SLVSGV9 august   2023 DRV8213

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
    7. 7.7 Typical Operating Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 External Components
    4. 8.4 Feature Description
      1. 8.4.1 Bridge Control
      2. 8.4.2 Current Sense and Regulation (IPROPI)
        1. 8.4.2.1 Current Sensing and Current Mirror Gain Selection
        2. 8.4.2.2 Current Regulation
      3. 8.4.3 Hardware Stall Detection
      4. 8.4.4 Protection Circuits
        1. 8.4.4.1 Overcurrent Protection (OCP)
        2. 8.4.4.2 Thermal Shutdown (TSD)
        3. 8.4.4.3 VM Undervoltage Lockout (UVLO)
    5. 8.5 Device Functional Modes
      1. 8.5.1 Active Mode
      2. 8.5.2 Low-Power Sleep Mode
      3. 8.5.3 Fault Mode
    6. 8.6 Pin Diagrams
      1. 8.6.1 Logic-Level Inputs
      2. 8.6.2 Tri-Level Input
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Brushed DC Motor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Motor Voltage
          2. 9.2.1.2.2 Motor Current
        3. 9.2.1.3 Stall Detection
          1. 9.2.1.3.1 Detailed Design Procedure
            1. 9.2.1.3.1.1 Hardware Stall Detection Application Description
              1. 9.2.1.3.1.1.1 Hardware Stall Detection Timing
              2. 9.2.1.3.1.1.2 Hardware Stall Threshold Selection
            2. 9.2.1.3.1.2 Software Stall Detection Application Description
              1. 9.2.1.3.1.2.1 Software Stall Detection Timing
              2. 9.2.1.3.1.2.2 Software Stall Threshold Selection
        4. 9.2.1.4 Application Curves
        5. 9.2.1.5 Thermal Performance
          1. 9.2.1.5.1 Steady-State Thermal Performance
          2. 9.2.1.5.2 Transient Thermal Performance
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  12. 11Layout
    1. 11.1 Layout Guidelines
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

DSG: 1.65 V ≤ VVM ≤ 11 V, RTE: 0 V ≤ VVM ≤ 11 V and 1.65 V ≤ VVCC ≤ 5.5 V, –40°C ≤ TJ ≤ 150°C (unless otherwise noted).
Typical values are at TJ = 27°C, VVM = 5 V, VVCC = 3.3 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLIES, DSG (VM)
IVMQ VM sleep mode current IN1 = IN2 = 0 V, after waiting tAUTOSLEEP, VVM = 5 V, TJ = 27°C 20 60 nA
IVM VM active mode current IN1 = 3.3 V, IN2 = 0 V 1.2 1.9 mA
tWAKE Turnon time Sleep mode to active mode delay 250 μs
tAUTOSLEEP Autosleep turnoff time Active mode to autosleep mode delay 0.7 1 1.3 ms
fVCP Charge pump switching frequency 6000 kHz
POWER SUPPLIES, RTE (VM, VCC)
IVMQ VM sleep mode current IN1 = IN2 = 0 V, after waiting tAUTOSLEEP, VVM = 5 V, VVCC = 3.3 V, TJ = 27°C 10 20 nA
IVM VM active mode current IN1 = 3.3 V, IN2 = 0 V, VVM = 5 V, VVCC = 3.3 V 0.83 1 mA
IVCCQ VCC sleep mode current IN1 = IN2 = 0 V, after waiting tAUTOSLEEP, VVM = 5 V, VVCC = 3.3 V, TJ = 27°C 6 12 nA
IVCC VCC active mode current IN1 = 3.3 V, IN2 = 0 V, VVM = 5 V, VVCC = 3.3 V 0.46 0.6 mA
tWAKE Turnon time Sleep mode to active mode delay 250 μs
tAUTOSLEEP Autosleep turnoff time Active mode to autosleep mode delay 0.75 0.9 1.05 ms
LOGIC-LEVEL INPUTS (IN1, IN2)
VIL Input logic low voltage 0 0.4 V
VIH Input logic high voltage 1.45 5.5 V
VHYS Input hysteresis 40 mV
IIL Input logic low current VI = 0 V -1 1 µA
IIH Input logic high current VINx = 5 V 15 35 µA
VnSTALL = VCC 40 nA
RPD Input pulldown resistance, INx 200 kΩ
tDEGLITCH Input logic deglitch, INx 50 ns
TRI-LEVEL INPUTS (IMODE, SMODE)
