SWRS353A
April 2025 – February 2026
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Functional Block Diagrams
5
Pin Configuration and Functions
5.1
Pin Diagram
5.2
Pin Descriptions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Electrical Characteristics
6.5
WLAN Performance: 2.4GHz Receiver Characteristics
6.6
WLAN Performance: 2.4GHz Transmitter Power
6.7
WLAN Performance: 5GHz Receiver Characteristics
6.8
WLAN Performance: 5GHz Transmitter Power
6.9
Bluetooth Low Energy Performance: Receiver Characteristics
6.10
Bluetooth Low Energy Performance: Transmitter Characteristics
6.11
Current Consumption: 2.4GHz WLAN Static Modes
6.12
Current Consumption: 5GHz WLAN Static Modes
6.13
Current Consumption: 2.4GHz WLAN Use Cases
6.14
Current Consumption: 5GHz WLAN Use Cases
6.15
Current Consumption: Bluetooth Low Energy Static Modes
6.16
Current Consumption: Bluetooth Low Energy Use Cases
6.17
Current Consumption: Device Modes
6.18
Timing and Switching Characteristics
6.18.1
Power Supply Sequencing
6.18.2
Clocking Specifications
6.18.2.1
Slow Clock Generated Internally
6.18.2.2
Slow Clock Using an External Oscillator
6.19
Interface Timing Characteristics
6.19.1
SDIO Timing Specifications
6.19.1.1
SDIO Timing Diagram: Default Speed
6.19.1.2
SDIO Timing Diagram: High Speed
6.19.2
SPI Timing Specifications
6.19.2.1
SPI Timing Diagram
6.19.2.2
SPI Timing Parameters
6.19.3
UART 4-Wire Interface
6.19.3.1
UART Timing Parameters
7
Detailed Description
7.1
WLAN Features
7.2
Bluetooth Low Energy Features
8
Device Certification
8.1
FCC Certification and Statement
8.2
IC/ISED Certification and Statement
8.3
ETSI/CE
8.4
MIC Certification
8.5
Manual Information to the End User
8.6
Module Markings
8.6.1
Test Grades
9
Application Information
9.1
Applications, Implementation, and Layout
9.2
Typical Application—CC335xMOD Reference Design
9.3
Design Recommendations
9.3.1
General Layout Recommendations
9.3.2
CC335xMOD RF Layout Recommendations
9.3.3
Thermal Board Recommendations
9.4
Baking and SMT Recommendations
9.4.1
Baking Recommendations
9.4.2
SMT Recommendations
10
Device and Documentation Support
10.1
Third-Party Products Disclaimer
10.2
Device Nomenclature Boilerplate
10.3
Tools and Software
10.4
Documentation Support
10.5
Support Resources
10.6
Trademarks
10.7
Electrostatic Discharge Caution
10.8
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
MOZ|65
Thermal pad, mechanical data (Package|Pins)