SLLS853F August   2007  – January 2015 DAC5682Z

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics — DC Specification
    6. 7.6 Electrical Characteristics — AC Specification
    7. 7.7 Electrical Characteristics (Digital Specifications)
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  FIR Filters
      2. 8.3.2  Coarse Mixers: CMIX0 and CMIX1
      3. 8.3.3  Clock Inputs
      4. 8.3.4  LVDS Data Interfacing
      5. 8.3.5  LVDS Inputs
      6. 8.3.6  LVDS SYNCP/N Operation
      7. 8.3.7  DLL Operation
      8. 8.3.8  CMOS Digital Inputs
      9. 8.3.9  Reference Operation
      10. 8.3.10 DAC Transfer Function
      11. 8.3.11 DAC Output SINC Response
      12. 8.3.12 Analog Current Outputs
      13. 8.3.13 Designing the PLL Loop Filter
      14. 8.3.14 Test Methodology
    4. 8.4 Device Functional Modes
      1. 8.4.1 Dual-Channel Real Upconversion
      2. 8.4.2 Clock and Data Modes
      3. 8.4.3 PLL Clock Mode
      4. 8.4.4 Recommended Multi-DAC Synchronization Procedure Multi-DAC Synchronization Procedure
      5. 8.4.5 Digital Self Test Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
    6. 8.6 Register Maps
      1. 8.6.1  Register Name: STATUS0 - Address: 0x00, Default = 0x03
      2. 8.6.2  Register Name: CONFIG1 - Address: 0x01, Default = 0x10
      3. 8.6.3  Register Name: CONFIG2 - Address: 0x02, Default = 0xC0
      4. 8.6.4  Register Name: CONFIG3 - Address: 0x03, Default = 0x70
      5. 8.6.5  Register Name: STATUS4 - Address: 0x04, Default = 0x00
      6. 8.6.6  Register Name: CONFIG5 - Address: 0x05, Default = 0x00
      7. 8.6.7  Register Name: CONFIG6 - Address: 0x06, Default = 0x0C
      8. 8.6.8  Register Name: CONFIG7 - Address: 0x07, Default = 0xFF
      9. 8.6.9  Register Name: CONFIG8 - Address: 0x08, Default = 0x00
      10. 8.6.10 Register Name: CONFIG9 - Address: 0x09, Default = 0x00
      11. 8.6.11 Register Name: CONFIG10 - Address: 0x0A, Default = 0x00
      12. 8.6.12 Register Name: CONFIG11 - Address: 0x0B, Default = 0x00
      13. 8.6.13 Register Name: CONFIG12 - Address: 0x0C, Default = 0x00
      14. 8.6.14 Register Name: CONFIG13 - Address: 0x0D, Default = 0x00
      15. 8.6.15 Register Name: CONFIG14 - Address: 0x0E, Default = 0x00
      16. 8.6.16 Register Name: CONFIG15 - Address: 0x0F, Default = 0x00
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Digital Interface and Clocking Considerations for Application Examples
      2. 9.3.2 Single Complex Input, Real IF Output Radio
      3. 9.3.3 Dual Channel Real IF Output Radio
      4. 9.3.4 Direct Conversion Radio
      5. 9.3.5 CMTS/VOD Transmitter
      6. 9.3.6 High-Speed Arbitrary Waveform Generator
    4. 9.4 Initialization Set Up
      1. 9.4.1 Recommended Start-up Sequence
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Device Nomenclature
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGC|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.1.2 Device Nomenclature

Adjacent Carrier Leakage Ratio (ACLR): Defined for a 3.84Mcps 3GPP W-CDMA input signal measured in a 3.84MHz bandwidth at a 5MHz offset from the carrier with a 12dB peak-to-average ratio.

Analog and Digital Power Supply Rejection Ratio (APSSR, DPSSR): Defined as the percentage error in the ratio of the delta IOUT and delta supply voltage normalized with respect to the ideal IOUT current.

Differential Nonlinearity (DNL): Defined as the variation in analog output associated with an ideal 1 LSB change in the digital input code.

Gain Drift: Defined as the maximum change in gain, in terms of ppm of full-scale range (FSR) per °C, from the value at ambient (25°C) to values over the full operating temperature range.

Gain Error: Defined as the percentage error (in FSR%) for the ratio between the measured full-scale output current and the ideal full-scale output current.

Integral Nonlinearity (INL): Defined as the maximum deviation of the actual analog output from the ideal output, determined by a straight line drawn from zero scale to full scale.

Intermodulation Distortion (IMD3, IMD): The two-tone IMD3 or four-tone IMD is defined as the ratio (in dBc) of the worst 3rd-order (or higher) intermodulation distortion product to either fundamental output tone.

Offset Drift: Defined as the maximum change in DC offset, in terms of ppm of full-scale range (FSR) per °C, from the value at ambient (25°C) to values over the full operating temperature range.

Offset Error: Defined as the percentage error (in FSR%) for the ratio of the differential output current (IOUT1–IOUT2) and the mid-scale output current.

Output Compliance Range: Defined as the minimum and maximum allowable voltage at the output of the current-output DAC. Exceeding this limit may result reduced reliability of the device or adversely affecting distortion performance.

Reference Voltage Drift: Defined as the maximum change of the reference voltage in ppm per degree Celsius from value at ambient (25°C) to values over the full operating temperature range.

Spurious Free Dynamic Range (SFDR): Defined as the difference (in dBc) between the peak amplitude of the output signal and the peak spurious signal.

Signal to Noise Ratio (SNR): Defined as the ratio of the RMS value of the fundamental output signal to the RMS sum of all other spectral components below the Nyquist frequency, including noise, but excluding the first six harmonics and dc.

12.2 Trademarks

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.