SLVSFV5A july   2023  – july 2023 DRV8262

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
      1. 6.4.1 Transient Thermal Impedance & Current Capability
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1  Overview
    2. 7.2  Functional Block Diagram
    3. 7.3  Feature Description
    4. 7.4  Device Operational Modes
      1. 7.4.1 Dual H-Bridge Mode (MODE1 = 0)
      2. 7.4.2 Single H-Bridge Mode (MODE1 = 1)
    5. 7.5  Current Sensing and Regulation
      1. 7.5.1 Current Sensing and Feedback
      2. 7.5.2 Current Regulation
        1. 7.5.2.1 Mixed Decay
        2. 7.5.2.2 Smart tune Dynamic Decay
      3. 7.5.3 Current Sensing with External Resistor
    6. 7.6  Charge Pump
    7. 7.7  Linear Voltage Regulator
    8. 7.8  VCC Voltage Supply
    9. 7.9  Logic Level, Tri-Level and Quad-Level Pin Diagrams
    10. 7.10 Protection Circuits
      1. 7.10.1 VM Undervoltage Lockout (UVLO)
      2. 7.10.2 VCP Undervoltage Lockout (CPUV)
      3. 7.10.3 Logic Supply Power on Reset (POR)
      4. 7.10.4 Overcurrent Protection (OCP)
      5. 7.10.5 Thermal Shutdown (OTSD)
      6. 7.10.6 nFAULT Output
      7. 7.10.7 Fault Condition Summary
    11. 7.11 Device Functional Modes
      1. 7.11.1 Sleep Mode
      2. 7.11.2 Operating Mode
      3. 7.11.3 nSLEEP Reset Pulse
      4. 7.11.4 Functional Modes Summary
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving Brushed-DC Motors
        1. 8.1.1.1 Brushed-DC Motor Driver Typical Application
        2. 8.1.1.2 Power Loss Calculations - Dual H-bridge
        3. 8.1.1.3 Power Loss Calculations - Single H-bridge
        4. 8.1.1.4 Junction Temperature Estimation
        5. 8.1.1.5 Application Performance Plots
      2. 8.1.2 Driving Stepper Motors
        1. 8.1.2.1 Stepper Driver Typical Application
        2. 8.1.2.2 Power Loss Calculations
        3. 8.1.2.3 Junction Temperature Estimation
      3. 8.1.3 Driving Thermoelectric Coolers (TEC)
  10. 9 Package Thermal Considerations
    1. 9.1 DDW Package
      1. 9.1.1 Thermal Performance
        1. 9.1.1.1 Steady-State Thermal Performance
        2. 9.1.1.2 Transient Thermal Performance
    2. 9.2 DDV Package
    3. 9.3 PCB Material Recommendation
  11. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
    2. 10.2 Power Supplies
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.1 Transient Thermal Impedance & Current Capability

Information based on thermal simulations

Table 6-1 Transient Thermal Impedance (RθJA) and Current Capability

RθJA [°C/W](1)

 Configuration

Current (A)(2)

without PWM(3)

with PWM(4)

0.1 sec

1 sec

10 sec

DC

0.1 sec

1 sec

10 sec

DC

10 sec

DC

1.8

4.7

8.4

23.3

 Dual H-Bridge (both outputs loaded with same current)

8

5.7

4.2

2.5

4

2.2
Dual H-Bridge (only one output loaded)

8

8

6

3.5

5.4

3
Single H-Bridge

16

11.3

8.4

4.9

7.9

4.4
(1) Based on thermal simulations using 114.3 mm x 76.2 mm x 1.6 mm 4 layer PCB – 2 oz Cu on top and bottom layers, 1 oz Cu on internal planes, 16 cm2 top and bottom layer copper area, with 13 x 5 thermal via array below thermal pad, 1.1 mm pitch, 0.2 mm diameter, 0.025 mm Cu plating.
(2) Current values correspond to the estimated transient current capability at 85 °C ambient temperature for junction temperature rise up to 150°C.
(3) For the current values without PWM, only conduction losses (I2R) and quiescent current loss at 48 V supply voltage are considered. The maximum switch ON resistance values at 150°C as per Electrical Characteristics table are considered to calculate conduction losses.
(4) For the current values with PWM, switching loss roughly estimated by the following equation: PSW = VVM x ILoad x fPWM x tRF, where VVM = 48 V, fPWM = 20 KHz, tRF = 110 ns