SLLSEP8C July   2015  – July 2025 ISO7831

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Rating
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3V Supply
    12. 5.12 Supply Current Characteristics—3.3V Supply
    13. 5.13 Electrical Characteristics—2.5V Supply
    14. 5.14 Supply Current Characteristics—2.5V Supply
    15. 5.15 Switching Characteristics—5V Supply
    16. 5.16 Switching Characteristics—3.3V Supply
    17. 5.17 Switching Characteristics—2.5V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
        1. 9.1.1.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision B (April 2016) to Revision C (July 2025)

  • Added 15mm(typ) creepage/clearance to Insulation Specifications tableGo

Changes from Revision A (September 2015) to Revision B (April 2016)

  • Changed Section 1 From: Low Power Consumption, Typical 2.5mA per Channel at 1Mbps To: Low Power Consumption, Typical 1.7 mA per Channel at 1Mbps Go
  • Changed the isolation barrier life from > 25 years to > 40 years in the Section 1 sectionGo
  • Changed Section 1 From: Safety and Regulatory Approvals To: Safety-Related Certifications Go
  • Updated the status of the certifications throughout the document Go
  • Added the extra-wide body package (16 pin SOIC [DWW]) optionGo
  • Changed the values for the DW package in the Thermal Information table Go
  • Changed CIO Specification From: 2pF To: ≅1 pF Go
  • Added the climatic category parameter to the Insulation Characteristics table Go
  • Moved Section 5.7 to the Section 5 sectionGo
  • Moved Section 5.8 to the Section 5 sectionGo
  • Changed the test conditions and values for the DW package in the Safety Limiting Values tableGo
  • Changed VCCO to VCCI in the minimum value for the input threshold voltage hysteresis parameter in the electrical characteristics tablesGo
  • Added the VCM test condition to the CMTI parameter in the electrical characteristics tables. Also updated the minimum value from 70 to 100 and deleted the maximum value of 100Go
  • Changed tfs To: tDO in Section 5.15 Go
  • Changed tfs To: tDO in Section 5.16 Go
  • Changed tfs To: tDO in Section 5.17 Go
  • Added the lifetime projection graphs for DW and DWW packages to the Insulation Characteristics Curves section Go
  • Changed the thermal derating curves in the Safety Limiting Values sectionGo
  • Changed 2.7V To: 1.7V, fs high To: default high, and fs low To: default low in Figure 6-3 Go

Changes from Revision * (July 2015) to Revision A (September 2015)

  • Changed From: 1-page Product Preview To: Production data sheetGo