SLLS897E March   2008  – June 2015 ISO1176

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: ISODE-Pin
    6. 7.6  Supply Current
    7. 7.7  Electrical Characteristics: Driver
    8. 7.8  Electrical Characteristics: Receiver
    9. 7.9  Power Dissipation Characteristics
    10. 7.10 Switching Characteristics: Driver
    11. 7.11 Switching Characteristics: Receiver
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Insulation and Safety-Related Package Characteristics
      2. 9.3.2 DIN V VDE V 0884-10 Insulation Characteristics
      3. 9.3.3 IEC 60664-1 Ratings Table
      4. 9.3.4 Safety Limiting Values
      5. 9.3.5 Regulatory Information
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Transient Voltages
        2. 10.2.2.2 ISO1176 “Sticky Bit” Issue (Under Certain Conditions)
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Meets or Exceeds the Requirements of
    EN 50170 and TIA/EIA-485-A
  • Signaling Rates up to 40 Mbps
  • Differential Output Exceeds 2.1 V (54-Ω Load)
  • Low Bus Capacitance – 10 pF (Maximum)
  • Up to 160 Transceivers on a Bus
  • 50 kV/μs Typical Transient Immunity
  • Fail-Safe Receiver for Bus Open, Short, Idle
  • 3.3-V Inputs are 5-V Tolerant
  • Bus-Pin ESD Protection
    • 16-kV HBM Between Bus Pins and GND2
    • 6-kV HBM Between Bus Pins and GND1
  • Safety and Regulatory Approvals
    • 4000-VPK Isolation, 560-VPK VIORM per DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12 and DIN EN 61010-1
    • 2500 VRMS Isolation Rating per UL 1577
    • 4000 VPK Isolation Rating per CSA CA5A and IEC 60950-1

2 Applications

  • Profibus
  • Factory Automation
  • Networked Sensors
  • Motor and Motion Control
  • HVA and Building Automation Networks
  • Networked Security Stations

3 Description

The ISO1176 device is an isolated differential line transceiver designed for use in PROFIBUS applications. The device is ideal for long transmission lines because the ground loop is broken to provide for operation with a much larger common-mode voltage range. The symmetrical isolation barrier of each device is tested to provide 2500 VRMS of isolation per UL between the line transceiver and the logic level interface.

The galvanically isolated differential bus transceiver is an integrated circuit designed for bidirectional data communication on multipoint bus-transmission lines. The transceiver combines a galvanically isolated differential line driver and differential input line receiver. The driver has an active-high enable with isolated enable-state output on the ISODE pin (pin 10) to facilitate direction control. The driver differential outputs and the receiver differential inputs connect internally to form a differential input/output (I/O) bus port that is designed to offer minimum loading to the bus allowing up to 160 nodes.

The PV pin (pin 7) is provided as a full-chip enable option. All device outputs become high impedance when a logic low is applied to the PV pin. For more information, see the function tables in Device Functional Modes.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ISO1176 SOIC (16) 10.30 mm × 7.50 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

ISO1176 dpack_logic_lls563.gif