VTHYS Tri-level input logic low voltage 0 0.4 V
ITIL Tri-level input Hi-Z voltage 0.75 1.05 V
ITIZ Tri-level input logic high voltage 1.45 5.5 V
RTPD Tri-level pulldown resistance to GND 83 kΩ
ITPU Tri-level pullup current to VCC 10.5 µA
OPEN-DRAIN OUTPUTS (nFAULT, nSTALL)
VOL Output logic low voltage IOD = 5 mA 0.4 V
IOZ Output logic high current VOD = VCC -1 1 µA
DRIVER OUTPUTS (OUTx)
RDS(ON)_HS High-side MOSFET on resistance IOUTx = 1 A 120 280 mΩ
RDS(ON)_LS Low-side MOSFET on resistance, 350mA to 2A GAINSEL = Low 120 260 mΩ
RDS(ON)_LS Low-side MOSFET on resistance, 60mA to 350mA GAINSEL = High-Z 460 900 mΩ
RDS(ON)_LS Low-side MOSFET on resistance, 10mA to 60mA GAINSEL = High 2100 4000 mΩ
VSD Body diode forward voltage IOUTx = -1 A 0.9 V
tRISE Output rise time VOUTx rising from 10% to 90% of VVM 70 ns
tFALL Output fall time VOUTx falling from 90% to 10% of VVM 40 ns
tPDR Input high to output high propagation delay Input to OUTx 450 ns
tPDF Input low to output low propagation delay Input to OUTx 450 ns
tDEAD Output dead time 500 ns
CURRENT SENSE AND REGULATION (IPROPI, VREF)
VREF_INT Internal reference voltage SMODE = Open for RTE package and for DSG package 470 510 550 mV
AIPROPI_H Current scaling factor GAINSEL = Low 205 µA/A
AIPROPI_M Current scaling factor GAINSEL = High-Z 1050 µA/A
AIPROPI_L Current scaling factor GAINSEL = High 4900 µA/A
AERR_H Current mirror total error, 350 mA to 2 A GAINSEL = Low, VIPROPI ≤ min(VM-1.25 V, 3.3 V), 3.3 V ≤ VVM ≤ 11 V -6 6 %
AERR_H Current mirror total error, 350 mA to 2 A GAINSEL = Low, VIPROPI ≤ min(VM-1.25 V, 3.3 V), 1.65 V ≤ VVM ≤ 3.3 V -6 6 %
AERR_M Current mirror total error, 60 mA to 350 mA GAINSEL = High-Z, VIPROPI ≤ min(VM-1.25 V, 3.3 V), 3.3 V ≤ VVM ≤ 11 V -6 6 %
GAINSEL = High-Z, VIPROPI ≤ min(VM-1.25 V, 3.3 V), 1.65 V ≤ VVM ≤ 3.3 V -6 6 %
AERR_L Current mirror total error, 10 mA to 60 mA GAINSEL = High, VIPROPI ≤ min(VM-1.25 V, 3.3 V), 3.3 V ≤ VVM ≤ 11 V -6 6 %
GAINSEL = High, VIPROPI ≤ min(VM-1.25 V, 3.3 V), 1.65 V ≤ VVM ≤ 3.3 V -6 6 %
tOFF Current regulation off time 20 µs
tBLANK Current regulation blanking time 1.8 µs
tDELAY Current sense delay time 1.5 µs
tDEG Current regulation and stall detection deglitch time 2 µs
HARDWARE STALL DETECTION (TINRUSH)
VTINRUSH_trip Threshold voltage for setting tINRUSH timing 0.97 1 1.03 V
ITINRUSH Current sourced out of the TINRUSH pin Inputs transition to a state other than IN1=IN2=0, VTINRUSH <  VTINRUSH_trip 8 10 12 µA
tdischarge TINRUSH capacitor discharge time 0.8 nF ≤ CTINRUSH ≤ 0.8 µF 100 µs
tSTALL_RETRY IN1/IN2 = 0/0 duration to recover from Stall (retry type) 350 900 µs
PROTECTION CIRCUITS
VUVLO_VM VM supply undervoltage lockout (UVLO), DSG Supply rising 1.65 V
Supply falling 1.30 V
VUVLO_VCC VCC supply undervoltage lockout (UVLO), RTE Supply rising 1.65 V
Supply falling 1.30 V
VUVLO_HYS Supply UVLO hysteresis Rising to falling threshold 150 mV
tUVLO Supply undervoltage deglitch time VVM falling (DSG) or VVCC falling (RTE) to OUTx disabled 10 µs
IOCP Overcurrent protection trip point, 350mA to 2A 4 A
IOCP Overcurrent protection trip point, 60mA to 350mA 0.8 A
IOCP Overcurrent protection trip point, 10mA to 60mA 0.16 A
tOCP Overcurrent protection deglitch time 4.2 µs
tRETRY Fault retry time 1.5 ms
TTSD Thermal shutdown temperature 165 175 185 °C
THYS Thermal shutdown hysteresis 17 °C