4 Revision History
Changes from F Revision (May 2015) to G Revision
- Changed DMD Marking Image Object for Figure 19Go
Changes from E Revision (September 2013) to F Revision
- Added ESD Ratings, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
- Changed Incorrect VCC2 value from 9V to 8VGo
- Changed LVDS ƒclock to200 MHz - previously incorrectly listed as 150 MHzGo
- Added Max Recommended DMD Temperature – Derating CurveGo
- Added LVCMOS Output Measurement Condition FigureGo
- Changed Incorrect tC value from 4 ns to 5 ns (200 MHz clock)Go
- Changed Incorrect tW value from 1.25 ns to 2.5 ns (200 MHz clock)Go
- Changed SCP Bus DiagramsGo
- Added LVDS Voltage Definition FigureGo
- Changed LVDS Waveform Requirements FigureGo
- Added LVDS Equivalent Input Circuit FigureGo
- Added LVDS & SCP Rise and Fall Time FiguresGo
- Moved the Mechanical section from Recommended Operating Conditions table to the System Mounting Interface Loads section Go
- Added Micromirror Array Physical Characteristics section Go
- Changed Micromirror Array Physical Characteristics Figure to generic image (M x N)Go
- Added Micromirror Array Optical Characteristics section Go
- Changed specular reflectivity wavelength range to 420 - 700 nm (from 400 - 700 nm) to match Recommended Operating ConditionsGo
- Changed Micromirror Landed Orientation and Tilt Figure to generic image (M x N)Go
- Added Window Characteristics section Go
- Added Chipset Component Usage Specification section Go
- Changed Micromirror Array, Pitch, Hinge Axis Orientation Figure to generic image (M x N)Go
- Changed Micromirror States: On, Off, Flat Figure to generic DMD imageGo
- Changed Test Point locations from TC1 & TC2 to TP1 - TP5Go
- Changed Test Point location Diagram to show TP1 - TP5Go
- Added Micromirror Landed-on/Landed-Off Duty Cycle sectionGo
- Changed Typical Application diagramGo
- Replaced "DAD" with "DLPA200"Go
Changes from D Revision (October 2012) to E Revision
- Deleted the Device Part Number Nomenclature sectionGo
Changes from C Revision (June 2012) to D Revision
- Changed the Device Part Number Nomenclature From: DLP5500FYA To: DLP5500AFYAGo
- Updated Mechanical ICD to V2 with a minor change in the window heightGo
Changes from B Revision (Spetember 2011) to C Revision
- Added the Package Footprint and Socket information in the Features list Go
- Deleted redundant information from the DescriptionGo
- Changed the Illumination power density Max value of <420 mm From: 20 To: 2 mW/cm2Go
- Changed Storage temperature range and humidity values in Absolute Maximum Ratings Go
- Added Operating Case Temperature, Operating Humidity, Operating Device Temperature Gradient and Operating Landed Duty-Cycle to RECOMMENDED OPERATING CONDITIONS.Go
- Added Mirror metal specular reflectivity and Illumination overfill values to "Micromirror Array Optical Characteristics" tableGo
- Corrected the CL2W, Qarray and Tarray values in Micromirror Array Temperature Calculation for Uniform Illumination.Go
- Corrected the document reference in Related Documents sectionGo
Changes from A Revision (June 2010) to B Revision
- Changed the window refractive index NOM spec From: 1.5090 To: 1.5119Go
- Added table note "At a wavelength of 632.8 nm"Go
Changes from * Revision (April 2010) to A Revision
- Changed VREF to VCC1Go
- Added |VID| to the absolute max tableGo
- Added VMBRST to the absolute max tableGo
- Clarified Note6 measurement point Go
- Changed the Illumination power density Max value of <420 mm From: 2 To: 20 mW/cm2Go
- Added Additional Related DocumentsGo