DLPS156F January   2019  – November 2024 DLPC3436

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Test Pins and General Control
    2. 4.2 Parallel Port Input
    3. 4.3 DSI Input Data and Clock
    4. 4.4 DMD Reset and Bias Control
    5. 4.5 DMD SubLVDS Interface
    6. 4.6 Peripheral Interface
    7. 4.7 GPIO Peripheral Interface
    8. 4.8 Clock and PLL Support
    9. 4.9 Power and Ground
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Electrical Characteristics
    6. 5.6  Pin Electrical Characteristics
    7. 5.7  Internal Pullup and Pulldown Electrical Characteristics
    8. 5.8  DMD SubLVDS Interface Electrical Characteristics
    9. 5.9  DMD Low-Speed Interface Electrical Characteristics
    10. 5.10 System Oscillator Timing Requirements
    11. 5.11 Power Supply and Reset Timing Requirements
    12. 5.12 Parallel Interface Frame Timing Requirements
    13. 5.13 Parallel Interface General Timing Requirements
    14. 5.14 Flash Interface Timing Requirements
    15. 5.15 Other Timing Requirements
    16. 5.16 DMD SubLVDS Interface Switching Characteristics
    17. 5.17 DMD Parking Switching Characteristics
    18. 5.18 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Source Requirements
        1. 6.3.1.1 Input Frame Rates and 3-D Display Operation
          1. 6.3.1.1.1 Parallel Interface Data Transfer Format
        2. 6.3.1.2 3D Display
      2. 6.3.2 Device Startup
      3. 6.3.3 SPI Flash
        1. 6.3.3.1 SPI Flash Interface
        2. 6.3.3.2 SPI Flash Programming
      4. 6.3.4 I2C Interface
      5. 6.3.5 Content Adaptive Illumination Control (CAIC)
      6. 6.3.6 Local Area Brightness Boost (LABB)
      7. 6.3.7 3D Glasses Operation
      8. 6.3.8 Test Point Support
      9. 6.3.9 DMD Interface
        1. 6.3.9.1 SubLVDS (HS) Interface
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
  9. 8 Power Supply Recommendations
    1. 8.1 PLL Design Considerations
    2. 8.2 System Power-Up and Power-Down Sequence
    3. 8.3 Power-Up Initialization Sequence
    4. 8.4 DMD Fast Park Control (PARKZ)
    5. 8.5 Hot Plug I/O Usage
    6. 8.6 Maximum Signal Transition Time
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 PLL Power Layout
      2. 9.1.2 Reference Clock Layout
        1. 9.1.2.1 Recommended Crystal Oscillator Configuration
      3. 9.1.3 Unused Pins
      4. 9.1.4 DMD Control and SubLVDS Signals
      5. 9.1.5 Layer Changes
      6. 9.1.6 Stubs
      7. 9.1.7 Terminations
      8. 9.1.8 Routing Vias
      9. 9.1.9 Thermal Considerations
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Device Nomenclature
        1. 10.1.2.1 Device Markings DLPC343x
        2. 10.1.2.2 Device Markings DLPC342x
        3. 10.1.2.3 Video Timing Parameter Definitions
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Related Links
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Internal Pullup and Pulldown Electrical Characteristics

over operating free-air temperature (unless otherwise noted) (2)
INTERNAL PULLUP AND PULLDOWN RESISTOR CHARACTERISTICSTEST CONDITIONS(1)MINMAXUNIT
Weak pullup resistanceVCCIO = 3.3V2963kΩ
VCCIO = 2.5V3890
VCCIO = 1.8V56148
Weak pulldown resistanceVCCIO = 3.3V3072kΩ
VCCIO = 2.5V36101
VCCIO = 1.8V52167
(1) The resistance is dependent on VCCIO, the pin's supply reference (see a given pins supply reference in Table 4-3).
(2) An external 8-kΩ pullup or pulldown (if needed) would work for any voltage condition to correctly pull enough to override any associated internal pullups or pulldowns.