10 Revision History
Changes from Revision B (April 2016) to Revision C (July 2025)
- Added 15mm(typ) creepage/clearance to Insulation Specifications
tableGo
Changes from Revision A (September 2015) to Revision B (April 2016)
- Changed
Section 1
From: Low Power Consumption, Typical 2.5mA per
Channel at 1Mbps To: Low Power Consumption,
Typical 1.7 mA per Channel at 1Mbps Go
- Changed the isolation barrier life from > 25 years to > 40 years in the
Section 1
sectionGo
- Changed
Section 1
From: Safety and Regulatory Approvals To: Safety-Related Certifications Go
- Updated the status of the certifications throughout the document Go
- Added the extra-wide body package (16 pin SOIC [DWW]) optionGo
- Changed the values for the DW package in the Thermal Information table Go
- Changed CIO Specification From: 2pF To: ≅1 pF Go
- Added the climatic category parameter to the Insulation Characteristics table Go
- Moved
Section 5.7
to the
Section 5
sectionGo
- Moved
Section 5.8
to the
Section 5
sectionGo
- Changed the test conditions and values for the DW package in the Safety Limiting Values tableGo
- Changed VCCO to VCCI in the minimum value for the input threshold voltage hysteresis parameter in the electrical characteristics tablesGo
- Added the VCM test condition to the CMTI parameter in the electrical characteristics tables. Also updated the minimum value from 70 to 100 and deleted the maximum value of 100Go
- Changed tfs To: tDO in
Section 5.15
Go
- Changed tfs To: tDO in
Section 5.16
Go
- Changed tfs To: tDO in
Section 5.17
Go
- Added the lifetime projection graphs for DW and DWW packages to the Insulation
Characteristics Curves section Go
- Changed the thermal derating curves in the Safety Limiting Values sectionGo
- Changed 2.7V To: 1.7V, fs high To: default high, and fs low To: default low in Figure 6-3
Go
Changes from Revision * (July 2015) to Revision A (September 2015)
- Changed From: 1-page Product Preview To: Production data sheetGo