Refer to the PDF data sheet for device specific package drawings
Packages can be placed using standard pick and place equipment with an accuracy of ±0.05 mm. Component pick and place systems are composed of a vision system that recognizes and positions the component and a mechanical system that physically performs the pick and place operation. Two commonly used types of vision systems are:
The second type renders more accurate placements but tends to be more expensive and time consuming. Both methods are acceptable since the parts align due to a self-centering features fo the solder joint during solder reflow. It is recommended to release the package to 1 to 2 mils into the solder paste or with minimum force to avoid causing any possible damage to the thinner packages.