SLLSG36 April   2025 ISO6540-Q1 , ISO6541-Q1 , ISO6542-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Package Characteristics
    6. 5.6  Electrical Characteristics—5-V Supply
    7. 5.7  Supply Current Characteristics—5-V Supply
    8. 5.8  Electrical Characteristics—3.3-V Supply
    9. 5.9  Supply Current Characteristics—3.3-V Supply
    10. 5.10 Electrical Characteristics—2.5-V Supply 
    11. 5.11 Supply Current Characteristics—2.5-V Supply
    12. 5.12 Electrical Characteristics—1.8-V Supply
    13. 5.13 Supply Current Characteristics—1.8-V Supply
    14. 5.14 Switching Characteristics—5-V Supply
    15. 5.15 Switching Characteristics—3.3-V Supply
    16. 5.16 Switching Characteristics—2.5-V Supply
    17. 5.17 Switching Characteristics—1.8-V Supply
    18. 5.18 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
    5. 7.5 Device I/O Schematics
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Functional Modes

Table 7-2 lists the functional modes for the ISO654x-Q1 devices.

Table 7-2 Function Table
VCCI(1)VCCOINPUT
(INx)
OUTPUT ENABLE
(ENx)
OUTPUT
(OUTx)
COMMENTS
PUPUHH or openHNormal Operation: A channel output assumes the logic state of the input.
LH or openL
OpenH or openDefaultDefault mode: When INx is open, the corresponding channel output goes to the default logic state. Default is High for ISO654x-Q1 and Low for ISO654xF-Q1 (with F suffix).
XPUXLZA low value of output enable causes the outputs to be high-impedance.
PDPUXH or openDefaultDefault mode: When VCCI is unpowered, a channel output assumes the logic state based on the selected default option. Default is High for ISO654x-Q1 and Low for ISO654xF-Q1 (with F suffix).
When VCCI transitions from unpowered to powered-up, a channel output assumes the logic state of the input.
When VCCI transitions from powered-up to unpowered, channel output assumes the selected default state.
XPDXXUndeterminedWhen VCCO is unpowered, a channel output is undetermined(2). When VCCO transitions from unpowered to powered-up, a channel output assumes the logic state of the input.
VCCI = Input-side VCC; VCCO = Output-side VCC; PU = Powered up (VCC ≥ VCC_RO(MIN)); PD = Powered down (VCC ≤ VCC_UVLO–); X = Irrelevant; H = High level; L = Low level; Z = High Impedance
The outputs are in undetermined state when VCC_UVLO– ≤ VCCI or VCCO < VCC ≥ VCC_RO(MIN).