SLLSG36 April   2025 ISO6540-Q1 , ISO6541-Q1 , ISO6542-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Package Characteristics
    6. 5.6  Electrical Characteristics—5-V Supply
    7. 5.7  Supply Current Characteristics—5-V Supply
    8. 5.8  Electrical Characteristics—3.3-V Supply
    9. 5.9  Supply Current Characteristics—3.3-V Supply
    10. 5.10 Electrical Characteristics—2.5-V Supply 
    11. 5.11 Supply Current Characteristics—2.5-V Supply
    12. 5.12 Electrical Characteristics—1.8-V Supply
    13. 5.13 Supply Current Characteristics—1.8-V Supply
    14. 5.14 Switching Characteristics—5-V Supply
    15. 5.15 Switching Characteristics—3.3-V Supply
    16. 5.16 Switching Characteristics—2.5-V Supply
    17. 5.17 Switching Characteristics—1.8-V Supply
    18. 5.18 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
    5. 7.5 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) ISO654x UNIT
DBQ (SSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 73 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36.1 °C/W
RθJB Junction-to-board thermal resistance 40.4 °C/W
ψJT Junction-to-top characterization parameter 17 °C/W
ψJB Junction-to-board characterization parameter 39.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the no.