SLLSFC5C November   2021  – January 2023 ISOUSB211

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Supply Options
      2. 8.3.2  Power Up
      3. 8.3.3  Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 8.3.4  Connect and Speed Detection
      5. 8.3.5  Disconnect Detection
      6. 8.3.6  Reset
      7. 8.3.7  LS/FS Message Traffic
      8. 8.3.8  HS Message Traffic
      9. 8.3.9  Equalization and Pre-emphasis
      10. 8.3.10 L2 Power Management State (Suspend) and Resume
      11. 8.3.11 L1 Power Management State (Sleep) and Resume
      12. 8.3.12 HS Test Mode Support
      13. 8.3.13 CDP Advertising
    4. 8.4 Device Functional Modes
  10. 9 Power Supply Recommendations
  11. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Isolated Host or Hub
      2. 10.1.2 Isolated Peripheral - Self-Powered
      3. 10.1.3 Isolated Peripheral - Bus-Powered
      4. 10.1.4 Application Curve
        1. 10.1.4.1 Insulation Lifetime
    2. 10.2 Meeting USB2.0 HS Eye-Diagram Specifications
    3. 10.3 Thermal Considerations
      1. 10.3.1 VBUS / V3P3V Power
      2. 10.3.2 VCCx / V1P8Vx Power
      3. 10.3.3 Example Configuration 1
      4. 10.3.4 Example Configuration 2
      5. 10.3.5 Example Configuration 3
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Example
      2. 11.1.2 PCB Material
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DP|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Compliant to USB 2.0
  • Supports low speed (1.5 Mbps), full speed (12 Mbps) and high speed (480 Mbps) signaling
  • Does not need external crystal or clock input
  • Automatic speed and connection detection
  • Supports L1 (sleep) and L2 (suspend) low-power states
  • Programmable equalization to compensate board trace loss in high speed mode
  • CDP advertising on downstream side
  • Supply OK indication on opposite side
  • Supports automatic role reversal for USB On-The-Go (OTG) and Type-C® Dual Role Port (DRP) designs
  • High CMTI: 100 kV/µs
  • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
  • VBUS voltage range: 4.25 V to 5.5 V
    • 3.3 V and 1.8 V internal LDOs
  • Meets CISPR32 class B emissions limits
  • Ambient temperature range: –40°C to +125°C
  • Small footprint 28-SSOP package
  • Safety-related certifications:
    • 7071-VPK VIOTM and 2121-VPK VIORM (Reinforced) per DIN EN IEC 60747-17 (VDE 0884-17)
    • 5000-VRMS isolation for 1 minute per UL 1577
    • IEC 62368-1, IEC 60601-1 and IEC 61010-1 certifications
    • CQC, TUV and CSA certifications