SBOS977A March   2019  – May 2021 INA302-Q1 , INA303-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Current Sensing
      2. 7.3.2 Out-of-Range Detection
      3. 7.3.3 Alert Outputs
        1. 7.3.3.1 Setting Alert Thresholds
          1. 7.3.3.1.1 Resistor-Controlled Current Limit
            1. 7.3.3.1.1.1 Resistor-Controlled Current Limit: Example
          2. 7.3.3.1.2 Voltage-Source-Controlled Current Limit
        2. 7.3.3.2 Hysteresis
    4. 7.4 Device Functional Modes
      1. 7.4.1 Alert Operating Modes
        1. 7.4.1.1 Transparent Output Mode
        2. 7.4.1.2 Latch Output Mode
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Selecting a Current-Sensing Resistor (RSENSE)
        1. 8.1.1.1 Selecting a Current-Sensing Resistor: Example
      2. 8.1.2 Input Filtering
      3. 8.1.3 Using the INA30x-Q1 With Common-Mode Transients Greater Than 36 V
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Related Links
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1)INA30x-Q1UNIT
PW (TSSOP)
14 PINS
RθJAJunction-to-ambient thermal resistance110.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance35.1°C/W
RθJBJunction-to-board thermal resistance53.2°C/W
ψJTJunction-to-top characterization parameter2.3°C/W
ψJBJunction-to-board characterization parameter52.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.