SLVSHE0 August   2025 DRV8002-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Auto
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information RGZ package
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 External Components
    4. 7.4 Feature Description
      1. 7.4.1 High-Side Drivers
        1. 7.4.1.1 High-side Driver Control
          1. 7.4.1.1.1 High-side Driver PWM Generator
          2. 7.4.1.1.2 Constant Current Mode
          3. 7.4.1.1.3 OUTx HS ITRIP Behavior
          4. 7.4.1.1.4 High-side Drivers - Parallel Outputs
        2. 7.4.1.2 High-side Driver Protection Circuits
          1. 7.4.1.2.1 High-side Drivers Internal Diode
          2. 7.4.1.2.2 High-side Driver Short-circuit Protection
          3. 7.4.1.2.3 High-side Driver Overcurrent Protection
          4. 7.4.1.2.4 High-side Driver Open Load Detection
      2. 7.4.2 Half-bridge Drivers
        1. 7.4.2.1 Half-bridge Control
        2. 7.4.2.2 OUT1 and OUT2 High-side Driver Mode
        3. 7.4.2.3 Half-bridge Register Control
        4. 7.4.2.4 Half-Bridge ITRIP Regulation
        5. 7.4.2.5 Half-bridge Protection and Diagnostics
          1. 7.4.2.5.1 Half-Bridge Off-State Diagnostics (OLP)
          2. 7.4.2.5.2 Half-bridge Open Load Detection
          3. 7.4.2.5.3 Half-Bridge Overcurrent Protection
      3. 7.4.3 Gate Drivers
        1. 7.4.3.1 Input PWM Modes
          1. 7.4.3.1.1 Half-Bridge Control
          2. 7.4.3.1.2 H-Bridge Control
          3. 7.4.3.1.3 DRVOFF - Gate Driver Shutoff Pin
        2. 7.4.3.2 Smart Gate Driver - Functional Block Diagram
          1. 7.4.3.2.1  Smart Gate Driver
          2. 7.4.3.2.2  Functional Block Diagram
          3. 7.4.3.2.3  Slew Rate Control (IDRIVE)
          4. 7.4.3.2.4  Gate Driver State Machine (TDRIVE)
            1. 7.4.3.2.4.1 tDRIVE Calculation Example
          5. 7.4.3.2.5  Propagation Delay Reduction (PDR)
          6. 7.4.3.2.6  PDR Pre-Charge/Pre-Discharge Control Loop Operation Details
          7. 7.4.3.2.7  PDR Post-Charge/Post-Discharge Control Loop Operation Details
            1. 7.4.3.2.7.1 PDR Post-Charge/Post-Discharge Setup
          8. 7.4.3.2.8  Detecting Drive and Freewheel MOSFET
          9. 7.4.3.2.9  Automatic Duty Cycle Compensation (DCC)
          10. 7.4.3.2.10 Closed Loop Slew Time Control (STC)
            1. 7.4.3.2.10.1 STC Control Loop Setup
        3. 7.4.3.3 Tripler (Double-Stage) Charge Pump
        4. 7.4.3.4 Wide Common Mode Differential Current Shunt Amplifier
        5. 7.4.3.5 Gate Driver Protection Circuits
          1. 7.4.3.5.1 MOSFET VDS Overcurrent Protection (VDS_OCP)
          2. 7.4.3.5.2 Gate Driver Fault (VGS_GDF)
          3. 7.4.3.5.3 Offline Short-circuit and Open Load Detection (OOL and OSC)
      4. 7.4.4 Sense Output (IPROPI)
      5. 7.4.5 Protection Circuits
        1. 7.4.5.1 Fault Reset (CLR_FLT)
        2. 7.4.5.2 DVDD Logic Supply Power on Reset (DVDD_POR)
        3. 7.4.5.3 PVDD Supply Undervoltage Monitor (PVDD_UV)
        4. 7.4.5.4 PVDD Supply Overvoltage Monitor (PVDD_OV)
        5. 7.4.5.5 VCP Charge Pump Undervoltage Lockout (VCP_UV)
        6. 7.4.5.6 Thermal Clusters
        7. 7.4.5.7 Watchdog Timer
        8. 7.4.5.8 Fault Detection and Response Summary Table
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI)
      2. 7.5.2 SPI Format
      3. 7.5.3 Timing Diagrams
  9. 8  DRV8002-Q1 Register Map
    1. 8.1 DRV8000-Q1_STATUS Registers
    2. 8.2 DRV8000-Q1_CNFG Registers
    3. 8.3 DRV8000-Q1_CTRL Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 IDRIVE Calculation Example
        2. 9.2.2.2 tDRIVE Calculation Example
        3. 9.2.2.3 Maximum PWM Switching Frequency
        4. 9.2.2.4 Current Shunt Amplifier Configuration
    3. 9.3 Initialization Setup
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Bulk Capacitance Sizing
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Pre-Production Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C, TA
  • Functional Safety-Compliant Targeted
    • Developed for functional safety applications
    • Documentation to aid ISO26262 system design
    • Systematic integrity up to ASIL D
    • Hardware integrity up to ASIL B
  • 5V to 35V (40V abs. max) operating range
  • H-bridge or dual-channel half-bridge gate drivers
    • Smart gate drive architecture
    • Tripler charge pump for 100% PWM
    • Wide common mode current shunt amplifier
  • 1 Integrated half-bridge with IOUT max 8A (RDSON HS +LS FET = 155mΩ)
  • 1 Integrated half-bridge with IOUT max 7A (RDSON HS +LS FET = 185mΩ)
  • 2 Integrated half-bridges with IOUT max 4A (RDSON HS +LS FET = 440mΩ)
  • 2 Integrated half-bridges with IOUT max 1.3A load (RDSON HS +LS FET = 1540mΩ)
  • 1 Configurable integrated high-side driver as lamp or LED driver with IOUT Max 1.5/0.5A (RDSON = 0.4/1.2Ω)
  • 5 Configurable integrated high-side drivers for 0.5/0.25A load (RDSON = 1.2Ω)
  • Internal 10bit PWM generator for high-side drivers
  • All high-side drivers support a low- or high- current threshold constant current mode to drive a wide range of LED modules
  • Integrated driver output features current regulation (ITRIP)
  • Muxable sense output (IPROPI)
    • Internal current sensing with proportional current output (IPROPI)
    • Advanced die temperature monitoring with multiple thermal clusters
    • Motor supply voltage monitor
  • Protection and diagnostic features with configurable fault behavior
    • Load diagnostics in both the off-state and on-state to detect open load and short-circuit
    • Overcurrent and over temperature protection
  • Device Comparison Table