SCAS931G May   2012  – January 2018 CDCM6208

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information, Airflow = 0 LFM
    5. 6.5  Thermal Information, Airflow = 150 LFM
    6. 6.6  Thermal Information, Airflow = 250 LFM
    7. 6.7  Thermal Information, Airflow = 500 LFM
    8. 6.8  Single-Ended Input Characteristics (SI_MODE[1:0], SDI/SDA/PIN1, SCL/PIN4, SDO/ADD0/PIN2, SCS/ADD1/PIN3, STATUS1/PIN0, RESETN/PWR, PDN, SYNCN, REF_SEL)
    9. 6.9  Single-Ended Input Characteristics (PRI_REF, SEC_REF)
    10. 6.10 Differential Input Characteristics (PRI_REF, SEC_REF)
    11. 6.11 Crystal Input Characteristics (SEC_REF)
    12. 6.12 Single-Ended Output Characteristics (STATUS1, STATUS0, SDO, SDA)
    13. 6.13 PLL Characteristics
    14. 6.14 LVCMOS Output Characteristics
    15. 6.15 LVPECL (High-Swing CML) Output Characteristics
    16. 6.16 CML Output Characteristics
    17. 6.17 LVDS (Low-Power CML) Output Characteristics
    18. 6.18 HCSL Output Characteristics
    19. 6.19 Output Skew and Sync to Output Propagation Delay Characteristics
    20. 6.20 Device Individual Block Current Consumption
    21. 6.21 Worst Case Current Consumption
    22. 6.22 Timing Requirements, I2C Timing
    23. 6.23 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Typical Device Jitter
      2. 8.3.2  Universal Input Buffer (PRI_REF, SEC_REF)
      3. 8.3.3  VCO Calibration
      4. 8.3.4  Reference Divider (R)
      5. 8.3.5  Input Divider (M)
      6. 8.3.6  Feedback Divider (N)
      7. 8.3.7  Prescaler Dividers (PS_A, PS_B)
      8. 8.3.8  Phase Frequency Detector (PFD)
      9. 8.3.9  Charge Pump (CP)
      10. 8.3.10 Fractional Output Divider Jitter Performance
      11. 8.3.11 Device Block-Level Description
      12. 8.3.12 Device Configuration Control
      13. 8.3.13 Configuring the RESETN Pin
      14. 8.3.14 Preventing False Output Frequencies in SPI/I2C Mode at Start-Up
      15. 8.3.15 Input MUX and Smart Input MUX
    4. 8.4 Device Functional Modes
      1. 8.4.1 Control Pins Definition
      2. 8.4.2 Loop Filter Recommendations for Pin Modes
      3. 8.4.3 Status Pins Definition
      4. 8.4.4 PLL Lock Detect
      5. 8.4.5 Interface and Control
        1. 8.4.5.1 Register File Reference Convention
        2. 8.4.5.2 SPI - Serial Peripheral Interface
          1. 8.4.5.2.1 Writing to the CDCM6208
          2. 8.4.5.2.2 Reading From the CDCM6208
          3. 8.4.5.2.3 Block Write/Read Operation
          4. 8.4.5.2.4 I2C Serial Interface
    5. 8.5 Programming
    6. 8.6 Register Maps
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1  Jitter Considerations in SERDES Systems
        2. 9.2.2.2  Jitter Considerations in ADC and DAC Systems
        3. 9.2.2.3  Configuring the PLL
        4. 9.2.2.4  Programmable Loop Filter
        5. 9.2.2.5  Loop filter Component Selection
        6. 9.2.2.6  Device Output Signaling
        7. 9.2.2.7  Integer Output Divider (IO)
        8. 9.2.2.8  Fractional Output Divider (FOD)
        9. 9.2.2.9  Output Synchronization
        10. 9.2.2.10 Output Mux on Y4 and Y5
        11. 9.2.2.11 Staggered CLK Output Power Up for Power Sequencing of a DSP
  10. 10Power Supply Recommendations
    1. 10.1 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
      1. 10.1.1 Mixing Supplies
      2. 10.1.2 Power-On Reset
      3. 10.1.3 Slow Power-Up Supply Ramp
      4. 10.1.4 Fast Power-Up Supply Ramp
      5. 10.1.5 Delaying VDD_Yx_Yy to Protect DSP IOs
    2. 10.2 Device Power-Up Timing
    3. 10.3 Power Down
    4. 10.4 Power Supply Ripple Rejection (PSRR) versus Ripple Frequency
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Reference Schematics
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Configuring the PLL

The CDCM6208 allows configuring the PLL to accommodate various input and output frequencies either through an I2C or SPI programming interface or in the absence of programming, the PLL can be configured through control pins. The PLL can be configured by setting the Smart Input MUX, Reference Divider, PLL Loop Filter, Feedback Divider, Prescaler Divider, and Output Dividers.

For the PLL to operate in closed-loop mode, the following condition in Equation 1 has to be met when using primary input for the reference clock, and the condition in Equation 2 has to be met when using secondary input for the reference clock.

Equation 1. CDCM6208 eq2_Fpri_cas931.gif
Equation 2. CDCM6208 eq3_Fsec_cas931.gif

In Equation 1 and Equation 2, ƒPRI_REF is the reference input frequency on the primary input and ƒSEC_REF is the reference input frequency on the secondary input, R is the reference divider, M is the input divider, N is the feedback divider, and PS_A the prescaler divider A.

The output frequency, ƒOUT, is a function of ƒVCO, the prescaler A, and the output divider (O), and is given by Equation 3. (Use PS_B in for outputs 2, 3, 6, and 7).

Equation 3. CDCM6208 eq4_Fout_cas931.gif

When the output frequency plan calls for the use of some output dividers as fractional values, the following steps are needed to calculate the closest achievable frequencies for those using fractional output dividers and the frequency errors (difference between the desired frequency and the closest achievable frequency).

  • Based on system needs, decide the frequencies that need to have best possible jitter performance.
  • Once decided, these frequencies need to be placed on integer output dividers.
  • Then a frequency plan for these frequencies with strict jitter requirements can be worked out using the common divisor algorithm.
  • Once the integer divider plans are worked out, the PLL settings (including VCO frequency, feedback divider, input divider and prescaler divider) can be worked out to map the input frequency to the frequency out of the prescaler divider.
  • Then calculate the fractional divider values (whose values must be greater than 2) that are needed to support the output frequencies that are not part of the common frequency plan from the common divisor algorithm already worked out.
  • For each fractional divider value, try to represent the fractional portion in a 20-bit binary scheme, where the first fractional bit is represented as 0.5, the second fractional bit is represented as 0.25, third fractional bit is represented as 0.125 and so on. Continue this process until the entire 20-bit fractional binary word is exhausted.
  • Once exhausted, the fraction can be calculated as a cumulative sum of the fractional bit x fractional value of the fractional bit. Once this is done, the closest achievable output frequency can be calculated with the mathematical function of the frequency out of the prescaler divider divided by the achievable fractional divider.
  • The frequency error can then be calculated as the difference between the desired frequency and the closest achievable frequency.