DLPS193 November   2020 DLP500YX

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Capacitance at Recommended Operating Conditions
    8. 6.8  Timing Requirements
    9. 6.9  Typical Characteristics
    10. 6.10 System Mounting Interface Loads
    11. 6.11 Micromirror Array Physical Characteristics
    12. 6.12 Micromirror Array Optical Characteristics
    13. 6.13 Window Characteristics
    14. 6.14 Chipset Component Usage Specification
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
      1. 7.6.1 Micromirror Array Temperature Calculation using Illumination Power Density
      2. 7.6.2 Micromirror Array Temperature Calculation using Total Illumination Power
      3. 7.6.3 Micromirror Array Temperature Calculation using Screen Lumens
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 DMD Die Temperature Sensing
  9. Power Supply Recommendations
    1. 9.1 DMD Power Supply Power-Up Procedure
    2. 9.2 DMD Power Supply Power-Down Procedure
    3. 9.3 Restrictions on Hot Plugging and Hot Swapping
      1. 9.3.1 No Hot Plugging
      2. 9.3.2 No Hot Swapping
      3. 9.3.3 Intermittent or Voltage Power Spike Avoidance
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Critical Signal Guidelines
      2. 10.1.2 Power Connection Guidelines
      3. 10.1.3 Noise Coupling Avoidance
    2. 10.2 Layout Example
      1. 10.2.1 Layers
      2. 10.2.2 Impedance Requirements
      3. 10.2.3 Trace Width, Spacing
        1. 10.2.3.1 Voltage Signals
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Critical Signal Guidelines

The DLP500YX DMD is one device in a chipset controlled by the DLPC900 Controller. The following guidelines are targeted at designing a functioning PCB using this DLP500YX DMD chipset. The DLP500YX DMD board must be a high-speed multi-layer PCB containing high-speed digital logic utilizing dual edge (DDR) LVDS signals at 400 MHz clock rates. Figure 10-1 shows the DLP500YX signals and the recommendations needed from/to the DLPC900 Controller devices. The DLPC900 device provides the data and control to the DMD. The TPS65145 and LP38513 devices supply power to the DMD.

GUID-20201113-CA0I-CS7T-7ZK9-LC9CZ9XXP8H0-low.gif Figure 10-1 DLP500YX DMD System Connections and Layout Restrictions
Table 10-1 Layout Restriction Notes for Figure 10-1
Note Signal Type Guideline
A Differential Prevent signal noise
Route 100 ±10-Ω resistor
Intra-pair (P-to-N) length tolerance is ±12-mils
DD and SCTRL must be matched to the DCLK within ±150-mils
DCLK_C must be matched to DCLK_D within ±1.25-ns
DCLK_A must be matched to DCLK_B within ±1.25-ns
Do not switch routing layers except at the beginning and end of trace
Signal routing length must not exceed 375-mm
B Single-ended Prevent signal noise
Route single-ended signals 50 ±5-Ω
No length match requirement
C Power VRESET, VOFFSET, VBIAS, and VCC at the DMD must be kept within the operating limits specified in the data sheet
Provide proper amount of decoupling capacitance for each voltage at the DMD