DLPS136 November   2018 DLP650LNIR

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  System Mounting Interface Loads
    9. 6.9  Micromirror Array Physical Characteristics
    10. 6.10 Micromirror Array Optical Characteristics
    11. 6.11 Window Characteristics
    12. 6.12 Chipset Component Usage Specification
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 System Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DLPC410: Digital Controller for DLP Discovery 4100 Chipset
      2. 7.3.2 DLPA200: DMD Micromirror Driver
      3. 7.3.3 DLPR410: PROM for DLP Discovery 4100 Chipset
      4. 7.3.4 DLP650LNIR: DLP 0.65 WXGA NIR 2xLVDS Series 450 DMD
        1. 7.3.4.1 DLP650LNIR Chipset Interfaces
          1. 7.3.4.1.1 DLPC410 Interface Description
            1. 7.3.4.1.1.1 DLPC410 IO
            2. 7.3.4.1.1.2 Initialization
            3. 7.3.4.1.1.3 DMD Device Detection
            4. 7.3.4.1.1.4 Power Down
          2. 7.3.4.1.2 DLPC410 to DMD Interface
            1. 7.3.4.1.2.1 DLPC410 to DMD IO Description
            2. 7.3.4.1.2.2 Data Flow
          3. 7.3.4.1.3 DLPC410 to DLPA200 Interface
            1. 7.3.4.1.3.1 DLPA200 Operation
            2. 7.3.4.1.3.2 DLPC410 to DLPA200 IO Description
          4. 7.3.4.1.4 DLPA200 to DLP650LNIR Interface
            1. 7.3.4.1.4.1 DLPA200 to DLP650LNIR Interface Overview
      5. 7.3.5 Measurement Conditions
    4. 7.4 Device Operational Modes
      1. 7.4.1 DMD Block Modes
        1. 7.4.1.1 Single Block Mode
        2. 7.4.1.2 Dual Block Mode
        3. 7.4.1.3 Quad Block Mode
        4. 7.4.1.4 Global Mode
      2. 7.4.2 DMD Load4 Mode
    5. 7.5 Feature Description
      1. 7.5.1 Power Interface
      2. 7.5.2 Timing
    6. 7.6 Optical Interface and System Image Quality Considerations
      1. 7.6.1 Optical Interface and System Image Quality
      2. 7.6.2 Numerical Aperture and Stray Light Control
      3. 7.6.3 Pupil Match
      4. 7.6.4 Illumination Overfill
    7. 7.7 Micromirror Temperature Calculations
      1. 7.7.1 Sample Calculation 1: Uniform Illumination of Entire DMD Active Array (1280 × 800 pixels)
      2. 7.7.2 Sample Calculation 2: Partial DMD Active Array Illumination with Non-uniform Illumination Peak
    8. 7.8 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.8.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.8.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.8.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.8.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Description
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Impedance Requirements
      2. 10.1.2 PCB Signal Routing
      3. 10.1.3 Fiducials
      4. 10.1.4 DMD Interface
        1. 10.1.4.1 Trace Length Matching
      5. 10.1.5 DLP650LNIR Decoupling
        1. 10.1.5.1 Decoupling Capacitors
      6. 10.1.6 VCC and VCC2
      7. 10.1.7 DMD Layout
      8. 10.1.8 DLPA200
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Timing Requirements

Over Recommended Operating Conditions (unless otherwise noted).
PARAMETER DESCRIPTION SIGNAL MIN TYP MAX UNIT
LVDS(1)
tC Clock Cycle Duration for DCLK_A LVDS 2.46 ns
tC Clock Cycle Duration for DCLK_B LVDS 2.46 ns
tW Pulse Duration for DCLK_A LVDS 1.07 1.23 ns
tW Pulse Duration for DCLK_B LVDS 1.07 1.23 ns
tSU Setup Time for D_A(15:0) before DCLK_A LVDS 0.35 ns
tSU Setup Time for D_A(15:0) before DCLK_B LVDS 0.35 ns
tSU Setup Time for SCTRL_A before DCLK_A LVDS 0.35 ns
tSU Setup Time for SCTRL_B before DCLK_B LVDS 0.35 ns
tH Hold time for D_A(15:0) after DCLK_A LVDS 0.50 ns
tH Hold time for D_B(15:0) after DCLK_B LVDS 0.50 ns
tH Hold Time for SCTRL_A after DCLK_A LVDS 0.50 ns
tH Hold Time for SCTRL_B after DCLK_B LVDS 0.50 ns
tSKEW Channel B relative to Channel A(2)(3) LVDS –1.23 1.23 ns
(1) See Figure 7 for timing requirements for LVDS.
(2) Channel A (Bus A) includes the following LVDS pairs: DCLK_AN and DCLK_AP, SCTRL_AN and SCTRL_AP, D_AN(15,13,11,9,7,5,3,1) and D_AP(15,13,11,9,7,5,3,1).
(3) Channel B (Bus B) includes the following LVDS pairs: DCLK_BN and DCLK_BP, SCTRL_BN and SCTRL_BP, D_BN(15,13,11,9,7,5,3,1) and D_BP(15,13,11,9,7,5,3,1).
DLP650LNIR p47_4k_s316_scp_timing_requirements.gifFigure 3. SCP Timing Requirements

See Recommended Operating Conditions for fSCPCLK, tSCP_DS, tSCP_DH, and tSCP_PD specifications.

See Recommended Operating Conditions for tr and tf specifications and conditions.

DLP650LNIR Rise_Time_Fall_Time.gif
Not to scale.
Refer to the Timing Requirements.
Refer to for list of LVDS pins and SCP pins.
Figure 4. Rise Time and Fall Time
DLP650LNIR test_load_circuit.gifFigure 5. Test Load Circuit for Output Propagation Measurement

For output timing analysis, the tester pin electronics and its transmission line effects must be taken into account. Use IBIS or other simulation tools to correlate the timing reference load to a system environment. See Figure 5.

DLP650LNIR lvds_waveform_req.gifFigure 6. LVDS Waveform Requirements

See Recommended Operating Conditions for VCM, VID, and VLVDS specifications and conditions.

DLP650LNIR timing_req.gifFigure 7. Timing Requirements

See Timing Requirements for timing requirements and LVDS pairs per channel (bus) defining D_P(0:x) and D_N(0:x).