Power-Management Subsystem
      1. 9.5.1 VBAT Wide-Voltage Connection
    6. 9.6  Low-Power Operating Mode
    7. 9.7  Memory
      1. 9.7.1 Internal Memory
        1. 9.7.1.1 SRAM
        2. 9.7.1.2 ROM
        3. 9.7.1.3 Flash Memory
        4. 9.7.1.4 Memory Map
    8. 9.8  Restoring Factory Default Configuration
    9. 9.9  Boot Modes
      1. 9.9.1 Boot Mode List
    10. 9.10 Device Certification and Qualification
      1. 9.10.1 FCC Certification and Statement
      2. 9.10.2 Industry Canada (IC) Certification and Statement
      3. 9.10.3 ETSI/CE Certification
      4. 9.10.4 MIC Certification
      5. 9.10.5 SRRC Certification and Statement
    11. 9.11 Module Markings
    12. 9.12 End Product Labeling
    13. 9.13 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Typical Application
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.2.2 Reset
      3. 10.2.3 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 CC3220MODx RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
      3. 10.3.3 CC3220MODAx RF Layout Recommendations
  11. 11Environmental Requirements and Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Development Tools and Software
    2. 12.2 Firmware Updates
    3. 12.3 Device Nomenclature
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 CC3220MODx Tape Specifications
        2. 13.2.2.2 CC3220MODAx Tape Specifications

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)

Features

  • CC3220MODx is a family of wireless MCU modules consisting of SimpleLink™Wi-Fi® single chip wireless MCUs—the CC3220MODS and CC3220MODAS modules consist of the CC3220SM2ARGK wireless MCU, while the CC3220MODSF and CC3220MODASF modules consist of the CC3220SF12ARGK wireless MCU. Fully integrated, industrial temperature-grade, green modules include all required clocks, SPI Flash, and passives
  • CC3220MODAx modules include an integral antenna for easy integration into the host system
  • CC3220MODx and CC3220MODAx SimpleLink™ Wi-Fi® wireless MCU System-on-Chip (SoC) contains a single chip with two separate execution environments:
    • User application dedicated Arm®Cortex®-M4 MCU
    • Network processor MCU to run all Wi-Fi and internet logical layers
  • FCC, IC, CE, MIC, and SRRC Certified
  • Wi-Fi Alliance members can request certificate transfer of Wi-Fi CERTIFIED™ modules
  • 1.27-mm pitch QFM package for easy assembly and low-cost PCB design
  • Applications MCU subsystem:
    • Arm® Cortex®-M4 core at 80 MHz
    • Embedded memory:
      • CC3220MODS and CC3220MODAx variants include 256KB of RAM
      • CC3220MODSF and CC3220MODASF are Flash-based MCUs with an integrated 1MB of Flash and 256KB of RAM
      • Peripheral drivers in ROM
    • McASP supports two I2S channels
    • SD
    • SPI
    • I2C
    • UART
    • 8-Bit synchronous image interface
    • Four General-Purpose Timers (GPTs) with
      16-Bit PWM mode
    • One Watchdog Timer Module
    • 4-channel, 12-bit Analog-to-Digital Converters (ADCs)
    • Debug interfaces: JTAG, cJTAG, and SWD
  • Wi-Fi network processor subsystem:
    • Wi-Fi®Internet-on-a chip™ dedicated Arm® MCU completely offloads Wi-Fi and internet protocols from the application MCU
    • Wi-Fi® Modes:
      • 802.11b/g/n Station
      • 802.11b/g/n Access Point Supports up to Four Stations
      • Wi-Fi Direct® Client and Group Owner
      • WPA2™ Personal and Enterprise Security: WEP, WPA™, WPA2 PSK, and WPA2 Enterprise (802.1x)
      • IPv4 and IPv6 TCP and IP Stack
      • Industry-Standard BSD Socket Application Programming Interfaces (APIs):
        • 16 Simultaneous TCP or UDP Sockets
        • 6 Simultaneous TLS and SSL Sockets
      • IP Addressing: StaticIP, LLA, DHCPv4, DHCPv6 with Duplicate Address Detection (DAD)
      • SimpleLink™ technology connection manager for autonomous and fast Wi-Fi connections
      • Flexible Wi-Fi provisioning with SmartConfig™ technology, AP Mode, and WPS2 Options
      • RESTful API support using internal HTTP server
      • Embedded network applications running on dedicated network processor
      • Wide set of security features:
        • Hardware features:
          • Separate execution environments
          • Device identity
          • Hardware crypto engine for advanced fast security, including: AES, DES, 3DES, SHA2, MD5, CRC, and Checksum
        • Initial secure programming:
          • Debug security
          • JTAG and debug ports are locked
        • Personal and enterprise Wi-Fi security
        • Secure sockets
          (SSLv3, TLS1.0, TLS1.1, TLS1.2)
      • Networking security
        • HTTPS server
        • Trusted Root-Certificate Catalog
        • TI Root-of-Trust Public Key
      • SW IP protection:
        • Secure key storage
        • File system security
        • Software tamper detection
        • Cloning protection
        • Secure Boot: Validate integrity and authenticity of runtime binary during boot
      • Embedded network applications running on dedicated network processor:
        • HTTP and HTTPS web server with dynamic user callbacks
        • mDNS, DNS-SD, and DHCP Servers
        • Ping
      • Recovery mechanism: can recover to factory defaults or to complete factory image
    • Wi-Fi TX power:
      • 17.0 dBm at 1 DSSS
      • 13.5 dBm at 54 OFDM
    • Wi-Fi RX sensitivity:
      • –95.0 dBm at 1 DSSS
      • –73.5 dBm at 54 OFDM
    • Application Throughput:
      • UDP: 16 Mbps
      • TCP: 13 Mbps
  • Power-management subsystem:
    • Integrated DC/DC converter with
      a wide-supply voltage
      • VBAT: 2.3 to 3.6 V
    • Advanced low-power modes:
      • Shutdown: 1 µA
      • Hibernate: 5 µA
      • Low-Power Deep Sleep (LPDS): 135 µA (measured on CC3220MODS and CC3220MODSF with 256KB RAM retention)
      • RX Traffic (MCU Active): 59 mA (measured on CC3220MODS; CC3220MODSF and CC3220MODASF consume an additional
        15 mA) at 54 OFDM
      • TX Traffic (MCU Active): 223 mA (measured on CC3220MODS; CC3220MODSF and CC3220MODASF consume an additional
        15 mA) at 54 OFDM, maximum power
      • Idle connected (MCU in LPDS): 710 µA (measured on CC3220MODS and CC3220MODSF with 256KB RAM retention) at DTIM = 1
  • Additional integrated components:
    • 40.0-MHz crystal
    • 32.768-kHz crystal (RTC)
    • 32-Mbit SPI Serial Flash
    • RF filter and passive components
  • Footprint compatible QFM package:
    • CC3220MODx: 1.27-mm pitch,
      63-pin, 20.5-mm × 17.5-mm
    • CC3220MODAx: 1.27-mm pitch,
      63-pin, 20.5-mm × 25.0-mm
  • Operating temperature:
    • Ambient temperature range: –40°C to +85°C
  • Module supports SimpleLink Developer's Ecosystem